Assignee
ADVANPACK SOLUTIONS PTE LTD
SG·30 granted patents·21 pending applications·1,720 citations·filing 2000–2018
Top patents by PatentIndex Score
51 records- 0198US6578754B1Pillar connections for semiconductor chips and method of manufactureADVANPACK SOLUTIONS PTE LTD·Filed 2000·Granted Jun 17, 2003·546 cites·9 claims
- 0296US6592019B2Pillar connections for semiconductor chips and method of manufactureADVANPACK SOLUTIONS PTE LTD·Filed 2001·Granted Jul 15, 2003·216 cites·9 claims
- 0396US6550666B2Method for forming a flip chip on leadframe semiconductor packageADVANPACK SOLUTIONS PTE LTD·Filed 2001·Granted Apr 22, 2003·250 cites·23 claims
- 0495US9653323B2Manufacturing method of substrate structure having embedded interconnection layersADVANPACK SOLUTIONS PTE LTD·Filed 2016·Granted May 16, 2017·12 cites·14 claims
- 0593US7456496B2Package design and method of manufacture for chip grid arrayADVANPACK SOLUTIONS PTE LTD·Filed 2005·Granted Nov 25, 2008·48 cites·16 claims
- 0692US6732913B2Method for forming a wafer level chip scale package, and package formed therebyADVANPACK SOLUTIONS PTE LTD·Filed 2002·Granted May 11, 2004·90 cites·40 claims
- 0792US6510976B2Method for forming a flip chip semiconductor packageADVANPACK SOLUTIONS PTE LTD·Filed 2001·Granted Jan 28, 2003·75 cites·41 claims
- 0889US7462942B2Die pillar structures and a method of their formationADVANPACK SOLUTIONS PTE LTD·Filed 2003·Granted Dec 9, 2008·149 cites·59 claims
- 0986US7087458B2Method for fabricating a flip chip package with pillar bump and no flow underfillADVANPACK SOLUTIONS PTE LTD·Filed 2002·Granted Aug 8, 2006·91 cites·13 claims
- 1085US7795071B2Semiconductor package for fine pitch miniaturization and manufacturing method thereofADVANPACK SOLUTIONS PTE LTD·Filed 2007·Granted Sep 14, 2010·33 cites·4 claims
- 1185US6750082B2Method of assembling a package with an exposed die backside with and without a heatsink for flip-chipADVANPACK SOLUTIONS PTE LTD·Filed 2002·Granted Jun 15, 2004·45 cites·58 claims
- 1285US6467676B1Fluxing adhesiveADVANPACK SOLUTIONS PTE LTD·Filed 2000·Granted Oct 22, 2002·45 cites·17 claims
- 1380US9892916B2Manufacturing method of package substrate and package manufacturing method of semiconductor deviceADVANPACK SOLUTIONS PTE LTD·Filed 2016·Granted Feb 13, 2018·3 cites·14 claims
- 1478US6929981B2Package design and method of manufacture for chip grid arrayADVANPACK SOLUTIONS PTE LTD·Filed 2002·Granted Aug 16, 2005·26 cites·10 claims
- 1577US6734039B2Semiconductor chip grid array package design and method of manufactureADVANPACK SOLUTIONS PTE LTD·Filed 2002·Granted May 11, 2004·28 cites·19 claims
- 1675US9219027B2Semiconductor device carrier and semiconductor package using the sameADVANPACK SOLUTIONS PTE LTD·Filed 2014·Granted Dec 22, 2015·3 cites·21 claims
- 1772US9301391B2Substrate structure, semiconductor package device, and manufacturing method of substrate structureADVANPACK SOLUTIONS PTE LTD·Filed 2012·Granted Mar 29, 2016·2 cites·15 claims
- 1872US6365435B1Method for producing a flip chip packageADVANPACK SOLUTIONS PTE LTD·Filed 2001·Granted Apr 2, 2002·24 cites·30 claims
- 1969US9379044B2Package carrier, package carrier manufacturing method, package structure for semiconductor device and manufacturing method thereofADVANPACK SOLUTIONS PTE LTD·Filed 2012·Granted Jun 28, 2016·2 cites·19 claims
- 2068US6599775B2Method for forming a flip chip semiconductor package, a semiconductor package formed thereby, and a substrate thereforADVANPACK SOLUTIONS PTE LTD·Filed 2001·Granted Jul 29, 2003·30 cites·34 claims
- 2166US9362206B2Chip and manufacturing method thereofADVANPACK SOLUTIONS PTE LTD·Filed 2014·Granted Jun 7, 2016·1 cites·25 claims
- 2263US10049950B2Multi-layer substrate for semiconductor packagingADVANPACK SOLUTIONS PTE LTD·Filed 2013·Granted Aug 14, 2018·1 cites·23 claims
- 2355US10446457B2Multi-layer substrate for semiconductor packagingADVANPACK SOLUTIONS PTE LTD·Filed 2018·Granted Oct 15, 2019·0 cites·6 claims
