Copper alloy

Abstract

A copper alloy according to the present invention includes 17 mass % to 34 mass % of Zn, 0.02 mass % to 2.0 mass % of Sn, 1.5 mass % to 5 mass % of Ni, and a balance consisting of Cu and unavoidable impurities, in which relationships of 12≤f1=[Zn]+5×[Sn]−2×[Ni]≤30, 10≤[Zn]−0.3×[Sn]−2×[Ni]≤28, 10≤f3={f1×(32−f1)×[Ni]} 1/2 ≤33, 1.20≤0.7×[Ni]+[Sn]≤4, and 1.4≤[Ni]/[Sn]≤90 are satisfied, conductivity is 13% IACS to 25% IACS, a ratio of an α phase is 99.5% or more by area ratio or an area ratio of a γ phase (γ) % and an area ratio of a β phase (β) % in an α phase matrix satisfy a relationship of 0≤2×(γ)+(β)≤0.7.

1 - 12 . (canceled) 
     
     
         13 . A method of producing a copper alloy sheet which is composed of a copper alloy,
 the copper alloy consisting:   17 mass % to 34 mass % of Zn;   0.02 mass % to 2.0 mass % of Sn;   1.5 mass % to 5 mass % of Ni; and   a balance consisting of Cu and unavoidable impurities,   wherein a Zn content [Zn] (mass %), a Sn content [Sn] (mass %), and a Ni content [Ni] (mass %) satisfy relationships of:
   12 ≤f 1=[Zn]+5×[Sn]−2×[Ni]≤30,
 
   10 ≤f 2=[Zn]−0.3×[Sn]−2×[Ni]≤28,
 
   10 ≤f 3={ f 1×(32 −f 1)×[Ni]} 1/2 ≤33,
 
   1.2≤0.7×[Ni]+[Sn]≤4, and
 
   1.4≤[Ni]/[Sn]≤90,
 
   conductivity is 13% IACS or more and 25% IACS or less, and   in a metallographic structure, a ratio of an α phase in a constituent phase of the metallographic structure is 99.5% or more by area ratio or an area ratio of a γ phase (γ) % and an area ratio of a β phase (β) % of an α phase matrix satisfy a relationship of 0≤2×(γ)+(β)≤0.7, and the γ phase having an area ratio of 0% to 0.3% and the β phase having an area ratio of 0% to 0.5% are dispersed in the α phase matrix, and   the method comprising:   a casting process;   a pair of a cold rolling process and an annealing process;   a cold rolling process;   a recrystallization heat treatment process;   a finish cold rolling process; and   a recovery heat treatment process,   wherein a process of hot-rolling a copper alloy or a rolled material is not included,   either or both of a combination of the cold rolling process and the recrystallization heat treatment process and a combination of the finish cold rolling process and the recovery heat treatment process are carried out,   a cold working rate in the cold rolling process is 40% or more,   the recrystallization heat treatment process sequentially includes a heating step of heating the cold-rolled copper alloy material to a predetermined temperature using a continuous heat treatment furnace, a holding step of holding the copper alloy material at a predetermined temperature for a predetermined period of time after the heating step, and a cooling step of cooling the copper alloy material to a predetermined temperature after the holding step,   in the recrystallization heat treatment process, when a maximum reaching temperature of the copper alloy material is denoted by Tmax (° C.), and a heating and holding time in a temperature range of a temperature 50° C. lower than the maximum reaching temperature of the copper alloy material to the maximum reaching temperature is denoted by tm (min),
   540≤Tmax≤790,
 
   0.04≤tm≤1.0, and
 
   500 ≤It 1=( T max−30 ×tm   −1/2 )≤680,
 
   the recovery heat treatment process includes a heating step of heating the finish cold-rolled copper alloy material to a predetermined temperature, a holding step of holding the copper alloy material at a predetermined temperature for a predetermined period of time after the heating step, and a cooling step of cooling the copper alloy material to a predetermined temperature after the holding step, and when a maximum reaching temperature of the copper alloy material is denoted by Tmax2 (° C.), and a heating and holding time in a temperature range of a temperature 50° C. lower than the maximum reaching temperature of the copper alloy material to the maximum reaching temperature is denoted by tm2 (min),
   150≤Tmax2≤580,
 
   0.02≤tm2≤100, and
 
   120 ≤It 2=( T max2−25 ×tm 2 −1/2 )≤390.
 
