US2015349145A1PendingUtilityA1

Shingled solar cell module

Assignee: COGENRA SOLAR INCPriority: May 27, 2014Filed: Dec 10, 2014Published: Dec 3, 2015
Est. expiryMay 27, 2034(~7.9 yrs left)· nominal 20-yr term from priority
H10F 77/937H10F 77/935H10F 77/215H10F 77/211H10F 77/50H10F 71/137H10F 71/121H10F 71/00H10F 19/908H10F 19/904H10F 19/902H10F 19/807H10F 19/804H10F 19/85H10F 19/80H10F 19/75H10F 19/70H10F 19/40H10F 19/00H10F 10/14H10F 19/90H01L 31/0201H01L 31/028H02S 40/36H02S 30/00Y02B10/10H02S 40/30H02S 50/10H02S 40/34H02S 20/25Y02E10/50Y02E10/547H02S 30/10H02S 50/00H02S 40/32
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Claims

Abstract

A high efficiency configuration for a solar cell module comprises solar cells arranged in a shingled manner to form super cells, which may be arranged to efficiently use the area of the solar module, reduce series resistance, and increase module efficiency.

Claims

exact text as granted — not AI-modified
What is claimed is: 
     
         1 . A method comprising:
 laser scribing a scribe line on a silicon wafer to define a solar cell region;   applying an electrically conductive adhesive bonding material to a top surface of the scribed silicon wafer adjacent to a long side of the solar cell region; and   separating the silicon wafer along the scribe line to provide a solar cell strip comprising a portion of the electrically conductive adhesive bonding material disposed adjacent to a long side of the solar cell strip.   
     
     
         2 . A method as in  claim 1  further comprising providing the silicon wafer with a metallization pattern, such that the separating produces the solar cell strip having the metallization pattern along the long side. 
     
     
         3 . A method as in  claim 2  wherein the metallization pattern comprises a bus bar or a discrete contact pad. 
     
     
         4 . A method as in  claim 2  wherein the providing comprises printing the metallization pattern. 
     
     
         5 . A method as in  claim 2  wherein the providing comprises electroplating the metallization pattern. 
     
     
         6 . A method as in  claim 2  wherein the metallization pattern comprises a feature configured to confine spreading of the electrically conductive adhesive bonding material. 
     
     
         7 . An apparatus as in  claim 6  wherein the feature comprises a moat. 
     
     
         8 . A method as in  claim 1  wherein the applying comprises printing. 
     
     
         9 . A method as in  claim 1  wherein the applying comprises depositing using a mask. 
     
     
         10 . A method as in  claim 1  wherein a length of the long side of the solar cell strip reproduces a shape of the wafer. 
     
     
         11 . A method as in  claim 10  wherein the length is 156 mm or 125 mm. 
     
     
         12 . A method as in  claim 10  wherein an aspect ratio between a width of the solar cell strip and the length is between about 1:2 to about 1:20. 
     
     
         13 . A method as in  claim 1  wherein the separating comprises:
 applying a vacuum between a bottom surface of the wafer and a curved supporting surface to flex the solar cell region against the curved supporting surface and thereby cleave the silicon wafer along the scribe line. 
 
     
     
         14 . A method as in  claim 1  further comprising:
 arranging a plurality of solar cell strips in line with long sides of adjacent solar cell strips overlapping and a portion of the electrically conductive adhesive bonding material disposed in between; and 
 curing the electrically conductive bonding material, thereby bonding adjacent overlapping solar cell strips to each other and electrically connecting them in series. 
 
     
     
         15 . A method as in  claim 14  wherein the curing comprises the application of heat. 
     
     
         16 . A method as in  claim 14  wherein the curing comprises the application of pressure. 
     
     
         17 . A method as in  claim 14  wherein the arranging comprises forming a layered structure. 
     
     
         18 . A method as in  claim 17  wherein the curing comprises the application of heat and pressure to the layered structure. 
     
     
         19 . A method as in  claim 17  wherein the layered structure comprises an encapsulant. 
     
     
         20 . A method as in  claim 19  wherein the encapsulant comprises a thermoplastic polymer. 
     
     
         21 . A method as in  claim 20  wherein the thermoplastic polymer comprises a thermoplastic olefin polymer. 
     
     
         22 . A method as in  claim 17  wherein the layered structure comprises a backing sheet. 
     
     
         23 . A method as in  claim 22  wherein:
 the backing sheet is white; and 
 the layered structure further comprises darkened stripes. 
 
     
     
         24 . A method as in  claim 14  wherein the arranging comprises arranging at least nineteen solar cell strips in line. 
     
     
         25 . A method as in  claim 24  wherein each of the at least nineteen solar cell strips has a breakdown voltage of at least 10V. 
     
     
         26 . A method as in  claim 24  further comprising placing the at least nineteen solar cell strips in communication with only a single bypass diode. 
     
     
         27 . A method as in  claim 26  further comprising forming a ribbon conductor between one of the at least nineteen solar cell strips and the single bypass diode. 
     
     
         28 . A method as in  claim 27  wherein the single bypass diode is located in a junction box 
     
     
         29 . A method as in  claim 28  wherein the junction box is on a back side of a solar module, in mating arrangement with another junction box of a different solar module. 
     
     
         30 . A method as in  claim 14  wherein an overlapping cell strip of the plurality of solar cell strips, overlaps the solar cell strip by between about 1-5 mm. 
     
     
         31 . A method as in  claim 14  wherein the solar cell strip includes a first chamfered corner. 
     
     
         32 . A method as in  claim 31  wherein a long side of an overlapping solar cell strip of the plurality of solar cell strips, does not include a second chamfered corner. 
     
     
         33 . A method as in  claim 32  wherein a width of the solar cell strip is greater than a width of the overlapping solar cell strip, such that the solar cell strip and the overlapping solar cell strip have approximately a same area. 
     
     
         34 . A method as in  claim 31  wherein a long side of an overlapping solar cell strip of the plurality of solar cell strips, includes a second chamfered corner. 
     
     
         35 . A method as in  claim 34  wherein the long side of the overlapping solar cell strip of the plurality of solar cell strips, overlaps the long side of the cell strip including the first chamfered corner. 
     
     
         36 . A method as in  claim 34  wherein the long side of the overlapping solar cell strip of the plurality of solar cell strips, overlaps a long side of the cell strip not including the first chamfered corner. 
     
     
         37 . A method as in  claim 14  further comprising connecting the plurality of solar cell strips with another plurality of solar cell strips utilizing an interconnect. 
     
     
         38 . A method as in  claim 37  wherein a portion of the interconnect is covered by a dark film. 
     
     
         39 . A method as in  claim 37  wherein a portion of the interconnect is colored. 
     
     
         40 . A method as in  claim 37  wherein the plurality of solar cell strips is connected in series with the other plurality of solar cell strips.

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