Multi-wafer rotating disc reactor with inertial planetary drive

Abstract

Wafer carriers and methods for moving wafers in a reactor. The wafer carrier may include a platen with a plurality of compartments and a plurality of wafer platforms. The platen is configured to rotate about a first axis. Each of the wafer platforms is associated with one of the compartments and is configured to rotate about a respective second axis relative to the respective compartment. The platen and the wafer platforms rotate with different angular velocities to create planetary motion therebetween. The method may include rotating a platen about a first axis of rotation. The method further includes rotating each of a plurality of wafer platforms carried on the platen and carrying the wafers about a respective second axis of rotation and with a different angular velocity than the platen to create planetary motion therebetween.

1 . A method of moving wafers in a reactor, the method comprising:
 rotating a platen about a first axis of rotation; and   rotating each of a plurality of wafer platforms carried in compartments on the platen and carrying the wafers about a respective second axis of rotation and with a different angular velocity than the platen to create planetary motion therebetween.   
     
     
         2 . The method of  claim 1  wherein rotating each of the wafer platforms comprises:
 transferring torque from a drive shaft to each of the wafer platforms. 
 
     
     
         3 . The method of  claim 2  wherein the transferring torque comprises:
 spinning a first gear connected with the drive shaft at a first angular velocity to generate the torque; and 
 transferring the torque from the first gear to a second gear attached to each of the wafer platforms and thereby cause rotation of the wafer platforms. 
 
     
     
         4 . The method of  claim 2  wherein the transferring torque comprises:
 spinning the drive shaft at a first angular velocity to generate the torque; and 
 transferring the torque with belt couplings from the drive shaft to each of the wafer platforms and thereby cause rotation of the wafer platforms. 
 
     
     
         5 . The method of  claim 2  wherein rotating the platen about the first axis of rotation comprises:
 transferring torque from the drive shaft to the platen to cause rotation about the first axis at a first angular velocity, 
 wherein the wafer platforms are free of direct mechanical connections with the drive shaft and rotation of the platen at the first angular velocity causes free rotation of each wafer platform relative to the respective compartment at a second angular velocity. 
 
     
     
         6 . The method of  claim 2  further comprising:
 modulating an angular velocity of the drive shaft with a time-varying profile for the different angular velocities of the platen and the wafer platforms.