   
     
     
         14 . A method of producing a copper alloy sheet which is composed of a copper alloy,
 the copper alloy consisting:   18 mass % to 33 mass % of Zn;   0.2 mass % to 1.5 mass % of Sn;   1.5 mass % to 4 mass % of Ni; and   a balance consisting of Cu and unavoidable impurities,   wherein a Zn content [Zn] (mass %), a Sn content [Sn] (mass %), and a Ni content [Ni] (mass %) satisfy relationships of:
   15 ≤f 1=[Zn]+5×[Sn]−2×[Ni]≤30,
 
   12 ≤f 2=[Zn]−0.3×[Sn]−2×[Ni]≤28,
 
   10 ≤f 3={ f 1×(32 −f 1)×[Ni]} 1/2 ≤30,
 
   1.4≤0.7×[Ni]+[Sn]≤3.6, and
 
   1.6≤[Ni]/[Sn]≤12,
 
   conductivity is 14% IACS or more and 25% IACS or less, and   a metallographic structure is composed of an a single phase, and   the method comprising:   a casting process;   a pair of a cold rolling process and an annealing process;   a cold rolling process;   a recrystallization heat treatment process;   a finish cold rolling process; and   a recovery heat treatment process,   wherein a process of hot-rolling a copper alloy or a rolled material is not included,   either or both of a combination of the cold rolling process and the recrystallization heat treatment process and a combination of the finish cold rolling process and the recovery heat treatment process are carried out,   a cold working rate in the cold rolling process is 40% or more,   the recrystallization heat treatment process sequentially includes a heating step of heating the cold-rolled copper alloy material to a predetermined temperature using a continuous heat treatment furnace, a holding step of holding the copper alloy material at a predetermined temperature for a predetermined period of time after the heating step, and a cooling step of cooling the copper alloy material to a predetermined temperature after the holding step,   in the recrystallization heat treatment process, when a maximum reaching temperature of the copper alloy material is denoted by Tmax (° C.), and a heating and holding time in a temperature range of a temperature 50° C. lower than the maximum reaching temperature of the copper alloy material to the maximum reaching temperature is denoted by tm (min),
   540≤Tmax≤790,
 
   0.04≤tm≤1.0, and
 
   500 ≤It 1=( T max−30 ×tm   −1/2 )≤680,
 
   the recovery heat treatment process includes a heating step of heating the finish cold-rolled copper alloy material to a predetermined temperature, a holding step of holding the copper alloy material at a predetermined temperature for a predetermined period of time after the heating step, and a cooling step of cooling the copper alloy material to a predetermined temperature after the holding step, and when a maximum reaching temperature of the copper alloy material is denoted by Tmax2 (° C.), and a heating and holding time in a temperature range of a temperature 50° C. lower than the maximum reaching temperature of the copper alloy material to the maximum reaching temperature is denoted by tm2 (min),
   150≤Tmax2≤580,
 
   0.02≤tm2≤100, and
 
   120 ≤It 2=( T max2−25 ×tm 2 −1/2 )≤390.
 
   
     
     
         15 . A method of producing a copper alloy sheet which is composed of a copper alloy,
 the copper alloy consisting:   17 mass % to 34 mass % of Zn;   0.02 mass % to 2.0 mass % of Sn;   1.5 mass % to 5 mass % of Ni;   at least one or more selected from 0.003 mass % to 0.09 mass % of P, 0.005 mass % to 0.5 mass % of Al, 0.01 mass % to 0.09 mass % of Sb, 0.01 mass % to 0.09 mass % of As, and 0.0005 mass % to 0.03 mass % of Pb; and   a balance consisting of Cu and unavoidable impurities,   wherein a Zn content [Zn] (mass %), a Sn content [Sn] (mass %), and a Ni content [Ni] (mass %) satisfy relationships of:
   12 ≤f 1=[Zn]+5×[Sn]−2×[Ni]≤30,
 
