US2015300695A1PendingUtilityA1
Heat conversion member and heat conversion laminate
Est. expiryOct 26, 2032(~6.3 yrs left)· nominal 20-yr term from priority
H10F 77/12F24J 2/481F24J 2/485F24J 2/484F24S 70/225Y02E10/40F24S 70/16F24S 70/12
56
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Claims
Abstract
The present invention addresses the problem of providing a heat conversion member capable of efficiently converting light to heat. This heat conversion member is characterized in that it includes a composite material of at least one type of semiconductor and at least one type of metal material.
Claims
exact text as granted — not AI-modified1 - 8 . (canceled)
9 . A light-to-heat conversion member comprising a composite material of one or more kinds of semiconductor and one or more kinds of metal material.
10 . The light-to-heat conversion member according to claim 9 , wherein the metal material is in the form of particles.
11 . The light-to-heat conversion member according to claim 9 , wherein the semiconductor comprises FeSiX (X=0.5-4).
12 . The light-to-heat conversion member according to claim 11 , wherein X in FeSiX is 2.
13 . The light-to-heat conversion member according to claim 9 , which has a film shape.
14 . The light-to-heat conversion member according to claim 13 , wherein the film shape has a thickness of 1 nm to 10 μm.
15 . A light-to-heat conversion laminate having laminated at least one or more layers including the light-to-heat conversion member according to claim 13 , and a metal layer.
16 . A light-to-heat conversion laminate having laminated at least a metal layer, one or more layers including the light-to-heat conversion member according to claim 13 , and a transparent dielectric layer, in that order.Join the waitlist — get patent alerts
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