Semiconductor Assembly and Method of Fabricating a Semiconductor Structure

Abstract

A semiconductor structure and a method of fabricating the same. The semiconductor structure comprises: a layer element, one or more supporting elements disposed on a first surface of the layer element, and one or more anchoring elements disposed within the layer element and connected to the one or more supporting elements to couple the one or more supporting elements to the layer element to strengthen the layer element.

1 . A semiconductor assembly formed during the construction of a semiconductor structure, comprising:
 a magnetic carrier;   a layer element on the magnetic carrier, wherein the layer element is part of or whole of a substrate; and,   two or more anchoring elements disposed within the layer element and connected to the carrier to couple the carrier to the layer element to strengthen the layer element,   wherein each of the two or more anchoring elements comprises at least an upper section and a lower section,   wherein, relative to the lower section, the upper section has a larger cross-sectional area in a plane parallel to the first surface of the layer element, the upper section being connected to the carrier, and   wherein the magnetic carrier can be magnetically secured in place for the processing of the layer element.   
     
     
         2 . The semiconductor assembly as claimed in  claim 1 , wherein the layer element comprises two or more discrete sections on the magnetic carrier. 
     
     
         3 . The semiconductor assembly as claimed in  claim 1 , wherein the upper sections of the two or more anchoring elements are connected in blocks to increase coupling to the carrier. 
     
     
         4 . The semiconductor assembly as claimed in  claim 1 , further comprising:
 a further layer element; and   one or more further anchoring elements disposed within the further layer element and connected to the two or more anchoring elements of the layer element to strengthen both the layer element and the further layer element,   wherein the magnetic carrier can be magnetically secured in place for the processing of the further layer element.   
     
     
         5 . A semiconductor assembly formed during the construction of a semiconductor structure, comprising:
 a magnetic carrier;   a plurality of layer elements on the magnetic carrier; and,   a plurality of anchoring elements disposed within each of the layer element,   wherein the anchoring elements in one layer element are connected to the anchoring elements in next layer element and further connected to the carrier to couple the carrier to the plurality of layer elements to strengthen the plurality of layer elements, and   wherein the magnetic carrier can be magnetically secured in place for the processing of each of the layer element.   
     
     
         6 . A method of fabricating a semiconductor structure, the method comprising:
 providing a magnetic carrier;   forming two or more anchoring elements over the magnetic carrier such that each of the two or more anchoring elements comprises an upper section and a lower section, and such that, relative to the lower section, the upper section has a larger cross-sectional area in a plane parallel to the first surface of the layer element;   encapsulating the two or more anchoring elements within a layer element; and   holding the magnetic carrier in place by magnetically securing the magnetic carrier for the processing of the layer element.   
     
     
         7 . The method as claimed in  claim 6 , further comprising:
 removing the magnetic carrier from the layer element.   
     
     
         8 . The method as claimed in  claim 6 , further comprising:
 forming one or more further anchoring elements on the layer element;   encapsulating the one or more anchoring elements within a further layer element;   holding the assembly in place by magnetically securing the magnetic carrier; and   processing the further layer element.   
     
     
         9 . The method as claimed in  claim 8 , further comprising:
 removing the magnetic carrier from the layer element.