   10 ≤f 2=[Zn]−0.3×[Sn]−2×[Ni]≤28,
 
   10 ≤f 3={ f 1×(32 −f 1)×[Ni]} 1/2 ≤33,
 
   1.2≤0.7×[Ni]+[Sn]≤4, and
 
   1.4≤[Ni]/[Sn]≤90,
 
   conductivity is 13% IACS or more and 25% IACS or less, and   in a metallographic structure, a ratio of an α phase in a constituent phase of the metallographic structure is 99.5% or more by area ratio or an area ratio of a γ phase (γ) % and an area ratio of a β phase (β) % of an α phase matrix satisfy a relationship of 0≤2×(γ)+(β)≤0.7, and the γ phase having an area ratio of 0% to 0.3% and the β phase having an area ratio of 0% to 0.5% are dispersed in the α phase matrix, and   the method comprising:   a casting process;   a pair of a cold rolling process and an annealing process;   a cold rolling process;   a recrystallization heat treatment process;   a finish cold rolling process; and   a recovery heat treatment process,   wherein a process of hot-rolling a copper alloy or a rolled material is not included,   either or both of a combination of the cold rolling process and the recrystallization heat treatment process and a combination of the finish cold rolling process and the recovery heat treatment process are carried out,   a cold working rate in the cold rolling process is 40% or more,   the recrystallization heat treatment process sequentially includes a heating step of heating the cold-rolled copper alloy material to a predetermined temperature using a continuous heat treatment furnace, a holding step of holding the copper alloy material at a predetermined temperature for a predetermined period of time after the heating step, and a cooling step of cooling the copper alloy material to a predetermined temperature after the holding step,   in the recrystallization heat treatment process, when a maximum reaching temperature of the copper alloy material is denoted by Tmax (° C.), and a heating and holding time in a temperature range of a temperature 50° C. lower than the maximum reaching temperature of the copper alloy material to the maximum reaching temperature is denoted by tm (min),
   540≤Tmax≤790,
 
   0.04≤tm≤1.0, and
 
   500 ≤It 1=( T max−30 ×tm   −1/2 )≤680,
 
   the recovery heat treatment process includes a heating step of heating the finish cold-rolled copper alloy material to a predetermined temperature, a holding step of holding the copper alloy material at a predetermined temperature for a predetermined period of time after the heating step, and a cooling step of cooling the copper alloy material to a predetermined temperature after the holding step, and when a maximum reaching temperature of the copper alloy material is denoted by Tmax2 (° C.), and a heating and holding time in a temperature range of a temperature 50° C. lower than the maximum reaching temperature of the copper alloy material to the maximum reaching temperature is denoted by tm2 (min),
   150≤Tmax2≤580,
 
   0.02≤tm2≤100, and
 
   120 ≤It 2=( T max2−25 ×tm 2 −1/2 )≤390.
 
   
     
     
         16 . A method of producing a copper alloy sheet which is composed of a copper alloy,
 18 mass % to 33 mass % of Zn;   0.2 mass % to 1.5 mass % of Sn;   1.5 mass % to 4 mass % of Ni;   0.003 mass % to 0.08 mass % of P; and   a balance consisting of Cu and unavoidable impurities,   wherein a Zn content [Zn] (mass %), a Sn content [Sn] (mass %), a Ni content [Ni] (mass %), and P content [P] (mass %) satisfy relationships of:
   15 ≤f 1=[Zn]+5×[Sn]−2×[Ni]≤30,
 
