Inventor · disambiguated record
Takaaki Hioka
Also filed as: HIOKA TAKAAKI
23 granted patents·5 pending applications·32 citations·filing 2011–2022
91Inventor score
Top patents by PatentIndex Score
28 records- 0190US9945912B2Hall sensor and compensation method for offset caused by temperature distribution in hall sensorSEIKO INSTR INC·Filed 2015·Granted Apr 17, 2018·5 cites·7 claims
- 0288US8466526B2Hall sensor for eliminating offset voltageHIOKA TAKAAKI·Filed 2011·Granted Jun 18, 2013·10 cites·20 claims
- 0385US10429453B2Magnetic sensor and method of manufacturing the sameSII SEMICONDUCTOR CORP·Filed 2017·Granted Oct 1, 2019·3 cites·6 claims
- 0484US9599682B2Vertical hall elementSEIKO INSTR INC·Filed 2015·Granted Mar 21, 2017·3 cites·18 claims
- 0580US8427140B2Hall sensorHIOKA TAKAAKI·Filed 2011·Granted Apr 23, 2013·5 cites·7 claims
- 0678US10290677B2Semiconductor device having hall elements formed in a semiconductor substrate and a magnetic body flux concentratorSII SEMICONDUTOR CORP·Filed 2017·Granted May 14, 2019·3 cites·5 claims
- 0774US11099244B2Semiconductor deviceABLIC INC·Filed 2019·Granted Aug 24, 2021·1 cites·2 claims
- 0869US9523745B2Magnetic sensor and method of manufacturing the sameSII SEMICONDUCTOR CORP·Filed 2016·Granted Dec 20, 2016·1 cites·8 claims
- 0965US9741924B2Magnetic sensor having a recessed die padSII SEMICONDUCTOR CORP·Filed 2016·Granted Aug 22, 2017·1 cites·5 claims
- 1055US12156480B2Semiconductor device and manufacturing method thereofABLIC INC·Filed 2022·Granted Nov 26, 2024·0 cites·5 claims
- 1154US11016151B2Semiconductor device and method of adjusting the sameABLIC INC·Filed 2019·Granted May 25, 2021·0 cites·17 claims
- 1253US11069851B2Semiconductor device having a vertical hall element with a buried layerABLIC INC·Filed 2019·Granted Jul 20, 2021·0 cites·8 claims
- 1353US10062836B2Magnetic sensor and method of manufacturing the sameSII SEMICONDUCTOR CORP·Filed 2017·Granted Aug 28, 2018·0 cites·6 claims
- 1452US11536783B2Semiconductor deviceABLIC INC·Filed 2020·Granted Dec 27, 2022·0 cites·18 claims
- 1548US10060991B2Semiconductor deviceSII SEMICONDUCTOR CORP·Filed 2017·Granted Aug 28, 2018·0 cites·11 claims
- 1647US10615333B2Semiconductor deviceABLIC INC·Filed 2018·Granted Apr 7, 2020·0 cites·9 claims
- 1747US10504957B2Semiconductor device with hall elements and magnetic flux concentratorSII SEMICONDUCTOR CORP·Filed 2017·Granted Dec 10, 2019·0 cites·14 claims
- 1847US10236440B2Semiconductor deviceABLIC INC·Filed 2018·Granted Mar 19, 2019·0 cites·11 claims
- 1947US2017294577A1Magnetic sensor and method of manufacturing the sameSII SEMICONDUCTOR CORP·Filed 2017·Application pending·0 cites
- 2045US10847710B2Semiconductor deviceABLIC INC·Filed 2019·Granted Nov 24, 2020·0 cites·10 claims
- 2145US9841471B2Hall elementSEIKO INSTR INC·Filed 2016·Granted Dec 12, 2017·0 cites·11 claims
- 2244US10263176B2Semiconductor device having vertical hall elementSII SEMICONDUCTOR CORP·Filed 2017·Granted Apr 16, 2019·0 cites·20 claims
- 2344US2019355899A1Semiconductor deviceABLIC INC·Filed 2019·Application pending·0 cites
- 2444US2020333820A1Constant current circuit and semiconductor deviceABLIC INC·Filed 2020·Application pending·0 cites
- 2542US2018315919A1Semiconductor deviceABLIC INC·Filed 2018·Application pending·0 cites
- 2641US10971678B2Semiconductor deviceABLIC INC·Filed 2019·Granted Apr 6, 2021·0 cites·10 claims
- 2741US10263177B2Semiconductor deviceSII SEMICONDUCTOR CORP·Filed 2017·Granted Apr 16, 2019·0 cites·18 claims
- 2838US2017199252A1Hall sensorSII SEMICONDUCTOR CORP·Filed 2017·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Takaaki Hioka files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →