Shingled solar cell module

Abstract

A high efficiency configuration for a solar cell module comprises solar cells arranged in a shingled manner to form super cells, which may be arranged to efficiently use the area of the solar module, reduce series resistance, and increase module efficiency.

What is claimed is: 
     
         1 . An apparatus comprising:
 a solar module comprising a front surface including a first series connected string of at least nineteen solar cells each having a breakdown voltage greater than about 10V, and grouped into a super cell comprising a first silicon solar cell arranged with an end overlapping and conductively bonded with an adhesive to a second silicon solar cell; and   an interconnect conductively bonded to a solar cell surface.   
     
     
         2 . An apparatus as in  claim 1  wherein the solar cell surface comprises a back of the first silicon solar cell. 
     
     
         3 . An apparatus as in  claim 2  further comprising a ribbon conductor electrically connecting the super cell to an electrical component. 
     
     
         4 . An apparatus as in  claim 3  wherein the ribbon conductor is conductively bonded to the solar cell surface away from the overlapping end. 
     
     
         5 . An apparatus as in  claim 4  wherein the electrical component is on a solar module rear surface. 
     
     
         6 . An apparatus as in  claim 4  wherein the electrical component comprises a junction box. 
     
     
         7 . An apparatus as in  claim 6  wherein the junction box is in mating engagement with another junction box on a different module overlapped by the module. 
     
     
         8 . An apparatus as in  claim 4  wherein the electrical component comprises a bypass diode. 
     
     
         9 . An apparatus as in  claim 4  wherein the electrical component comprises a module terminal. 
     
     
         10 . An apparatus as in  claim 4  wherein the electrical component comprises an inverter. 
     
     
         11 . An apparatus as in  claim 10  wherein the inverter comprises a DC/AC micro-inverter. 
     
     
         12 . An apparatus as in  claim 11  wherein the DC/AC micro-inverter is on a solar module rear surface. 
     
     
         13 . An apparatus as in  claim 4  wherein the electrical component comprises a power management device. 
     
     
         14 . An apparatus as in  claim 13  wherein the power management device comprises a switch. 
     
     
         15 . An apparatus as in  claim 14  further comprising a voltage sensing controller in communication with the switch. 
     
     
         16 . An apparatus as in  claim 13  wherein the power management device is configured to,
 receive a voltage output of the super cell; 
 based upon the voltage, determine if a solar cell of the super cell is in reverse bias; and 
 disconnect the solar cell in reverse bias from a super cell module circuit. 
 
     
     
         17 . An apparatus as in  claim 16  wherein the power management device is in electrical communication with a central inverter. 
     
     
         18 . An apparatus as in  claim 13  wherein the power management device comprises a DC/DC module power optimizer. 
     
     
         19 . An apparatus as in  claim 3  wherein the interconnect is sandwiched between the super cell and another super cell on the front surface. 
     
     
         20 . An apparatus as in  claim 3  wherein the ribbon conductor is conductively bonded to the interconnect. 
     
     
         21 . An apparatus as in  claim 3  wherein the interconnect provides a resistance to current flow of less than or equal to about 0.012 Ohms. 
     
     
         22 . An apparatus as in  claim 3  wherein the interconnect is configured to accommodate differential expansion between the first silicon solar cell and the interconnect for a temperature range of between about −40° C. to about 85° C. 
     
     
         23 . An apparatus as in  claim 3  wherein a thickness of the interconnect is less than or equal to about 100 microns. 
     
     
         24 . An apparatus as in  claim 3  wherein a thickness of the interconnect is less than or equal to about 30 microns. 
     
     
         25 . An apparatus as in  claim 3  wherein the super cell has a length in a direction of current flow of at least about 500 mm. 
     
     
         26 . An apparatus as in  claim 3  further comprising an other super cell on the module front surface. 
     
     
         27 . An apparatus as in  claim 26  wherein the interconnect connects the other super cell in series with the super cell. 
     
     
         28 . An apparatus as in  claim 26  wherein the interconnect connects the other super cell in parallel with the super cell. 
     
     
         29 . An apparatus as in  claim 26  wherein the front surface comprises a white backing featuring darkened stripes of location and width corresponding to gaps between the super cell and the other super cell. 
     
     
         30 . An apparatus as in  claim 3  wherein the interconnect comprises a pattern. 
     
     
         31 . An apparatus as in  claim 30  wherein the pattern comprises slits, slots, and/or holes. 
     
     
         32 . An apparatus as in  claim 3  wherein a portion of the interconnect is dark. 
     
     
         33 . An apparatus as in  claim 3  wherein:
 the first silicon solar cell includes chamfered corners; 
 the second silicon solar cell lacks chamfered corners; and 
 each silicon solar cell of the super cell has substantially a same front surface area exposed to light. 
 
     
     
         34 . An apparatus as in  claim 3  wherein:
 the first silicon solar cell includes chamfered corners; 
 the second silicon solar cell includes chamfered corners; and 
 the side comprises a long side overlapping a long side of the second silicon solar cell. 
 
     
     
         35 . An apparatus as in  claim 3  wherein the interconnect forms a bus. 
     
     
         36 . An apparatus as in  claim 3  wherein the interconnect is conductively bonded to the solar cell surface at a glued joint. 
     
     
         37 . An apparatus as in  claim 3  wherein a first portion of the interconnect folds around an edge of the super cell such that a remaining second portion is located on a backside of the super cell. 
     
     
         38 . An apparatus as in  claim 3  further comprising a metallization pattern on the front surface and comprising a line running along a long side, the apparatus further comprising at plurality of discrete contact pads located between the line and the long side. 
     
     
         39 . An apparatus as in  claim 38  wherein:
 the metallization further comprises fingers electrically connected to respective discrete contact pads and running perpendicularly to the long side; and 
 the conductive line interconnects the fingers. 
 
     
     
         40 . An apparatus as in  claim 38  wherein the metallization pattern comprises a raised feature to confine spreading of the adhesive.