   12 ≤f 2=[Zn]−0.3×[Sn]−2×[Ni]≤28,
 
   10 ≤f 3={ f 1×(32 −f 1)×[Ni]} 1/2 ≤30,
 
   1.4≤0.7×[Ni]+[Sn]≤3.6,
 
   1.6≤[Ni]/[Sn]≤12, and
 
   25≤[Ni]/[P]≤750,
 
   conductivity is 14% IACS or more and 25% IACS or less, and   a metallographic structure is composed of an a single phase, and   the method comprising:   a casting process;   a pair of a cold rolling process and an annealing process;   a cold rolling process;   a recrystallization heat treatment process;   a finish cold rolling process; and   a recovery heat treatment process,   wherein a process of hot-rolling a copper alloy or a rolled material is not included,   either or both of a combination of the cold rolling process and the recrystallization heat treatment process and a combination of the finish cold rolling process and the recovery heat treatment process are carried out,   a cold working rate in the cold rolling process is 40% or more,   the recrystallization heat treatment process sequentially includes a heating step of heating the cold-rolled copper alloy material to a predetermined temperature using a continuous heat treatment furnace, a holding step of holding the copper alloy material at a predetermined temperature for a predetermined period of time after the heating step, and a cooling step of cooling the copper alloy material to a predetermined temperature after the holding step,   in the recrystallization heat treatment process, when a maximum reaching temperature of the copper alloy material is denoted by Tmax (° C.), and a heating and holding time in a temperature range of a temperature 50° C. lower than the maximum reaching temperature of the copper alloy material to the maximum reaching temperature is denoted by tm (min),
   540≤Tmax≤790,
 
   0.04≤tm≤1.0, and
 
   500 ≤It 1=( T max−30 ×tm   −1/2 )≤680,
 
   the recovery heat treatment process includes a heating step of heating the finish cold-rolled copper alloy material to a predetermined temperature, a holding step of holding the copper alloy material at a predetermined temperature for a predetermined period of time after the heating step, and a cooling step of cooling the copper alloy material to a predetermined temperature after the holding step, and when a maximum reaching temperature of the copper alloy material is denoted by Tmax2 (° C.), and a heating and holding time in a temperature range of a temperature 50° C. lower than the maximum reaching temperature of the copper alloy material to the maximum reaching temperature is denoted by tm2 (min),
   150≤Tmax2≤580,
 
   0.02≤tm2≤100, and
 
   120 ≤It 2=( T max2−25 ×tm 2 −1/2 )≤390.
 
   
     
     
         17 . A method of producing a copper alloy sheet which is composed of a copper alloy,
 the copper alloy consisting:   17 mass % to 34 mass % of Zn;   0.02 mass % to 2.0 mass % of Sn;   1.5 mass % to 5 mass % of Ni;   0.0005 mass % or more and 0.2 mass % or less in total of at least one or more selected from Fe, Co, Mg, Mn, Ti, Zr, Cr, Si and rare earth metal elements, each contained in an amount of 0.0005 mass % or more and 0.05 mass % or less; and   a balance consisting of Cu and unavoidable impurities,   wherein a Zn content [Zn] (mass %), a Sn content [Sn] (mass %), and a Ni content [Ni] (mass %) satisfy relationships of:
   12 ≤f 1=[Zn]+5×[Sn]−2×[Ni]≤30,
 
   10 ≤f 2=[Zn]−0.3×[Sn]−2×[Ni]≤28,
 
   10 ≤f 3={ f 1×(32 −f 1)×[Ni]} 1/2 ≤33,
 
   1.2≤0.7×[Ni]+[Sn]≤4, and
 
   1.4≤[Ni]/[Sn]≤90,
 
   conductivity is 13% IACS or more and 25% IACS or less, and   in a metallographic structure, a ratio of an α phase in a constituent phase of the metallographic structure is 99.5% or more by area ratio or an area ratio of a γ phase (γ) % and an area ratio of a β phase (β) % of an α phase matrix satisfy a relationship of 0≤2×(γ)+(β)≤0.7, and the γ phase having an area ratio of 0% to 0.3% and the β phase having an area ratio of 0% to 0.5% are dispersed in the α phase matrix, and   the method comprising:   a casting process;   a pair of a cold rolling process and an annealing process;   a cold rolling process;   a recrystallization heat treatment process;   a finish cold rolling process; and   a recovery heat treatment process,   wherein a process of hot-rolling a copper alloy or a rolled material is not included,   either or both of a combination of the cold rolling process and the recrystallization heat treatment process and a combination of the finish cold rolling process and the recovery heat treatment process are carried out,   a cold working rate in the cold rolling process is 40% or more,   the recrystallization heat treatment process sequentially includes a heating step of heating the cold-rolled copper alloy material to a predetermined temperature using a continuous heat treatment furnace, a holding step of holding the copper alloy material at a predetermined temperature for a predetermined period of time after the heating step, and a cooling step of cooling the copper alloy material to a predetermined temperature after the holding step,   in the recrystallization heat treatment process, when a maximum reaching temperature of the copper alloy material is denoted by Tmax (° C.), and a heating and holding time in a temperature range of a temperature 50° C. lower than the maximum reaching temperature of the copper alloy material to the maximum reaching temperature is denoted by tm (min),
   540≤Tmax≤790,
 
