Wafer prober integrated with full-wafer contactor

Abstract

Methods and apparatus for testing unsingulated integrated circuits on a wafer include adapting a wafer prober for use with a full-wafer contactor disposed on the wafer. Some embodiments include placing a wafer on a chuck of the prober, aligning the wafer to a full-wafer contactor incorporated in the wafer prober, removably attaching the wafer to the full wafer contactor, separating the wafer from the chuck, and making electrical contact to one or more integrated circuits of the wafer by making physical contact with a surface of the full-wafer contactor that faces away from the wafer.

1 . (canceled) 
     
     
         2 . An apparatus for coupling a plurality of electrical pathways to a wafer, comprising:
 a wafer translator having a wafer-side positioned to face a wafer and an inquiry-side facing away from the wafer-side, wherein the wafer translator has a first plurality of first scale contact pads at the wafer-side corresponding to contacts on the wafer, and a second plurality of second scale contact pads at the inquiry-side corresponding to contacts of a probe card, wherein the first scale is generally smaller than the second scale, wherein the wafer translator is monolithic between the wafer-side and the inquiry-side, and wherein the wafer translator is mechanically coupled to a mounting fixture; and   a gasket positioned to seal a space between the wafer translator and the wafer using a vacuum.   
     
     
         3 . The apparatus of  claim 2 , further comprising the wafer in contact with the wafer-side of the translator. 
     
     
         4 . The apparatus of  claim 3 , wherein the wafer translator is more rigid than the wafer. 
     
     
         5 . The apparatus of  claim 3 , wherein the wafer is at least partially conformed to the wafer translator. 
     
     
         6 . The apparatus of  claim 2 , further comprising the mounting fixture removably attached to a top plate attachment. 
     
     
         7 . The apparatus of  claim 2 , wherein the wafer translator is an edge extended wafer translator extending outside of a circumferential edge of the wafer. 
     
     
         8 . The apparatus of  claim 2 , wherein the wafer translator is laterally continuous between the wafer-side and the inquiry-side. 
     
     
         9 . An apparatus for coupling a plurality of electrical pathways to a wafer, comprising:
 a wafer translator having a wafer-side positioned to face a wafer and an inquiry-side facing away from the wafer-side, wherein the wafer translator has a first plurality of first scale contact pads at the wafer-side corresponding to contacts on the wafer, and a second plurality of second scale contact pads at the inquiry-side corresponding to contacts at a probe card, wherein the first scale is generally smaller than the second scale, wherein the wafer translator is rigid between the wafer-side and the inquiry-side, and wherein the wafer translator is mechanically coupled to a mounting fixture; and   a gasket positioned to seal a space between the wafer translator and the wafer.   
     
     
         10 . The apparatus of  claim 9 , further comprising the mounting fixture removably attached to a top plate attachment. 
     
     
         11 . The apparatus of  claim 9 , further comprising a source of vacuum in fluidic communication with the space between the wafer translator and the wafer. 
     
     
         12 . The apparatus of  claim 9 , further comprising the wafer in contact with the wafer-side of the translator, wherein the wafer translator is more rigid than the wafer. 
     
     
         13 . The apparatus of  claim 12 , wherein the wafer is at least partially conformed to the wafer translator. 
     
     
         14 . The apparatus of  claim 9 , wherein the wafer translator is laterally continuous between the wafer-side and the inquiry-side.