US2017290215A1PendingUtilityA1

Electronic Assemblies without Solder and Methods for their manufacture

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Assignee: FJELSTAD JOSEPH CPriority: Aug 28, 2007Filed: Jun 11, 2017Published: Oct 5, 2017
Est. expiryAug 28, 2027(~1.1 yrs left)· nominal 20-yr term from priority
Inventors:Joseph Fjelstad
H10W 74/019H10W 72/9413H10W 72/0198H10W 72/073H10W 70/093H05K 1/056Y10T29/49146H01L 2924/14Y10T29/49124H05K 2203/1469H05K 3/4644H05K 1/185H05K 2203/0156H05K 2201/0969H05K 2201/2018H05K 3/284
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Claims

Abstract

A frame 100 containing aperture(s) 102, 103, 104 is positioned on and joined to a permanent substrate 206 a or temporary substrate 206 b . Electrical component(s) 202, 203, 204 are placed into respective aperture(s) 102, 103, 104 with the leads 504, 1002 of the component(s) 202, 203, 204 positioned on and attached to the permanent substrate 206 a or the temporary substrate 206 b . Then an encapsulant 402 , electrically insulating, but preferably thermally conductive, envelops the component(s) 102, 103, 104 . At this point, temporary substrate 206 b may be removed exposing component leads 1002 . Or, if component(s) 102, 103, 104 are mounted on permanent substrate 206 a , vias 502 extend from the surface of substrate 206 a to leads 504 . With leads 504, 1002 exposed, the completed subassembly 500, 1000 may be incorporated into various forms of reverse-interconnection process (RIP) assemblies as detailed in related applications.

Claims

exact text as granted — not AI-modified
I claim: 
     
         1 . A circuit subassembly comprising:
 a frame containing an aperture;   a component, with one or more leads inserted into the aperture, the one or more leads electrically accessible; and   an electrically insulating material attaching the component with the frame.   
     
     
         2 . The subassembly of  claim 1  wherein the subassembly is incorporated into a RIP assembly. 
     
     
         3 . The subassembly of  claim 1  wherein one or more of the leads are in electrical communication with electrically conductive material. 
     
     
         4 . The subassembly of  claim 1  wherein the subassembly is mounted on a foil base so that one or more of the leads are in electrical communication with the foil base. 
     
     
         5 . The subassembly of  claim 1  wherein one or more of the leads are in electrical communication with a central bonding material, the central bonding material in electrical communication with a printed circuit board. 
     
     
         6 . The subassembly of  claim 1  wherein the component is tested and burned in. 
     
     
         7 . The subassembly of  claim 1  wherein the frame comprises material selected from the group comprising electrically conductive material, unclad metal, clad metal, substantially electrically insulated metal, and electrically insulating material. 
     
     
         8 . A circuit subassembly comprising:
 a frame containing an aperture;   a substrate joined to the frame, the substrate having one or more vias extending through the substrate;   a component, with one or more leads inserted into the aperture, positioned so that the one or more vias expose one or more of the leads; and   an electrically insulating material enveloping the component.   
     
     
         9 . The subassembly of  claim 8  wherein the subassembly is incorporated into a RIP assembly. 
     
     
         10 . The subassembly of  claim 8  further comprising one or more of the vias filled with an electrically conductive material electrically connecting with the first set of one or more leads. 
     
     
         11 . The subassembly of  claim 8  wherein the frame is separated from the substrate, leaving the component attached to the substrate, and wherein the substrate is flexible. 
     
     
         12 . The subassembly of  claim 8  wherein the subassembly is mounted on a foil base so that one or more of the leads are in electrical communication with the foil base. 
     
     
         13 . The subassembly of  claim 8  wherein one or more of the leads are in electrical communication with a central bonding material, the central bonding material in electrical communication with a printed circuit board. 
     
     
         14 . The subassembly of  claim 8  wherein the component is tested and burned in. 
     
     
         15 . The subassembly of  claim 8  wherein the frame comprises material selected from the group comprising electrically conductive material, unclad metal, clad metal, substantially electrically insulated metal, and electrically insulating material. 
     
     
         16 . A circuit subassembly comprising:
 a frame containing an aperture;   a substrate joined to the frame, the substrate having one or more vias extending through the substrate;   a component, with one or more leads, inserted into the aperture so that the one or more vias expose one or more of the leads; and   an electrically insulating material in contact with one or more sides of the component.   
     
     
         17 . The subassembly of  claim 16  wherein the subassembly is incorporated into a RIP assembly. 
     
     
         18 . The subassembly of  claim 16  further comprising one or more of the vias filled with an electrically conductive material electrically connecting with the first set of one or more leads. 
     
     
         19 . The subassembly of  claim 16  wherein the frame is separated from the substrate, leaving the component attached to the substrate, and wherein the substrate is flexible. 
     
     
         20 . The subassembly of  claim 16  wherein the subassembly is mounted on a foil base so that one or more of the leads are in electrical communication with the foil base. 
     
     
         21 . The subassembly of  claim 16  wherein one or more of the leads are in electrical communication with a central bonding material, the central bonding material in electrical communication with a printed circuit board. 
     
     
         22 . The subassembly of  claim 16  wherein the component is tested and burned in. 
     
     
         23 . The subassembly of  claim 16  wherein the frame comprises material selected from the group comprising electrically conductive material, unclad metal, clad metal, substantially electrically insulated metal, and electrically insulating material. 
     
     
         24 . A method of making a circuit subassembly comprising:
 joining a first planar side of a frame, the frame having a first planar side and a second planar side and the frame having one or more apertures extending from the first planar side to a second planar side, with a first planar side of a substrate, the substrate having a first planar side and a second planar side, so that the apertures expose portions of the first planar side of the substrate;   placing a component on the substrate so that the component is contained within one of the apertures;   incorporating a first electrically insulating material, the first electrically insulating material adhering to one or more sides of the component; and   forming a first set of at least one via through the second planar side of substrate to expose a first set of at least one lead of the component.   
     
     
         25 . The method of  claim 24  further comprising filling the first set of at least one via with a first electrically conductive material. 
     
     
         26 . The method of  claim 25  wherein the first electrically conductive material forms a second set of at least one lead. 
     
     
         27 . The method of  claim 26  further comprising:
 forming a first layer of a second electrically insulating material on the substrate wherein the second insulating material covers the first electrically conductive material. 
 
     
     
         28 . The method of  claim 27  further comprising:
 forming a second set of at least one via extending through the layer exposing a second set of at least one lead. 
 
     
     
         29 . The method of  claim 28  further comprising:
 filling the second set of at least one via with a second electrically conductive material. 
 
     
     
         30 . A product manufactured by the process of  claim 24 . 
     
     
         31 . A product manufactured by the process of  claim 29 . 
     
     
         32 . A method of making a circuit assembly comprising:
 joining a first planar side of a frame, the frame having a first planar side and a second planar side and the frame having one or more apertures extending from the first planar side to a second planar side, with a first planar side of a substrate, the substrate having a first planar side and a second planar side, so that the apertures expose portions of the first planar side of the substrate;   placing a component on the substrate so that the component is contained within one of the apertures;   incorporating a first electrically insulating material, the first electrically insulating material adhering to one or more sides of the component; and   removing the substrate to expose a first set of at least one lead of the component.   
     
     
         33 . A product manufactured by the process of  claim 32 .

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