Copper alloy

Abstract

A copper alloy according to the present invention includes 17 mass % to 34 mass % of Zn, 0.02 mass % to 2.0 mass % of Sn, 1.5 mass % to 5 mass % of Ni, and a balance consisting of Cu and unavoidable impurities, in which relationships of 12≦f1=[Zn]+5×[Sn]−2×[Ni]≦30, 10≦[Zn]−0.3×[Sn]−2×[Ni]≦28, 10≦f3={f1×(32−f1)×[Ni]} 1/2 ≦33, 1.2≦0.7×[Ni]+[Sn]≦4, and 1.4≦[Ni]/[Sn]≦90 are satisfied, conductivity is 13% IACS to 25% IACS, a ratio of an α phase is 99.5% or more by area ratio or an area ratio of a γ phase (γ)% and an area ratio of a β phase (β)% in an α phase matrix satisfy a relationship of 0≦2×(γ)+(β)≦0.7.

1 . A copper alloy comprising:
 17 mass % to 34 mass % of Zn;   0.02 mass % to 2.0 mass % of Sn;   1.5 mass % to 5 mass % of Ni; and   a balance consisting of Cu and unavoidable impurities,   wherein a Zn content [Zn] (mass %), a Sn content [Sn] (mass %), and a Ni content [Ni] (mass %) satisfy relationships of
   12≦ f 1=[Zn]+5×[Sn]−2×[Ni]≦30,
 
   10≦ f 2=[Zn]−0.3×[Sn]−2×[Ni]≦28, and
 
   10≦ f 3={ f 1×(32− f 1)×[Ni]} 1/2 ≦33,
 
   the Sn content [Sn] (mass %) and the Ni content [Ni] (mass %) satisfy relationships of
   1.2≦0.7×[Ni]+[Sn]≦4, and
 
   1.4≦[Ni]/[Sn]≦90,
 
   conductivity is 13% IACS or more and 25% IACS or less, and   in a metallographic structure, a ratio of an α phase in a constituent phase of the metallographic structure is 99.5% or more by area ratio or an area ratio of a γ phase (γ)% and an area ratio of a β phase (β)% of an α phase matrix satisfy a relationship of 0≦2×(γ)+(β)≦0.7, and the γ phase having an area ratio of 0% to 0.3% and the β phase having an area ratio of 0% to 0.5% are dispersed in the α phase matrix.   
     
     
         2 . A copper alloy comprising:
 18 mass % to 33 mass % of Zn;   0.2 mass % to 1.5 mass % of Sn;   1.5 mass % to 4 mass % of Ni; and   a balance consisting of Cu and unavoidable impurities,   wherein a Zn content [Zn] (mass %), a Sn content [Sn] (mass %), and a Ni content [Ni] (mass %) satisfy relationships of
   15≦ f 1=[Zn]+5×[Sn]−2×[Ni]≦30,
 
   12≦ f 2=[Zn]−0.3×[Sn]−2×[Ni]≦28, and
 
   10≦ f 3={ f 1×(32− f 1)×[Ni]} 1/2 ≦30,
 
   the Sn content [Sn] (mass %) and the Ni content [Ni] (mass %) satisfy relationships of
   1.4≦0.7×[Ni]+[Sn]≦3.6, and
 
   1.6≦[Ni]/[Sn]≦12,
 
   conductivity is 14% IACS or more and 25% IACS or less, and   a metallographic structure is composed of an α single phase.   
     
     
         3 . A copper alloy comprising:
 17 mass % to 34 mass % of Zn;   0.02 mass % to 2.0 mass % of Sn;   1.5 mass % to 5 mass % of Ni;   at least one or more selected from 0.003 mass % to 0.09 mass % of P, 0.005 mass % to 0.5 mass % of Al, 0.01 mass % to 0.09 mass % of Sb, 0.01 mass % to 0.09 mass % of As, and 0.0005 mass % to 0.03 mass % of Pb; and   a balance consisting of Cu and unavoidable impurities,   wherein a Zn content [Zn] (mass %), a Sn content [Sn] (mass %), and a Ni content [Ni] (mass %) satisfy relationships of
   12≦ f 1=[Zn]+5×[Sn]−2×[Ni]≦30,
 
   10≦ f 2=[Zn]−0.3×[Sn]−2×[Ni]≦28, and
 
   10≦ f 3={ f 1×(32− f 1)×[Ni]} 1/2 ≦33,
 
   the Sn content [Sn] (mass %) and the Ni content [Ni] (mass %) satisfy relationships of
   1.2≦0.7×[Ni]+[Sn]≦4, and
 
   1.4≦[Ni]/[Sn]≦90,
 
   conductivity is 13% IACS or more and 25% IACS or less, and   in a metallographic structure, a ratio of an α phase in a constituent phase of the metallographic structure is 99.5% or more by area ratio or an area ratio of a γ phase (γ)% and an area ratio of a β phase (β)% of an α phase matrix satisfy a relationship of 0≦2×(γ)+(β)≦0.7, and the γ phase having an area ratio of 0% to 0.3% and the β phase having an area ratio of 0% to 0.5% are dispersed in the α phase matrix.   
     
