Vertical memory devices

Abstract

A vertical memory device includes a substrate, gate lines, channels, contacts and contact spacers. The gate lines are stacked on top of each other on the substrate. The gate lines are spaced apart from each other in a vertical direction with respect to a top surface of the substrate. The gate lines include step portions that extend in a parallel direction with respect to the top surface of the substrate. The channels extend through the gate lines in the vertical direction. The contacts are on the step portions of the gate lines. The contact spacers are selectively formed along sidewalls of a portion of the contacts.

1 . A vertical memory device, comprising:
 a substrate;   gate lines stacked on top of each other on the substrate, the gate lines being spaced apart from each other in a vertical direction with respect to a top surface of the substrate, the gate lines including step portions that extend in a parallel direction with respect to the top surface of the substrate,   the gate lines including first gate lines and second gate lines,   wherein the first gate lines are either on top of the second gate lines or the first gate lines are alternately stacked with the second gate lines;   channels extending through the gate lines in the vertical direction;   contacts on the step portions of the gate lines, the contacts including first contacts connected to the first gate lines and second contacts connected to the second gate lines; and   contact spacers formed along sidewalls of a portion of the first contacts,   the contact spacers not being formed along sidewalls of the second contacts.   
     
     
         2 . The vertical memory device of  claim 1 , wherein the contact spacers include one of silicon nitride and silicon oxynitride. 
     
     
         3 . The vertical memory device of  claim 2 , further comprising:
 a mold protection layer covering top and lateral surfaces of the step portions, wherein   the mold protection layer includes silicon oxide.   
     
     
         4 . The vertical memory device of  claim 3 , wherein
 the contact spacers surround the sidewalls of the first contacts,   the contact spacers extend through the mold protection layer,   the second contacts are in contact with the mold protection layer, and   the second contacts extend through the mold protection layer.   
     
     
         5 . The vertical memory device of  claim 1 , wherein
 the substrate includes a channel region, a first region, and a second region,   the channels are on the channel region,   the first region and the second region are sequentially positioned from the channel region in the parallel direction, and   the first contacts are on the step portions included in the first region and the second contacts are on the step portions included in the second region.   
     
     
         6 . (canceled) 
     
     
         7 . The vertical memory device of  claim 1 , wherein
 the first gate lines are on top of the second gate lines,   the first gate lines include a string selection lines (SSL) and upper word lines,   the second gate lines include a ground selection line (GSL) and lower word lines   the GSL, the lower word lines, the upper word lines, and the SSL are sequentially stacked from the top surface of the substrate, and   the first contacts are electrically connected to the SSL and the upper word lines.   
     
     
         8 . The vertical memory device of  claim 7 , wherein
 the second contacts are electrically connected to the lower word lines and the GSL.   
     
     
         9 . The vertical memory device of  claim 5 , wherein
 the first gate lines are on the second gate lines,   the substrate further includes a third region between the first region and the second region in the parallel direction,   the gate lines include third gate line between the first gate lines and the second gate lines, and   the contacts further include third contacts on the step portions of the third gate lines.   
     
     
         10 . The vertical memory device of  claim 1 , wherein
 the first gate lines are on the second gate lines,   the gate lines include third gate lines between the first gate lines and the second gate lines in the vertical direction,   the contact spacers further include second contact spacers along sidewalls of the third contacts.   
     
     
         11 . The vertical memory device of  claim 1 , further comprising:
 a peripheral circuit on a peripheral portion of the substrate;   a mold protection layer covering top and lateral surfaces of the step portions, and the peripheral circuit; and   a peripheral circuit contact extending through the mold protection layer to the peripheral circuit, wherein   the peripheral circuit contact is electrically connected to the peripheral circuit, and   the peripheral circuit contact is in contact with the mold protection layer.   
     
     
         12 . The vertical memory device of  claim 1 , wherein the contacts are arranged in a zigzag arrangement along the parallel direction. 
     
     
         13 . The vertical memory device of  claim 1 , wherein the first gate lines are alternately stacked with the second gate lines such that the contact spacers are formed along the sidewalls of the first gate contacts on the step portions of either odd levels or even levels of the gate lines. 
     
     
         14 . A vertical memory device, comprising:
 a substrate including a channel region, a contact region, and a peripheral circuit region;   a gate line structure on the substrate, the gate line structure including,
 gate lines on the channel region and the contact region, and stacked vertically from the substrate, the gate lines including step portions that extend to the contact region, 
 insulating interlayer patterns between the gate lines, and 
 channels extending vertically through the gate lines and the insulating interlayer patterns; 
   gate line contacts electrically connected to the gate lines on the contact region;   a peripheral circuit contact on the peripheral circuit region; and   contact spacers selectively formed along sidewalls of a portion of the gate line contacts, wherein   the contact spacers are not formed along a sidewall of the peripheral circuit contact.   
     
     
         15 . (canceled) 
     
     
         16 . A vertical memory device, comprising:
 a substrate;   vertical channel structures spaced apart from each other on the substrate,   gate lines surrounding the vertical channel structures,
 the gate lines being spaced apart from each other in a vertical direction, 
 the gate lines including step portions that extend different extension lengths in a horizontal direction from a same one of the vertical channel structures, 
 the extension lengths of the step portions increasing from top to bottom, 
 the gate lines including first gate lines and second gate lines, 
   wherein the first gate lines are either on top of the second gate lines or the first gate lines are alternately stacked with the second gate lines;   contacts that extend vertically and connect to corresponding ones of the step portions, the contacts including first contacts connected to the first gate lines and second contacts connected to the second gate lines; and   contact spacers surrounding one of the first contacts, the contact spacers not surrounding and the second contacts.   
     
     
         17 . The vertical memory device of  claim 16 , wherein
 the first gate lines are on top of second gate lines,   the first contacts are connected to the step portions of the first gate lines, and   the second contacts are connected to the step portions of the second gate lines.   
     
     
         18 . The vertical memory device of  claim 16 , wherein the contact spacers include one of silicon nitride and silicon oxynitride. 
     
     
         19 . The vertical memory device of  claim 16 , further comprising:
 a mold protection layer on the step portions, wherein   the mold protection layer and the contact spacers are formed of different insulating materials.   
     
     
         20 . The vertical memory device of  claim 19 , further comprising:
 a peripheral circuit on the substrate; and   at least one peripheral circuit contact that extends through the mold protection layer and connects to the peripheral circuit, wherein   the peripheral circuit is spaced apart from the gate lines.   
     
     
         21 . The vertical memory device of  claim 1 , further comprising:
 a peripheral circuit contact on a peripheral portion of the substrate, wherein   the contact spacers are not formed along a sidewall of the peripheral circuit contact.   
     
     
         22 . The vertical memory device of  claim 14 , wherein
 the gate lines include first gate lines and second gate lines,   the first gate lines are either on top of the second gate lines or the first gate lines are alternately stacked with the second gate lines,   the insulating interlayer patterns are between the first gate lines and second gate lines,   the gate line contacts include first gate line contacts connected to the first gate lines and second gate line contacts connected to the second gate lines on the contact region, and   the contact spacers surround the first gate line contacts but not the second gate line contacts.