Copper alloy

Abstract

A copper alloy according to the present invention includes 17 mass % to 34 mass % of Zn, 0.02 mass % to 2.0 mass % of Sn, 1.5 mass % to 5 mass % of Ni, and a balance consisting of Cu and unavoidable impurities, in which relationships of 12≤f1=[Zn]+5×[Sn]−2×[Ni]≤30, 10≤[Zn]−0.3×[Sn]−2×[Ni]≤28, 10≤f3={f1×(32−f1)×[Ni]}1/2≤33, 1.20≤0.7×[Ni]+[Sn]≤4, and 1.4≤[Ni]/[Sn]≤90 are satisfied, conductivity is 13% IACS to 25% IACS, a ratio of an α phase is 99.5% or more by area ratio or an area ratio of a γ phase (γ)% and an area ratio of a β phase (β)% in an α phase matrix satisfy a relationship of 0≤2×(γ)+(β)≤0.7.

1 - 12 . (canceled) 
     
     
         13 . A copper alloy comprising:
 17 mass % to 34 mass % of Zn;   0.02 mass % to 2.0 mass % of Sn;   2.1 mass % to 5 mass % of Ni; and   a balance consisting of Cu and unavoidable impurities,   wherein a Zn content expressed in mass %, [Zn], a Sn content expressed in mass %, [Sn], and a Ni content expressed in mass %, [Ni], satisfy relationships of
   12≤ f 1≤30, wherein  f 1=[Zn]+5×[Sn]−2×[Ni],
 
   10≤ f 2≤28, wherein  f 2=[Zn]−0.3×[Sn]−2×[Ni],
 
   10≤ f 3≤33, wherein  f 3={ f 1×(32− f 1)×[Ni]} 1/2 ;
 
   wherein the Sn content expressed in mass %, [Sn], and the Ni content expressed in mass %, [Ni], satisfy relationships of
   1.2≤0.7×[Ni]+[Sn]≤4, and
 
   1.4≤[Ni]/[Sn]≤90,
 
   wherein a conductivity is 13% IACS or more and 25% IACS or less, and   wherein, the copper alloy has a metallographic structure, selected from the group consisting of (1) a ratio of an α phase in a constituent phase of the metallographic structure is 99.5% or more by area ratio, and (2) an area ratio of a γ phase (γ)% and an area ratio of a β phase (β)% dispersed in an α phase matrix, satisfy a relationship of 0≤2×(γ)+(β)≤0.7, the γ phase having an area ratio of 0% to 0.3% and the p phase having an area ratio of 0% to 0.5% in the α phase matrix.   
     
     
         14 . A copper alloy comprising:
 17 mass % to 34 mass % of Zn;   0.02 mass % to 2.0 mass % of Sn;   2.1 mass % to 5 mass % of Ni;   at least one or more selected from 0.003 mass % to 0.09 mass % of P, 0.005 mass % to 0.5 mass % of Al, 0.01 mass % to 0.09 mass % of Sb, 0.01 mass % to 0.09 mass % of As, and 0.0005 mass % to 0.03 mass % of Pb; and   a balance consisting of Cu and unavoidable impurities,   wherein a Zn content in mass %, [Zn], a Sn content in mass %, [Sn], and a Ni content in mass %, [Ni] satisfy relationships of
   12≤ f 1≤30, wherein  f 1=[Zn]+5 33  [Sn]−2×[Ni],
 
   10≤ f 2≤28, wherein  f 2=[Zn]−0.3×[Sn]−2×[Ni], and
 
   10≤ f 3≤33, wherein  f 3= {f 1×(32− f 1)×[Ni]} 1/2 ;
 
   wherein the Sn content in mass %, [Sn],and the Ni content in mass %, [Ni], satisfy relationships of
   1.2≤0.7×[Ni]+[Sn]≤4, and
 
   1.4≤[Ni]/[Sn]≤90,
 
   wherein a conductivity is 13% IACS or more and 25% IACS or less, and   wherein, in a metallographic structure, a ratio of an α phase in a constituent phase of the metallographic structure is 99.5% or more by area ratio or an area ratio of a γ phase (γ)% and an area ratio of a β phase (β)% of an α phase matrix satisfy a relationship of 0≤2×(γ)+(β)≤0.7, and the γ phase having an area ratio of 0% to 0.3% and the p phase having an area ratio of 0% to 0.5% are dispersed in the α phase matrix,   wherein, the copper alloy contains P as at least one or more selected elements, the Ni content expressed in mass %, [Ni] and a P content expressed in mass %, [P] satisfy a relationship of
   25≤[Ni]/[P]≤750.
 
