Cooling device and method for manufacturing same

Abstract

This cooling device has: an evaporation section for storing a refrigerant; a condensation section for radiating the heat of a gas-phase refrigerant, which has been gasified by the evaporation section, by condensing and liquefying the gas-phase refrigerant; a vapor pipe for transporting the gas-phase refrigerant to the condensation section; a liquid pipe for transporting a liquid-phase refrigerant, which has been condensed by the condensation section, to the evaporation section; and a mounting plate provided with a connection structure connected to the device side which is to be cooled. The evaporation section is disposed on one surface of the mounting plate, and the condensation section is disposed on the other side of the mounting plate. This method for manufacturing a cooling device is configured in such a manner that a mounting plate is formed by providing a connection structure to a flat surface member, an evaporation section is disposed on one surface of the mounting plate, a condensation section is disposed on the other side of the mounting plate, and the condensation section is connected to the evaporation section by piping. In cooling devices using a phase change cooling method, the cost of manufacturing the entirety of each of the devices increases because the interchangeability of the device with existing cooling devices needs to be ensured.

What is claimed is: 
     
         1 . A cooling device, comprising:
 an evaporation section for storing a refrigerant;   a condensation section for radiating heat by condensing and liquefying a gas-phase refrigerant that is gasified in the evaporation section;   a vapor pipe for transporting the gas-phase refrigerant to the condensation section;   a liquid pipe for transporting a liquid-phase refrigerant that is condensed in the condensation section to the evaporation section; and   a mounting plate provided with a connection structure connected to the side of a device that is a cooling target,   wherein the evaporation section is disposed on one surface of the mounting plate and the condensation section is disposed on the other side of the mounting plate.   
     
     
         2 . The cooling device of  claim 1 , wherein at least a part of the evaporation section and the liquid pipe is disposed in a space that is formed at a part in the mounting plate in the plate thickness direction. 
     
     
         3 . The cooling device of  claim 1  wherein the condensation section includes an opening in a bottom face thereof, the mounting plate includes a first opening in an top face thereof, and
 the liquid pipe is formed so that the opening in the bottom face of the condensation section comes in contact with the first opening in the top face of the mounting plate. 
 
     
     
         4 . The cooling device of  claim 1 , wherein the mounting plate is formed so that a plurality of flat plate members are laminated. 
     
     
         5 . The cooling device of  claim 4 , wherein
 the mounting plate comprising;
 an top plate for forming an top face of the evaporation section, a connection section of the vapor pipe and a connection section of the liquid pipe: 
 a middle plate for forming a side face of the evaporation section and the liquid pipe: and 
 a bottom plate for forming a bottom face of the evaporation section. 
   
     
     
         6 . The cooling device of  claim 1  wherein a fin-shaped projection is formed on the bottom face of the evaporation section that comes in contact with the liquid refrigerant. 
     
     
         7 . The cooling device of  claim 1  wherein a sintered body is joined to the bottom of the evaporation section that comes in contact with the liquid-phase refrigerant. 
     
     
         8 . The cooling device of  claim 7 , wherein the sintered body is made of a metal that is the same as that of the bottom plate. 
     
     
         9 . The cooling device of  claim 5 , wherein the bottom plate is made of a metal that is different from that of either one or both of the middle plate and the top plate. 
     
     
         10 . A method for manufacturing a cooling device, comprising:
 forming a mounting plate provided with a connection structure connected to the side of a device that is a cooling target by providing a connection structure on a flat surface member;   disposing an evaporation section for storing a refrigerant on one surface of the mounting plate;   disposing a condensation section for radiating heat by condensing and liquefying a gas-phase refrigerant that is gasified in the evaporation section on the other side of the mounting plate; and   connecting the condensation section to the evaporation section by piping.