- 2454US9754899B2Semiconductor structure and method of fabricating the sameADVANPACK SOLUTIONS PTE LTD·Filed 2014·Granted Sep 5, 2017·0 cites·23 claims
- 2553US9305868B2Manufacturing method of forming an etch-back type semiconductor package with locking anchoragesADVANPACK SOLUTIONS PTE LTD·Filed 2014·Granted Apr 5, 2016·0 cites·22 claims
- 2652US10763133B2Semiconductor structure and semiconductor package device using the sameADVANPACK SOLUTIONS PTE LTD·Filed 2018·Granted Sep 1, 2020·0 cites·10 claims
- 2751US9723717B2Substrate structure, semiconductor package device, and manufacturing method of semiconductor packageADVANPACK SOLUTIONS PTE LTD·Filed 2012·Granted Aug 1, 2017·0 cites·8 claims
- 2851US9583449B2Semiconductor packageADVANPACK SOLUTIONS PTE LTD·Filed 2015·Granted Feb 28, 2017·0 cites·13 claims
- 2951US2016268225A1Chip and manufacturing method thereofADVANPACK SOLUTIONS PTE LTD·Filed 2016·Application pending·0 cites
- 3050US10154588B2Manufacturing method of semiconductor packageADVANPACK SOLUTIONS PTE LTD·Filed 2017·Granted Dec 11, 2018·0 cites·16 claims
- 3149US2016329306A1Semiconductor package and manufacturing method thereofADVANPACK SOLUTIONS PTE LTD·Filed 2016·Application pending·0 cites
- 3248US2018108584A1Semiconductor SubstrateADVANPACK SOLUTIONS PTE LTD·Filed 2017·Application pending·0 cites
- 3348US2017330842A1Semiconductor Assembly and Method of Fabricating a Semiconductor StructureADVANPACK SOLUTIONS PTE LTD·Filed 2017·Application pending·0 cites
- 3446US9059050B2Manufacturing methods of semiconductor substrate, package and deviceADVANPACK SOLUTIONS PTE LTD·Filed 2014·Granted Jun 16, 2015·0 cites·30 claims
- 3543US2015287673A1Semiconductor packageADVANPACK SOLUTIONS PTE LTD·Filed 2015·Application pending·0 cites
- 3643US2006180888A1Optical sensor package and method of manufactureADVANPACK SOLUTIONS PTE LTD·Filed 2005·Application pending·0 cites
- 3739US2004198022A1Method for forming a wafer level chip scale package, and package formed therebyADVANPACK SOLUTIONS PTE LTD·Filed 2004·Application pending·0 cites
- 3839US2007284420A1Integrated circuit chip formed on substrateADVANPACK SOLUTIONS PTE LTD·Filed 2006·Application pending·0 cites
- 3939US2008248610A1Thermal bonding process for chip packagingADVANPACK SOLUTIONS PTE LTD·Filed 2007·Application pending·0 cites
- 4038US2006060937A1Embedded passive componentADVANPACK SOLUTIONS PTE LTD·Filed 2004·Application pending·0 cites
- 4138US2007196979A1Flip chip in package using flexible and removable leadframeADVANPACK SOLUTIONS PTE LTD·Filed 2006·Application pending·0 cites
- 4238US2005133933A1Various structure/height bumps for wafer level-chip scale packageADVANPACK SOLUTIONS PTE LTD·Filed 2003·Application pending·0 cites
- 4336US2006103016A1Heat sinking structureADVANPACK SOLUTIONS PTE LTD·Filed 2004·Application pending·0 cites
- 4436US2006097346A1Structure for high quality factor inductor operationADVANPACK SOLUTIONS PTE LTD·Filed 2004·Application pending·0 cites
- 4535US2005167797A1Structure packageADVANPACK SOLUTIONS PTE LTD·Filed 2004·Application pending·0 cites
- 4635US2005087883A1Flip chip package using no-flow underfill and method of fabricationADVANPACK SOLUTIONS PTE LTD·Filed 2003·Application pending·0 cites
- 4735US2004130034A1Method for forming a wafer level chip scale packageADVANPACK SOLUTIONS PTE LTD·Filed 2002·Application pending·0 cites
- 4834US2004108580A1Leadless semiconductor packaging structure with inverted flip chip and methods of manufactureADVANPACK SOLUTIONS PTE LTD·Filed 2002·Application pending·0 cites
- 4934US2004084508A1Method for constraining the spread of solder during reflow for preplated high wettability lead frame flip chip assemblyADVANPACK SOLUTIONS PTE LTD·Filed 2002·Application pending·0 cites
- 5024US2008150561A1Device and method for testing semiconductor element, and manufacturing method thereofADVANPACK SOLUTIONS PTE LTD·Filed 2007·Application pending·0 cites
Showing the top 50 of 51 patent records by PatentIndex Score.
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