US2017294577A1PendingUtilityA1

Magnetic sensor and method of manufacturing the same

47
Assignee: SII SEMICONDUCTOR CORPPriority: Feb 26, 2015Filed: Jun 22, 2017Published: Oct 12, 2017
Est. expiryFeb 26, 2035(~8.6 yrs left)· nominal 20-yr term from priority
H10W 78/00H10W 70/695H10W 70/692H10W 70/68H01L 43/04H01L 43/065H01L 43/14G01R 33/07G01R 33/0052H10N 52/01H10N 52/80H10N 52/101G01R 33/077H02K 11/215H03K 17/9517G01R 33/072G01R 21/08G01R 33/0206H04Q 2213/307G01R 33/0005H03K 19/18G01R 15/207G01D 5/145G01R 15/202
47
PatentIndex Score
0
Cited by
0
References
0
Claims

Abstract

Provided are a magnetic sensor and a method of manufacturing the same. In the magnetic sensor and the method of manufacturing the same, a magnetic converging plate holder with a recessed pattern having the same shape and size as those of a magnetic converging plate is formed in a die pad of a package on which a semiconductor substrate having Hall elements, a circuit, and the like is to be arranged, the magnetic converging plate manufactured through processes different from those of the semiconductor substrate on which the Hall elements and the circuit are formed is inserted into the magnetic converging plate holder, and the semiconductor substrate having the Hall elements, the circuit, and the like is arranged on the resultant so that a back surface thereof faces the die pad and the magnetic converging plate.

Claims

exact text as granted — not AI-modified
What is claimed is: 
     
         1 . A method of manufacturing a magnetic sensor having a magnetic converging plate, the method comprising:
 preparing a semiconductor substrate having a surface on which Hall elements are formed;   forming the magnetic converging plate, and then performing high-temperature annealing to the magnetic converging plate;   forming a die pad having a magnetic converging plate holder having a recessed shape;   accommodating the magnetic converging plate in the magnetic converging plate holder; and   bonding a back surface of the semiconductor substrate to a surface of the die pad and a surface of the magnetic converging plate.   
     
     
         2 . A method of manufacturing a magnetic sensor according to  claim 1 , wherein the high-temperature annealing is performed at a process temperature of from 800° C. to 1,200° C. 
     
     
         3 . A method of manufacturing a magnetic sensor according to  claim 1 , wherein the magnetic converging plate subjected to the high-temperature annealing has, at at least one point of an outer periphery of the magnetic converging plate, one of a recessed portion and a protruded portion for magnetic converging plate rotation direction position adjustment, and is formed into a shape that includes one of a circular shape and a square shape and has a four-fold rotational axis in a plan view except for the one of the recessed portion and the protruded portion for magnetic converging plate rotation direction position adjustment. 
     
     
         4 . A method of manufacturing a magnetic sensor according to  claim 1 , wherein the magnetic converging plate subjected to the high-temperature annealing is formed into the same planar shape as a planar shape of the magnetic converging plate holder. 
     
     
         5 . A method of manufacturing a magnetic sensor according to  claim 1 , wherein the magnetic converging plate subjected to the high-temperature annealing is formed into the same cross-sectional shape as a cross-sectional shape of the magnetic converging plate holder.

Cited by (0)

No later patents cite this yet.

References (0)

No backward citations on record.