   0.04≤tm≤1.0, and
 
   500 ≤It 1=( T max−30 ×tm   −1/2 )≤680,
 
   the recovery heat treatment process includes a heating step of heating the finish cold-rolled copper alloy material to a predetermined temperature, a holding step of holding the copper alloy material at a predetermined temperature for a predetermined period of time after the heating step, and a cooling step of cooling the copper alloy material to a predetermined temperature after the holding step, and when a maximum reaching temperature of the copper alloy material is denoted by Tmax2 (° C.), and a heating and holding time in a temperature range of a temperature 50° C. lower than the maximum reaching temperature of the copper alloy material to the maximum reaching temperature is denoted by tm2 (min),
   150≤Tmax2≤580,
 
   0.02≤tm2≤100, and
 
   120 ≤It 2=( T max2−25 ×tm 2 −1/2 )≤390.
 
   
     
     
         18 . A method of producing a copper alloy sheet which is composed of a copper alloy,
 the copper alloy consisting:   17 mass % to 34 mass % of Zn;   0.02 mass % to 2.0 mass % of Sn;   1.5 mass % to 5 mass % of Ni;   at least one or more selected from 0.003 mass % to 0.09 mass % of P, 0.005 mass % to 0.5 mass % of Al, 0.01 mass % to 0.09 mass % of Sb, 0.01 mass % to 0.09 mass % of As, and 0.0005 mass % to 0.03 mass % of Pb;   0.0005 mass % or more and 0.2 mass % or less in total of at least one or more selected from Fe, Co, Mg, Mn, Ti, Zr, Cr, Si and rare earth metal elements, each contained in an amount of 0.0005 mass % or more and 0.05 mass % or less; and   a balance consisting of Cu and unavoidable impurities,   wherein a Zn content [Zn] (mass %), a Sn content [Sn] (mass %), and a Ni content [Ni] (mass %) satisfy relationships of:
   12 ≤f 1=[Zn]+5×[Sn]−2×[Ni]≤30,
 
   10 ≤f 2=[Zn]−0.3×[Sn]−2×[Ni]≤28,
 
   10 ≤f 3={ f 1×(32 −f 1)×[Ni]} 1/2 ≤33,
 
   1.2≤0.7×[Ni]+[Sn]≤4, and
 
   1.4[Ni]/[Sn]≤90,
 
   conductivity is 13% IACS or more and 25% IACS or less, and   in a metallographic structure, a ratio of an α phase in a constituent phase of the metallographic structure is 99.5% or more by area ratio or an area ratio of a γ phase (γ) % and an area ratio of a β phase (β) % of an α phase matrix satisfy a relationship of 0≤2×(γ)+(β)≤0.7, and the γ phase having an area ratio of 0% to 0.3% and the β phase having an area ratio of 0% to 0.5% are dispersed in the α phase matrix, and   the method comprising:   a casting process;   a pair of a cold rolling process and an annealing process;   a cold rolling process;   a recrystallization heat treatment process;   a finish cold rolling process; and   a recovery heat treatment process,   wherein a process of hot-rolling a copper alloy or a rolled material is not included,   either or both of a combination of the cold rolling process and the recrystallization heat treatment process and a combination of the finish cold rolling process and the recovery heat treatment process are carried out,   a cold working rate in the cold rolling process is 40% or more,   the recrystallization heat treatment process sequentially includes a heating step of heating the cold-rolled copper alloy material to a predetermined temperature using a continuous heat treatment furnace, a holding step of holding the copper alloy material at a predetermined temperature for a predetermined period of time after the heating step, and a cooling step of cooling the copper alloy material to a predetermined temperature after the holding step,   in the recrystallization heat treatment process, when a maximum reaching temperature of the copper alloy material is denoted by Tmax (° C.), and a heating and holding time in a temperature range of a temperature 50° C. lower than the maximum reaching temperature of the copper alloy material to the maximum reaching temperature is denoted by tm (min),
   540≤Tmax≤790,
 