     
         4 . A copper alloy comprising:
 18 mass % to 33 mass % of Zn;   0.2 mass % to 1.5 mass % of Sn;   1.5 mass % to 4 mass % of Ni;   0.003 mass % to 0.08 mass % of P; and   a balance consisting of Cu and unavoidable impurities,   wherein a Zn content [Zn] (mass %), a Sn content [Sn] (mass %), and a Ni content [Ni] (mass %) satisfy relationships of
   15≦ f 1=[Zn]+5×[Sn]−2×[Ni]≦30,
 
   12≦ f 2=[Zn]−0.3×[Sn]−2×[Ni]≦28, and
 
   10≦ f 3={ f 1×(32− f 1)×[Ni]} 1/2 ≦30,
 
   the Sn content [Sn] (mass %) and the Ni content [Ni] (mass %) satisfy relationships of
   1.4≦0.7×[Ni]+[Sn]≦3.6, and
 
   1.6≦[Ni]/[Sn]≦12,
 
   the Ni content [Ni] (mass %) and the P content [P] (mass %) satisfy a relationship of
   25≦[Ni]/[P]≦750,
 
   conductivity is 14% IACS or more and 25% IACS or less, and   a metallographic structure is composed of an α single phase.   
     
     
         5 . A copper alloy comprising:
 17 mass % to 34 mass % of Zn;   0.02 mass % to 2.0 mass % of Sn;   1.5 mass % to 5 mass % of Ni;   0.0005 mass % or more and 0.2 mass % or less in total of at least one or more selected from Fe, Co, Mg, Mn, Ti, Zr, Cr, Si and rare earth metal elements, each contained in an amount of 0.0005 mass % or more and 0.05 mass % or less; and   a balance consisting of Cu and unavoidable impurities,   wherein a Zn content [Zn] (mass %), a Sn content [Sn] (mass %), and a Ni content [Ni] (mass %) satisfy relationships of
   12≦ f 1=[Zn]+5×[Sn]−2×[Ni]≦30,
 
   10≦ f 2=[Zn]−0.3×[Sn]−2×[Ni]≦28, and
 
   10≦ f 3={ f 1×(32− f 1)×[Ni]} 1/2 ≦33,
 
   the Sn content [Sn] (mass %) and the Ni content [Ni] (mass %) satisfy relationships of
   1.2≦0.7×[Ni]+[Sn]≦4, and
 
   1.4≦[Ni]/[Sn]≦90,
 
   conductivity is 13% IACS or more and 25% IACS or less, and   in a metallographic structure, a ratio of an α phase in a constituent phase of the metallographic structure is 99.5% or more by area ratio or an area ratio of a γ phase (γ)% and an area ratio of a β phase (β)% of an α phase matrix satisfy a relationship of 0≦2×(γ)+(β)≦0.7, and the γ phase having an area ratio of 0% to 0.3% and the β phase having an area ratio of 0% to 0.5% are dispersed in the α phase matrix.   
     
     
         6 . A copper alloy comprising:
 17 mass % to 34 mass % of Zn;   0.02 mass % to 2.0 mass % of Sn;   1.5 mass % to 5 mass % of Ni;   at least one or more selected from 0.003 mass % to 0.09 mass % of P, 0.005 mass % to 0.5 mass % of Al, 0.01 mass % to 0.09 mass % of Sb, 0.01 mass % to 0.09 mass % of As, and 0.0005 mass % to 0.03 mass % of Pb;   0.0005 mass % or more and 0.2 mass % or less in total of at least one or more selected from Fe, Co, Mg, Mn, Ti, Zr, Cr, Si and rare earth metal elements, each contained in an amount of 0.0005 mass % or more and 0.05 mass % or less; and   a balance consisting of Cu and unavoidable impurities,   wherein a Zn content [Zn] (mass %), a Sn content [Sn] (mass %), and a Ni content [Ni] (mass %) satisfy relationships of
   12≦ f 1=[Zn]+5×[Sn]−2×[Ni]≦30,
 
   10≦ f 2=[Zn]−0.3×[Sn]−2×[Ni]≦28, and
 
   10≦ f 3={ f 1×(32− f 1)×[Ni]} 1/2 ≦33,
 
   the Sn content [Sn] (mass %) and the Ni content [Ni] (mass %) satisfy relationships of
   1.2≦0.7×[Ni]+[Sn]≦4, and
 
   1.4≦[Ni]/[Sn]≦90,
 
   conductivity is 13% IACS or more and 25% IACS or less, and   in a metallographic structure, a ratio of an α phase in a constituent phase of the metallographic structure is 99.5% or more by area ratio or an area ratio of a γ phase (γ)% and an area ratio of a β phase (β)% of an α phase matrix satisfy a relationship of 0≦2×(γ)+(β)≦0.7, and the γ phase having an area ratio of 0% to 0.3% and the β phase having an area ratio of 0% to 0.5% are dispersed in the α phase matrix.   
     
