Inventor · disambiguated record
Seiichi Suda
Also filed as: SUDA SEIICHI
5 granted patents·5 pending applications·33 citations·filing 2005–2013
75Inventor score
Top patents by PatentIndex Score
10 records- 0186US8658328B2Stack structure for laminated solid oxide fuel cell, laminated solid oxide fuel cell and manufacturing methodSUDA SEIICHI·Filed 2009·Granted Feb 25, 2014·27 cites·15 claims
- 0277US9546801B2Solar-thermal conversion member, solar-thermal conversion device, and solar thermal power generation device comprising a β-FeSi2 phase materialSATO AKINORI·Filed 2012·Granted Jan 17, 2017·2 cites·23 claims
- 0371US7614293B2Method of evaluating adhesion property, low-adhesion material, and mold for molding resinTOWA CORP·Filed 2005·Granted Nov 10, 2009·2 cites·1 claims
- 0469US7784764B2Low-adhesion material, mold for molding resin using the same and contaminant adhesion preventing materialTOWA CORP·Filed 2005·Granted Aug 31, 2010·2 cites·11 claims
- 0560US2010012816A1Method of evaluating adhesion property, low-adhesion material, and mold for molding resinKUNO TAKAKI·Filed 2009·Application pending·0 cites
- 0656US2015300695A1Heat conversion member and heat conversion laminateTOYOTA JIDOSHOKKI KK·Filed 2013·Application pending·0 cites
- 0754US2012076886A1Method of evaluating adhesion property, low-adhesion material, and mold for molding resinKUNO TAKAKI·Filed 2011·Application pending·0 cites
- 0852US2011042857A1Method of evaluating adhesion property, low-adhesion material, and mold for molding resinKUNO TAKAKI·Filed 2010·Application pending·0 cites
- 0951US9970684B2Optical selective filmTOYOTA JIDOSHOKKI KK·Filed 2013·Granted May 15, 2018·0 cites·8 claims
- 1042US2008296532A1Low Adhesion Material, Resin Molding Die, and Soil Resistant MaterialKUNO TAKAKI·Filed 2006·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →