System, method and computer program product for classification within inspection images

Abstract

An analysis system capable of classifying possible defects identified within an inspection image of an inspected object includes a storage device and a processor. The processor matches a template and a portion of the inspection image, thus giving rise to a matching portion of the inspection image. The inspection image is captured by an inspection tool. The processor associates, using a mask corresponding to the template and defining one or more segments within the matching portion of the inspection image, a potential defect with a segment defined by the mask and corresponding to a location of the potential defect, and classifies the potential defect in accordance with the segment defined by the mask within the matching portion of the inspection image and associated with the potential defect.

What is claimed is: 
     
         1 . An analysis system capable of classifying possible defects identified within an inspection image of an inspected object, the system comprising:
 a storage device; and   a processor, coupled to the storage device, to:
 match a template and a portion of the inspection image, thus giving rise to a matching portion of the inspection image, wherein the inspection image is captured by an inspection tool; 
 associate, using a mask corresponding to the template and defining one or more segments within the matching portion of the inspection image, a potential defect with a segment defined by the mask and corresponding to a location of the potential defect; and 
 classify the potential defect in accordance with the segment defined by the mask within the matching portion of the inspection image and associated with the potential defect. 
   
     
     
         2 . The system of  claim 1 , wherein the inspected object is selected from a group consisting of an electronic circuit, a wafer, and a photomask. 
     
     
         3 . The system of  claim 1 , wherein the processor is further to determine the location of the potential defect with respect to the one or more segments at an accuracy which exceeds the resolution of the inspection image. 
     
     
         4 . The system of  claim 1 , wherein the mask is configured to define the one or more segments such that parts of the inspected object having different physical characteristics correspond, respectively, to different segments. 
     
     
         5 . The system of  claim 1 , wherein the mask is configured to define the one or more segments such that defects associated with different segments have different implications on an operability of the inspected object. 
     
     
         6 . A computerized method of classifying a potential defect identified within an inspection image of an inspected object, the method comprising:
 matching, by a processor, a template and a portion of the inspection image, thereby determining a matching portion of the inspection image, wherein the inspection image is captured by an inspection tool;   using a mask corresponding to the template and defining one or more segments within the matching portion of the inspection image for associating, by the processor, the potential defect with a segment defined by the mask and corresponding to a location of the potential defect; and   classifying, by the processor, the potential defect in accordance with the segment defined by the mask within the matching portion of the inspection image and associated with the potential defect.   
     
     
         7 . The method of  claim 6 , wherein the inspected object is selected from a group consisting of an electronic circuit, a wafer, and a photomask. 
     
     
         8 . The method of  claim 6 , wherein the location of the potential defect with respect to the one or more segments is determined at an accuracy which exceeds the resolution of the inspection image. 
     
     
         9 . The method of  claim 6 , wherein the mask is configured to define the one or more segments such that defects associated with different segments have different implications on an operability of the inspected object. 
     
     
         10 . The method of  claim 6 , wherein the mask is configured to define the one or more segments such that parts of the inspected object having different physical characteristics correspond, respectively, to different segments. 
     
     
         11 . A computer program product implemented on a non-transitory computer usable medium having computer readable program code embodied therein to cause a processor to perform a method of classifying a potential defect identified within an inspection image of an inspected object, the method comprising:
 matching, by the processor, a template and a portion of the inspection image, thereby determining a matching portion of the inspection image, wherein the inspection image is captured by an inspection tool;   using a mask corresponding to the template and defining one or more segments within the matching portion of the inspection image for associating the potential defect with a segment defined by the mask and corresponding to a location of the potential defect; and   classifying the potential defect in accordance with the segment defined by the mask within the matching portion of the inspection image and associated with the potential defect.   
     
     
         12 . The computer program product of  claim 11 , wherein the inspected object is selected from a group consisting of an electronic circuit, a wafer, and a photomask. 
     
     
         13 . The computer program product of  claim 11 , wherein the location of the potential defect with respect to the one or more segments is determined at an accuracy which exceeds the resolution of the inspection image. 
     
     
         14 . The computer program product of  claim 11 , wherein the mask is configured to define the one or more segments such that parts of the inspected object having different physical characteristics correspond, respectively, to different segments. 
     
     
         15 . The computer program product of  claim 11 , wherein the mask is configured to define the one or more segments such that defects associated with different segments have different implications on an operability of the inspected object.