     
         7 . A copper alloy comprising:
 18 mass % to 33 mass % of Zn;   0.2 mass % to 1.5 mass % of Sn;   1.5 mass % to 4 mass % of Ni;   0.003 mass % to 0.08 mass % of P;   0.0005 mass % or more and 0.2 mass % or less in total of at least one or more selected from Fe, Co, Mg, Mn, Ti, Zr, Cr, Si and rare earth elements, each contained in an amount of 0.0005 mass % or more and 0.05 mass % or less; and   a balance consisting of Cu and unavoidable impurities,   wherein a Zn content [Zn] (mass %), a Sn content [Sn] (mass %), and a Ni content [Ni] (mass %) satisfy relationships of
   15≦ f 1=[Zn]+5×[Sn]−2×[Ni]≦30,
 
   12≦ f 2=[Zn]−0.3×[Sn]−2×[Ni]≦28, and
 
   10≦ f 3={ f 1×(32− f 1)×[Ni]} 1/2 ≦30,
 
   the Sn content [Sn] (mass %) and the Ni content [Ni] (mass %) satisfy relationships of
   1.4≦0.7×[Ni]+[Sn]≦3.6, and
 
   1.6≦[Ni]/[Sn]≦12,
 
   the Ni content [Ni] (mass %) and the P content [P] (mass %) satisfy a relationship of
   25≦[Ni]/[P]≦750,
 
   conductivity is 14% IACS or more and 25% IACS or less, and   a metallographic structure is composed of an α single phase.   
     
     
         8 . The copper alloy according to  claim 1 ,
 wherein the copper alloy is applicable to medical appliances, handrails, door handles, and water supply and drain sanitary facilities, apparatuses and containers.   
     
     
         9 . The copper alloy according to  claim 1 ,
 wherein the copper alloy is used for electronic and electrical components and automobile components of connectors, terminals, relays, and switches.   
     
     
         10 - 12 . (canceled) 
     
     
         13 . The copper alloy according to  claim 2 ,
 wherein the copper alloy is applicable to medical appliances, handrails, door handles, and water supply and drain sanitary facilities, apparatuses and containers.   
     
     
         14 . The copper alloy according to  claim 3 ,
 wherein the copper alloy is applicable to medical appliances, handrails, door handles, and water supply and drain sanitary facilities, apparatuses and containers.   
     
     
         15 . The copper alloy according to  claim 4 ,
 wherein the copper alloy is applicable to medical appliances, handrails, door handles, and water supply and drain sanitary facilities, apparatuses and containers.   
     
     
         16 . The copper alloy according to  claim 5 ,
 wherein the copper alloy is applicable to medical appliances, handrails, door handles, and water supply and drain sanitary facilities, apparatuses and containers.   
     
     
         17 . The copper alloy according to  claim 6 ,
 wherein the copper alloy is applicable to medical appliances, handrails, door handles, and water supply and drain sanitary facilities, apparatuses and containers.   
     
     
         18 . The copper alloy according to  claim 7 ,
 wherein the copper alloy is applicable to medical appliances, handrails, door handles, and water supply and drain sanitary facilities, apparatuses and containers.   
     
     
         19 . The copper alloy according to  claim 2 ,
 wherein the copper alloy is used for electronic and electrical components and automobile components of connectors, terminals, relays, and switches.   
     
     
         20 . The copper alloy according to  claim 3 ,
 wherein the copper alloy is used for electronic and electrical components and automobile components of connectors, terminals, relays, and switches.   
     
     
         21 . The copper alloy according to  claim 4 ,
 wherein the copper alloy is used for electronic and electrical components and automobile components of connectors, terminals, relays, and switches.   
     
     
         22 . The copper alloy according to  claim 5 ,
 wherein the copper alloy is used for electronic and electrical components and automobile components of connectors, terminals, relays, and switches.   
     
     
         23 . The copper alloy according to  claim 6 ,
 wherein the copper alloy is used for electronic and electrical components and automobile components of connectors, terminals, relays, and switches.   
     
     
         24 . The copper alloy according to  claim 7 ,
 wherein the copper alloy is used for electronic and electrical components and automobile components of connectors, terminals, relays, and switches.