Inventor · disambiguated record
Yosuke Nakasato
Also filed as: NAKASATO YOSUKE
9 granted patents·10 pending applications·1 citations·filing 2009–2022
77Inventor score
Top patents by PatentIndex Score
19 records- 0176US2018155807A1Copper alloyMITSUBISHI SHINDO KK·Filed 2017·Application pending·0 cites
- 0275US2020308675A1Copper alloyMITSUBISHI SHINDO KK·Filed 2020·Application pending·0 cites
- 0375US2020308674A1Copper alloyMITSUBISHI SHINDO KK·Filed 2020·Application pending·0 cites
- 0471US9873927B2Copper alloyMITSUBISHI SHINDO KK·Filed 2016·Granted Jan 23, 2018·0 cites·14 claims
- 0571US2016201164A1Copper alloyMITSUBISHI SHINDO KK·Filed 2014·Application pending·0 cites
- 0665US9970081B2Copper alloy and copper alloy sheetMITSUBISHI SHINDO KK·Filed 2014·Granted May 15, 2018·0 cites·9 claims
- 0765US2015122380A1Copper-alloy plate for terminal/connector material, and method for producing copper-alloy plate for terminal/connector materialMITSUBISHI SHINDO KK·Filed 2014·Application pending·0 cites
- 0864US10020088B2Copper-alloy plate for terminal/connector material, and method for producing copper-alloy plate for terminal/connector materialMITSUBISHI SHINDO KK·Filed 2015·Granted Jul 10, 2018·0 cites·10 claims
- 0960US9080227B2Copper alloy sheet and method of manufacturing copper alloy sheetMITSUBISHI SHINDO KK·Filed 2012·Granted Jul 14, 2015·0 cites·12 claims
- 1059US9957589B2Copper-alloy plate for terminal/connector material, and method for producing copper-alloy plate for terminal/connector materialMITSUBISHI SHINDO KK·Filed 2013·Granted May 1, 2018·0 cites·6 claims
- 1159US9212419B2Sputtering target for forming wiring film of flat panel displayMAKI KAZUNARI·Filed 2009·Granted Dec 15, 2015·1 cites·2 claims
- 1259US9133535B2Copper alloy sheet and method of manufacturing copper alloy sheetMITSUBISHI SHINDO KK·Filed 2014·Granted Sep 15, 2015·0 cites·8 claims
- 1358US2016186295A1Copper alloy and copper alloy sheetMITSUBISHI SHINDO KK·Filed 2016·Application pending·0 cites
- 1450US2024124955A1Hot-rolled copper alloy sheet and sputtering targetMITSUBISHI MATERIALS CORP·Filed 2022·Application pending·0 cites
- 1550US2024183009A1Hot-rolled copper alloy sheet and sputtering targetMITSUBISHI MATERIALS CORP·Filed 2022·Application pending·0 cites
- 1645US2011192719A1Sputtering target for forming thin film transistor wiring filmMITSUBISHI MATERIALS CORP·Filed 2009·Application pending·0 cites
- 1744US8658009B2Thin film transistor having a barrier layer as a constituting layer and Cu-alloy sputtering target used for sputter film formation of the barrier layerMAKI KAZUNARI·Filed 2009·Granted Feb 25, 2014·0 cites·1 claims
- 1843US2015136595A1Sputtering target for forming wiring film of flat panel displayMITSUBISHI MATERIALS CORP·Filed 2015·Application pending·0 cites
- 1937US8624397B2Electrode layer structure for a thin-film transistor and process for manufacture thereofMAKI KAZUNARI·Filed 2010·Granted Jan 7, 2014·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →