Cleaning Systems and Methods for Semiconductor Substrate Storage Articles

Abstract

Provided are methods and systems for cleaning various semiconductor substrate storage articles, in particular, FOUP doors. The FOUP doors and other similar articles often have openings that may get contaminated with cleaning liquids if not covered. The described cleaning system includes contact points for engaging the article and covering these openings. The contact points may be also used for supporting the article and for pressurizing the openings in the article with a gas. The gas may be supplied through one or more contact points. It prevents liquids from getting into the openings if even the openings are not completely sealed. The pressurization may be maintained through the entire wet portion of the cleaning process. The article may be rotated within the cleaning system while cleaning and/or other liquids or gases are dispensed through a set of spraying nozzles. Spraying nozzles may move to enhance cleaning of the article.

What is claimed is: 
     
         1 . A method for cleaning an article, the method comprising
 protecting an opening of the article with a gas flow;   cleaning the article with a liquid.   
     
     
         2 . A method as in  claim 1  further comprising
 aligning the gas flow with the opening. 
 
     
     
         3 . A method as in  claim 1   wherein the opening comprises an object, wherein the object is configured to be slidable in the opening, or   wherein the opening comprises an object, wherein the object is positioned in the opening with a gap, wherein the length of the object is at least 10× greater than the gap   
     
     
         4 . A method as in  claim 1   wherein the opening comprises a cavity, wherein the cavity has an aperture at a surface of the article, wherein a dimension of the aperture is smaller than a dimension of the cavity, or   wherein the opening comprises a hole, wherein the hole has an aperture at a surface of the article, wherein the hole has a depth, wherein the ratio of the depth and a dimension of the aperture is higher than 20:1.   
     
     
         5 . A method as in  claim 1   wherein protecting the opening comprises supplying the gas flow into the opening, or   wherein protecting the opening comprises applying the gas flow toward the opening to minimizing liquid entering the opening, or   wherein protecting the opening comprises blocking the opening from being exposed to the liquid, or   wherein protecting the opening comprises pressurizing the opening with the gas flow, or   wherein protecting the opening comprises applying a contact point at the opening, and applying the gas flow to the contact point.   
     
     
         6 . A method as in  claim 1   wherein cleaning the article comprises flowing a liquid toward the article, or   wherein cleaning the article comprises submerging the article in a liquid.   
     
     
         7 . A method for cleaning a semiconductor container, the method comprising
 loading a container door to a cleaning chamber;   protecting a latch opening of the container door with a contact point, wherein the contact point is configured to channel a gas from a gas inlet to the latch opening;   flowing a liquid toward the container door while supplying a gas flow into the gas inlet of the contact point.   
     
     
         8 . A method as in  claim 7  wherein cleaning the container body comprises
 flowing a liquid toward the container body while protecting an opening of the container body with a gas flow. 
 
     
     
         9 . A method as in  claim 7  further comprising
 rotating the container door. 
 
     
     
         10 . A method as in  claim 7  further comprising
 aligning and engaging the contact point with the opening. 
 
     
     
         11 . A method as in  claim 7  further comprising
 draining the liquid from the cleaning chamber. 
 
     
     
         12 . A method as in  claim 7   wherein the latch opening comprises a latch element, wherein the latch element is configured to be slidable in the latch opening.   
     
     
         13 . A method as in  claim 7   wherein the latch opening comprises a latch element, wherein the latch element is positioned in the opening with a gap, wherein the length of the latch element is at least 10× greater than the gap.   
     
     
         14 . A method as in  claim 7   wherein the latch opening comprises a latch element, wherein the latch element is positioned in the opening with a gap, wherein the length of the latch element is at least 20× greater than the gap.   
     
     
         15 . A method as in  claim 7   wherein protecting the latch opening comprises sealing the latch opening with the contact point.   
     
     
         16 . A method as in  claim 7   wherein protecting the latch opening comprises applying the contact point near the latch opening without touching the container door.   
     
     
         17 . A method as in  claim 7   wherein protecting the opening comprises pressurizing the contact point with the gas flow.   
     
     
         18 . An apparatus for cleaning semiconductor containers, the apparatus comprising:
 a cleaning chamber;   a support structure, wherein the support structure is configured to support a container door, wherein the support structure is configured to be positioned within the cleaning chamber;   a contact point for protecting a latch opening of the container door, wherein the contact point is configured to engage with the latch opening, wherein the contact point comprise a gas channel configured to flow a gas to the latch opening;   a set of spraying nozzles for dispensing a cleaning liquid onto the container door.   
     
     
         19 . An apparatus as in  claim 18  wherein the support structure is further configured to support a container body, wherein the apparatus further comprises
 a second contact point for protecting an opening of the container body, wherein the second contact point is configured to engage with the opening of the container body, wherein the second contact point comprise a second gas channel configured to flow a gas to the opening of the container body; 
 a set of second spraying nozzles for dispensing a cleaning liquid onto the container body. 
 
     
     
         20 . An apparatus as in  claim 18   wherein the contact point is coupled to the support structure,   wherein the contact point comprises a gas inlet for accepting a gas to the gas channel,   wherein the gas inlet is coupled to a gas conduit, which is coupled to a gas source.