   
     
     
         15 . A copper alloy comprising:
 17 mass % to 34 mass % of Zn;   0.02 mass % to 2.0 mass % of Sn;   2.1 mass % to 5 mass % of Ni;   0.0005 mass % or more and 0.2 mass % or less in total of at least one or more selected from Fe, Co, Mg, Mn, Ti, Zr, Cr, Si and rare earth metal elements, each contained in an amount of 0.0005 mass % or more and 0.05 mass % or less; and   a balance consisting of Cu and unavoidable impurities,   wherein a Zn content expressed in mass %, [Zn], a Sn content expressed in mass %, [Sn], and a Ni content expressed in mass %, [Ni], satisfy relationships of
   12≤ f 1≤30, wherein  f 1=[Zn]+5×[Sn]−2×[Ni],
 
   10≤ f 2≤28, wherein  f 2=[Zn]−0.3 33  [Sn]−2×[Ni], and
 
   10≤ f 3≤33, wherein  f 3= {f 1×(32− f 1)×[Ni]} 1/2 ;
 
   the Sn content expressed in mass %, [Sn], and the Ni content expressed in mass %, [Ni], satisfy relationships of
   1.2≤0.7×[Ni]+[Sn]≤4, and
 
   1.4≤[Ni]/[Sn]≤90,
 
   wherein a conductivity is 13% IACS or more and 25% IACS or less, and   wherein, the copper alloy has a metallographic structure, selected from the group consisting of (1) a ratio of an α phase in a constituent phase of the metallographic structure is 99.5% or more by area ratio, and (2) an area ratio of a γ phase (γ)% and an area ratio of a β phase (β)% dispersed in an α phase matrix and satisfy a relationship of 0≤2×(γ)+(β)≤0.7, the γ phase having an area ratio of 0% to 0.3% and the β phase having an area ratio of 0% to 0.5% in the α phase matrix.   
     
     
         16 . A copper alloy comprising:
 17 mass % to 34 mass % of Zn;   0.02 mass % to 2.0 mass % of Sn;   2.1 mass % to 5 mass % of Ni;   at least one or more selected from 0.003 mass % to 0.09 mass % of P, 0.005 mass % to 0.5 mass % of Al, 0.01 mass % to 0.09 mass % of Sb, 0.01 mass % to 0.09 mass % of As, and 0.0005 mass % to 0.03 mass % of Pb;   0.0005 mass % or more and 0.2 mass % or less in total of at least one or more selected from Fe, Co, Mg, Mn, Ti, Zr, Cr, Si and rare earth metal elements, each contained in an amount of 0.0005 mass % or more and 0.05 mass % or less; and   a balance consisting of Cu and unavoidable impurities,   wherein a Zn content expressed in mass %, [Zn], a Sn content expressed in mass %, [Sn], and a Ni content expressed in mass %, [Ni],satisfy relationships of
   12 ≤f 1≤30, wherein  f 1=[Zn]+5×[Sn]−2×[Ni],
 
   10 ≤f 2≤28, wherein  f 2=[Zn]−0.3×[Sn]−2 33  [Ni], and
 
   10≤ f 3≤33, wherein  f 3={ f 1×(32− f 1)×[Ni]} 1/2 ;
 
   wherein the Sn content expressed in mass %, [Sn], and the Ni content expressed in mass %, [Ni], satisfy relationships of
   1.2≤0.7×[Ni]+[Sn]≤4, and
 
   1.4≤[Ni]/[Sn]≤90,
 
   wherein a conductivity is 13% IACS or more and 25% IACS or less, and   wherein, the copper alloy has a metallographic structure, selected from the group consisting of (1) a ratio of an α phase in a constituent phase of the metallographic structure is 99.5% or more by area ratio, and (2) an area ratio of a γ phase (γ)% and an area ratio of a β phase (β)% dispersed in an α phase matrix and satisfying a relationship of 0≤2×(γ)+(β)≤0.7, the γ phase having an area ratio of 0% to 0.3% and the p phase having an area ratio of 0% to 0.5% in the α phase matrix,   wherein, when the copper alloy contains P as at least one or more selected elements, the Ni content in mass %, [Ni], and a P content in mass %, [P], satisfy a relationship of
   25≤[Ni]/[P]≤750.
 
   
     
     
         17 . The copper alloy according to  claim 13 ,
 wherein the copper alloy is applicable to medical appliances, handrails, door handles, and water supply and drain sanitary facilities, apparatuses and containers.   
     