   0.04≤tm≤1.0, and
 
   500 ≤It 1=( T max−30 ×tm   −1/2 )≤680,
 
   the recovery heat treatment process includes a heating step of heating the finish cold-rolled copper alloy material to a predetermined temperature, a holding step of holding the copper alloy material at a predetermined temperature for a predetermined period of time after the heating step, and a cooling step of cooling the copper alloy material to a predetermined temperature after the holding step, and when a maximum reaching temperature of the copper alloy material is denoted by Tmax2 (° C.), and a heating and holding time in a temperature range of a temperature 50° C. lower than the maximum reaching temperature of the copper alloy material to the maximum reaching temperature is denoted by tm2 (min),
   150≤Tmax2≤580,
 
   0.02≤tm2≤100, and
 
   120 ≤It 2=( T max2−25 ×tm 2 −1/2 )≤390.
 
   
     
     
         19 . A method of producing a copper alloy sheet which is composed of a copper alloy,
 the copper alloy consisting:   18 mass % to 33 mass % of Zn;   0.2 mass % to 1.5 mass % of Sn;   1.5 mass % to 4 mass % of Ni;   0.003 mass % to 0.08 mass % of P;   0.0005 mass % or more and 0.2 mass % or less in total of at least one or more selected from Fe, Co, Mg, Mn, Ti, Zr, Cr, Si and rare earth elements, each contained in an amount of 0.0005 mass % or more and 0.05 mass % or less; and   a balance consisting of Cu and unavoidable impurities,   wherein a Zn content [Zn] (mass %), a Sn content [Sn] (mass %), a Ni content [Ni] (mass %), and P content [P] (mass %) satisfy relationships of:
   15 ≤f 1=[Zn]+5×[Sn]−2×[Ni]≤30,
 
   12 ≤f 2=[Zn]−0.3×[Sn]−2×[Ni]≤28,
 
   10 ≤f 3={ f 1×(32 −f 1)×[Ni]} 1/2 ≤30,
 
   1.4≤0.7×[Ni]+[Sn]≤3.6,
 
   1.6≤[Ni]/[Sn]≤12, and
 
   25≤[Ni]/[P]≤750,
 
   conductivity is 14% IACS or more and 25% IACS or less, and   a metallographic structure is composed of an a single phase, and   the method comprising:   a casting process;   a pair of a cold rolling process and an annealing process;   a cold rolling process;   a recrystallization heat treatment process;   a finish cold rolling process; and   a recovery heat treatment process,   wherein a process of hot-rolling a copper alloy or a rolled material is not included,   either or both of a combination of the cold rolling process and the recrystallization heat treatment process and a combination of the finish cold rolling process and the recovery heat treatment process are carried out,   a cold working rate in the cold rolling process is 40% or more,   the recrystallization heat treatment process sequentially includes a heating step of heating the cold-rolled copper alloy material to a predetermined temperature using a continuous heat treatment furnace, a holding step of holding the copper alloy material at a predetermined temperature for a predetermined period of time after the heating step, and a cooling step of cooling the copper alloy material to a predetermined temperature after the holding step,   in the recrystallization heat treatment process, when a maximum reaching temperature of the copper alloy material is denoted by Tmax (° C.), and a heating and holding time in a temperature range of a temperature 50° C. lower than the maximum reaching temperature of the copper alloy material to the maximum reaching temperature is denoted by tm (min),
   540≤Tmax≤790,
 
   0.04≤tm≤1.0, and
 
   500 ≤It 1=( T max−30 ×tm   −1/2 )≤680,
 
   the recovery heat treatment process includes a heating step of heating the finish cold-rolled copper alloy material to a predetermined temperature, a holding step of holding the copper alloy material at a predetermined temperature for a predetermined period of time after the heating step, and a cooling step of cooling the copper alloy material to a predetermined temperature after the holding step, and when a maximum reaching temperature of the copper alloy material is denoted by Tmax2 (° C.), and a heating and holding time in a temperature range of a temperature 50° C. lower than the maximum reaching temperature of the copper alloy material to the maximum reaching temperature is denoted by tm2 (min),
   150≤Tmax2≤580,
 
   0.02≤tm2≤100, and
 
   120 ≤It 2=( T max2−25 ×tm 2 −1/2 )≤390.