Shingled solar cell module

Abstract

A high efficiency configuration for a solar cell module comprises solar cells arranged in a shingled manner to form super cells, which may be arranged to efficiently use the area of the solar module, reduce series resistance, and increase module efficiency.

What is claimed is: 
     
         1 . A method comprising:
 scribing a first scribe line on a wafer; and   separating the wafer along the first scribe line utilizing a vacuum to provide a solar cell strip.   
     
     
         2 . A method as in  claim 1  wherein the scribing comprises laser scribing. 
     
     
         3 . A method as in  claim 2  wherein the separating comprises applying the vacuum between a surface of the wafer and a curved surface. 
     
     
         4 . A method as in  claim 3  wherein the curved surface comprises a vacuum manifold. 
     
     
         5 . A method as in  claim 4  wherein the wafer is supported on a belt moving to the vacuum manifold, and the vacuum is applied through the belt. 
     
     
         6 . A method as in  claim 5  wherein the separating comprises:
 orienting the first scribe line at an angle relative to the vacuum manifold; and 
 beginning a cleaving at one end of the first scribe line. 
 
     
     
         7 . A method as in  claim 6  wherein the angle is substantially perpendicular. 
     
     
         8 . A method as in  claim 6  wherein the angle is other than substantially perpendicular. 
     
     
         9 . A method as in  claim 3  further comprising applying an uncured electrically conductive adhesive bonding material. 
     
     
         10 . A method as in  claim 9  wherein the first scribe line and the uncured electrically conductive adhesive bonding material are on a same surface of the wafer. 
     
     
         11 . A method as in  claim 10  wherein the laser scribing avoids curing the uncured conductive adhesive bonding material by selecting a laser power and/or a distance between the first scribe line and the uncured conductive adhesive bonding material. 
     
     
         12 . A method as in  claim 10  wherein the same surface is opposite a wafer surface supported by a belt moving the wafer to the curved surface. 
     
     
         13 . A method as in  claim 12  wherein the curved surface comprises a vacuum manifold. 
     
     
         14 . A method as in  claim 9  wherein the applying occurs after the scribing. 
     
     
         15 . A method as in  claim 9  wherein the applying occurs after the separating. 
     
     
         16 . A method as in  claim 9  wherein the applying comprises screen printing. 
     
     
         17 . A method as in  claim 9  wherein the applying comprises ink jet printing. 
     
     
         18 . A method as in  claim 9  wherein the applying comprises depositing using a mask. 
     
     
         19 . A method as in  claim 3  wherein the first scribe line is between,
 a first metallization pattern on a surface of the wafer along a first outside edge, and 
 a second metallization pattern on the surface of the wafer along a second outside edge. 
 
     
     
         20 . A method as in  claim 19  wherein the wafer further comprises a third metallization pattern on the surface of the semiconductor wafer not proximate to the first outside edge or to the second outside edge, and the method further comprises:
 scribing a second scribe line between the third metallization pattern and the second metallization pattern, such that the first scribe line is between the first metallization pattern and the third metallization pattern; and 
 separating the wafer along the second scribe line to provide another solar cell strip. 
 
     
     
         21 . A method as in  claim 20  wherein a distance between the first scribe line and the second scribe line forms a width defining an aspect ratio of between about 1:2 and about 1:20 with a length of the wafer comprising about 125 mm or about 156 mm. 
     
     
         22 . A method as in  claim 19  wherein the first metallization pattern comprises a finger pointing toward the second metallization pattern. 
     
     
         23 . A method as in  claim 22  wherein the first metallization pattern further comprises a bus bar intersecting the finger. 
     
     
         24 . A method as in  claim 23  wherein the bus bar is within 5 mm of the first outside edge. 
     
     
         25 . A method as in  claim 22  further comprising uncured electrically conductive adhesive bonding material in contact with the finger. 
     
     
         26 . A method as in  claim 19  wherein the first metallization pattern comprises a discrete contact pad. 
     
     
         27 . A method as in  claim 19  further comprising printing or electroplating the first metallization pattern on the wafer. 
     
     
         28 . A method as in  claim 3  further comprising:
 arranging the solar cell strip in a first super cell comprising at least nineteen solar cell strips each having a breakdown voltage of at least 10V, with long sides of adjacent solar cell strips overlapping the electrically conductive adhesive bonding material disposed in between; and 
 curing the electrically conductive bonding material to bond adjacent overlapping solar cell strips electrically connected in series. 
 
     
     
         29 . A method as in  claim 28  wherein the arranging comprises forming a layered structure including an encapsulant, the method further comprising laminating the layered structure. 
     
     
         30 . A method as in  claim 29  wherein the curing occurs at least partially during the laminating 
     
     
         31 . A method as in  claim 29  wherein the curing occurs distinct from the laminating. 
     
     
         32 . A method as in  claim 29  wherein the encapsulant comprises a thermoplastic olefin polymer. 
     
     
         33 . A method as in  claim 29  wherein the layered structure comprises:
 a white backing sheet; and 
 darkened stripes on the white backing sheet. 
 
     
     
         34 . A method as in  claim 28  wherein the arranging comprises confining a spreading of the electrically conductive adhesive bonding material using a metallization pattern feature. 
     
     
         35 . A method as in  claim 34  wherein metallization pattern feature is on a front surface of the solar cell strip. 
     
     
         36 . A method as in  claim 34  wherein metallization pattern feature is on a back surface of the solar cell strip. 
     
     
         37 . A method as in  claim 28  further comprising applying the electrically conductive adhesive bonding material between the first super cell and an interconnect connecting a second super cell in series. 
     
     
         38 . A method as in  claim 28  further comprising forming a ribbon conductor between a single bypass diode of the first super cell, the single bypass diode located in a first junction box of a first solar module in mating arrangement with a second junction box of a second solar module. 
     
     
         39 . A method as in  claim 28  wherein:
 the solar cell strip includes a first chamfered corner; 
 a long side of an overlapping solar cell strip of the plurality of solar cell strips, does not include a second chamfered corner; and 
 a width of the solar cell strip is greater than a width of the overlapping solar cell strip, such that the solar cell strip and the overlapping solar cell strip have approximately a same area. 
 
     
     
         40 . A method as in  claim 28  wherein:
 the solar cell strip includes a first chamfered corner; 
 a long side of an overlapping solar cell strip of the plurality of solar cell strips, includes a second chamfered corner; and 
 the long side of the overlapping solar cell strip of the plurality of solar cell strips, overlaps a long side of the solar cell strip not including the first chamfered corner.