     
         18 . The copper alloy according to  claim 13 ,
 wherein the copper alloy is used for electronic and electrical components and automobile components of connectors, terminals, relays, and switches.   
     
     
         19 . The copper alloy according to  claim 14 ,
 wherein the copper alloy is applicable to medical appliances, handrails, door handles, and water supply and drain sanitary facilities, apparatuses and containers.   
     
     
         20 . The copper alloy according to  claim 15 ,
 wherein the copper alloy is applicable to medical appliances, handrails, door handles, and water supply and drain sanitary facilities, apparatuses and containers.   
     
     
         21 . The copper alloy according to  claim 16 ,
 wherein the copper alloy is applicable to medical appliances, handrails, door handles, and water supply and drain sanitary facilities, apparatuses and containers.   
     
     
         22 . The copper alloy according to  claim 14 ,
 wherein the copper alloy is used for electronic and electrical components and automobile components of connectors, terminals, relays, and switches.   
     
     
         23 . The copper alloy according to  claim 15 ,
 wherein the copper alloy is used for electronic and electrical components and automobile components of connectors, terminals, relays, and switches.   
     
     
         24 . The copper alloy according to  claim 16 ,
 wherein the copper alloy is used for electronic and electrical components and automobile components of connectors, terminals, relays, and switches.   
     
     
         25 . The copper alloy according to  claim 13 ,
 wherein the Sn content expressed in mass %, [Sn], and the Ni content expressed in mass %, [Ni], satisfy relationships of
   1.6≤0.7×[Ni]+[Sn]≤4, and
 
   1.8≤[Ni]/[Sn]≤12, and
 
   wherein the conductivity is 13% IACS or more and 21% IACS or less.   
     
     
         26 . The copper alloy according to  claim 14 ,
 wherein the Sn content expressed in mass %, [Sn], and the Ni content expressed in mass %, [Ni], satisfy relationships of
   1.6≤0.7×[Ni]+[Sn]≤4, and
 
   1.8≤[Ni]/[Sn]≤12, and
 
   wherein the conductivity is 13% IACS or more and 21% IACS or less.   
     
     
         27 . The copper alloy according to  claim 15 ,
 wherein the Sn content expressed in mass %, [Sn], and the Ni content expressed in mass %, [Ni],satisfy relationships of
   1.6≤0.7×[Ni]+[Sn]≤4, and
 
   1.8≤[Ni]/[Sn]≤12, and
 
   wherein the conductivity is 13% IACS or more and 21% IACS or less.   
     
     
         28 . The copper alloy according to  claim 16 ,
 wherein the Sn content expressed in mass %, [Sn], and the Ni content expressed in mass %, [Ni], satisfy relationships of
   1.6≤0.7×[Ni]+[Sn]≤4, and
 
   1.8≤[Ni]/[Sn]≤12, and
 
   wherein the conductivity is 13% IACS or more and 21% IACS or less.   
     
     
         29 . The copper alloy according to  claim 13 ,
 wherein the content of Ni is 2.1 mass % to 5 mass %,   wherein the conductivity is 13% IACS or more and 25% IACS or less,   wherein the Zn content expressed in mass %, [Zn], the Sn content expressed in mass %, [Sn], and the Ni content expressed in mass %, [Ni], satisfy relationships of
   12 ≤f 1≤29, wherein  f 1=[Zn]+5×[Sn]−2×[Ni],
 
   10 ≤f 2≤27, wherein  f 2=[Zn]−0.3×[Sn]−2×[Ni], and
 
   12 ≤f 3≤33, wherein  f 3 ={f 1×(32− f 1)×[Ni]} 1/2 , and
 
   wherein the Sn content expressed in mass % [Sn], and the Ni content expressed in mass %, [Ni], satisfy relationships of
   1.4≤0.7×[Ni]+[Sn]≤4, and
 
   1.6≤[Ni]/[Sn]≤90.
 
   
     
     
         30 . The copper alloy according to  claim 14 :
 wherein the copper alloy further includes 0.003 mass % to 0.09 mass % of P.   
     
