Apparatus and method for stripping solder metals during the recycling of waste electrical and electronic equipment

Abstract

Apparatuses and processes for recycling printed wire boards, wherein electronic components, precious metals and base metals may be collected for reuse and recycling. The apparatuses generally include a mechanical solder removal module and/or a thermal module, a chemical solder removal module, and a precious metal leaching module, wherein the modules are attached for continuous passage of the e-waste from module to module.

1 .- 33 . (canceled) 
     
     
         34 . A process for removing solder from a surface of at least one printed wire board (PWB) and/or at least one casing, said method comprising:
 inserting the PWB(s) and/or casing(s) into a drum;   contacting the surface of the PWB(s) and/or casing(s) with a first composition to effect chemical removal of solder from the PWB(s) and/or casing(s);   rinsing the PWB(s) and/or casing(s) in a rinsing module; and   drying the PWB(s) and/or casing(s) in a drying module.   
     
     
         35 . The process of  claim 34 , wherein the drum is perforated. 
     
     
         36 . The process of  claim 34 , wherein the PWB(s) have at least one component attached to the surface by solder. 
     
     
         37 . The process of  claim 36 , wherein at least one component is removed from the PWB(s). 
     
     
         38 . The process of  claim 34 , wherein the PWB(s) and/or casing(s) are immersed in the first composition. 
     
     
         39 . The process of  claim 34 , wherein the drum is agitated such that the first composition flows past the surface of the PWB(s) and/or casing(s). 
     
     
         40 . The process of  claim 34 , wherein the PWB(s) and/or casing(s) move automatically or manually from the first composition to the rinsing module to the drying module. 
     
     
         41 . The process of  claim 34 , wherein the PWB(s) and/or casing(s) are rinsed with a rinsing composition. 
     
     
         42 . The process of  claim 41 , wherein the rinsing is effectuated by spraying the rinsing composition on the PWB(s) and/or casing(s), dipping the PWB(s) and/or casing(s) in a volume of the rinsing composition, contacting the PWB(s) and/or casing(s) with a pad or fibrous sorbent applicator element having the rinsing composition absorbed thereon, or contacting the PWB(s) and/or casing(s) with the rinsing composition that is recirculating. 
     
     
         43 . The process of  claim 41 , wherein the rinsing composition comprises water. 
     
     
         44 . The process of  claim 34 , wherein the PWB(s) and/or casing(s) are dried using nitrogen gas, isopropanol, regenerative air, hot air, or spin process technology. 
     
     
         45 . The process of  claim 34 , wherein the first composition selectively removes lead and/or tin-containing solder from the PWB(s) and/or casing(s) relative to precious metals, tantalum-containing metals, and/or base metals that are simultaneously present on said PWB(s) and/or casing(s). 
     
     
         46 . The process of  claim 34 , wherein the first composition comprises at least one oxidizing agent. 
     
     
         47 . The process of  claim 34 , wherein the first composition comprises nitric acid. 
     
     
         48 . The process of  claim 34 , wherein the first composition comprises at least one oxidizing agent and optionally at least one lead and/or tin complexing agent, at least one organic solvent, at least one passivating agent, or at least one solvent. 
     
     
         49 . The process of  claim 34 , further comprising heating the PWB(s) and/or casing(s) in a heating module prior to contacting with the first composition. 
     
     
         50 . The process of  claim 49 , wherein the heating module softens the solder. 
     
     
         51 . The process of  49 , wherein the heating module comprises means for moving the PWB(s) through a heating mechanism and agitation means for removing the casing(s) and/or at least one component from the PWB(s) once the solder is softened. 
     
     
         52 . The process of  claim 34 , further comprising removing at least one precious metal from the surface of the printed wire board (PWB). 
     
     
         53 . An apparatus for removing solder from a surface of at least one printed wire board (PWB) and/or at least one casing, said apparatus comprising:
 a chemical solder remover comprising a drum;   a rinsing module; and   a drying module.