     
         31 . A copper alloy comprising:
 17 mass % to 34 mass % of Zn;   0.02 mass % to 2.0 mass % of Sn;   2.1 mass % to 5 mass % of Ni;   0.0005 mass % to 0.05 mass % of Fe;   optionally 0.0005 mass % or more and 0.2 mass % or less in total of one or more selected from Co, Mg, Mn, Ti, Zr, Cr, Si and rare earth metal elements, each contained in an amount of 0.0005 mass % or more and 0.05 mass % or less; and   a balance consisting of Cu and unavoidable impurities,   wherein a Zn content expressed in mass %, [Zn], a Sn content expressed in mass %, [Sn], and a Ni content expressed in mass %, [Ni], satisfy relationships of
   12≤ f 1≤30, wherein  f 1=[Zn]+5×[Sn]−2×[Ni],
 
   10≤ f 2≤28, wherein  f 2=[Zn]−0.3×[Sn]−2×[Ni], and
 
   10≤ f 3≤33, wherein  f 3 ={f 1×(32− f 1)×[Ni]} 1/2 ;
 
   the Sn content expressed in mass %, [Sn], and the Ni content expressed in mass %, [Ni], satisfy relationships of
   1.2≤0.7×[Ni]+[Sn]≤4, and
 
   1.4≤[Ni]/[Sn]≤90,
 
   wherein a conductivity is 13% IACS or more and 25% IACS or less, and   wherein, the copper alloy has a metallographic structure, selected from the group consisting of (1) a ratio of an α phase in a constituent phase of the metallographic structure is 99.5% or more by area ratio, and (2) an area ratio of a γ phase (γ)% and an area ratio of a β phase (β)% dispersed in an α phase matrix satisfy a relationship of 0≤2×(γ)+(β)≤0.7, and the γ phase having an area ratio of 0% to 0.3% and the β phase having an area ratio of 0% to 0.5% in the α phase matrix.   
     
     
         32 . A copper alloy comprising:
 17 mass % to 34 mass % of Zn;   0.02 mass % to 2.0 mass % of Sn;   2.1 mass % to 5 mass % of Ni;   0.003 mass % to 0.09 mass % of P;   0.0005 mass % to 0.05 mass % of Fe;   optionally one or more selected from 0.005 mass % to 0.5 mass % of Al, 0.01 mass % to 0.09 mass % of Sb, 0.01 mass % to 0.09 mass % of As, and 0.0005 mass % to 0.03 mass % of Pb;   optionally 0.0005 mass % or more and 0.2 mass % or less in total of one or more selected from Co, Mg, Mn, Ti, Zr, Cr, Si and rare earth metal elements, each contained in an amount of 0.0005 mass % or more and 0.05 mass % or less; and   a balance consisting of Cu and unavoidable impurities,   wherein a Zn content expressed in mass %, [Zn], a Sn content expressed in mass %, [Sn], and a Ni content expressed in mass %, [Ni], satisfy relationships of
   12 ≤f 1≤30, wherein  f 1=[Zn]+5×[Sn]−2×[Ni],
 
   10 ≤f 2≤28, wherein  f 2=[Zn]−0.3×[Sn]−2×[Ni], and
 
   10 ≤f 3≤33, wherein  f 3 ={f 1×(32− f 1)×[Ni]} 1/2 ;
 
   wherein the Sn content expressed in mass %, [Sn], and the Ni content expressed in mass %, [Ni], satisfy relationships of
   1.2≤0.7×[Ni]+[Sn]≤4, and
 
   1.4≤[Ni]/[Sn]≤90,
 
   wherein a conductivity is 13% IACS or more and 25% IACS or less, and   wherein, the copper alloy has a metallographic structure, selected from the group consisting of (1) a ratio of an α phase in a constituent phase of the metallographic structure is 99.5% or more by area ratio, and (2) an area ratio of a γ phase (γ)% and an area ratio of a β phase (β)% dispersed in an α phase matrix satisfy a relationship of 0≤2×(γ)+(β)≤0.7, and the γ phase having an area ratio of 0% to 0.3% and the β phase having an area ratio of 0% to 0.5% in the α phase matrix,   wherein the Ni content expressed in mass %, [Ni], and a P content expressed in mass %, [P], satisfy a relationship of
   25≤[Ni]/[P]≤750.
 
   
     
     
         33 . The copper alloy according to  claim 13 :
 wherein proof stress×80%×(100%−stress relaxation rate (%) at 150° C. for 1,000 hours) is 295 N/mm 2  or more.   
     
     
         34 . The copper alloy according to  claim 14 :
 wherein proof stress×80%×(100%−stress relaxation rate (%) at 150° C. for 1,000 hours) is 295 N/mm 2  or more.   
     
     
         35 . The copper alloy according to  claim 15 :
 wherein proof stress×80%×(100%-stress relaxation rate (%) at 150° C. for 1,000 hours) is 295 N/mm 2  or more.   
     
     
         36 . The copper alloy according to  claim 16 :
 wherein proof stress×80%×(100%−stress relaxation rate (%) at 150° C. for 1,000 hours) is 295 N/mm 2  or more.