Wet processing system and method of operating

Abstract

An electrochemical deposition system having two or more electrochemical deposition modules arranged on a common platform and configured for depositing one or more metals on a substrate is described. Each electrochemical deposition module includes an anode compartment configured to contain a volume of anolyte fluid, a cathode compartment configured to contain a volume of catholyte fluid, and a membrane separating the anode compartment from the cathode compartment. Each electrochemical deposition module further includes a workpiece holder configured to hold opposing edges of a flexible workpiece between first and second leg members via a clamping mechanism, and a loader module configured to position the flexible workpiece in the workpiece holder while holding the flexible workpiece using an air cushion on each opposing planar surface of the flexible workpiece.

1 . An electrochemical deposition system comprising:
 two or more electrochemical deposition modules arranged on a common platform and configured for depositing one or more metals on a substrate, each electrochemical deposition module comprising:
 an anode compartment configured to contain a volume of anolyte fluid; 
 a cathode compartment configured to contain a volume of catholyte fluid; and 
   a loading port configured to receive a set of flexible workpieces;   a loader module configured to receive a flexible workpiece from the loading port and position the flexible workpiece in a workpiece holder while holding the flexible workpiece using an air cushion on each opposing planar surface of the flexible workpiece;   the workpiece holder having a header member separating first and second leg members, the workpiece holder configured to hold opposing edges of the flexible workpiece between the first and second leg members via a clamping mechanism that applies electrical contacts to the opposing planar surfaces of the flexible workpiece with the electrical contacts surrounded by an elastomeric seal to the flexible workpiece when held by the workpiece holder, the holder being configured to expose both sides of the workpiece to plating solution;   a transportation mechanism configured to transport flexible workpieces, via workpiece holders, from the loader module to a given electrochemical deposition module and lower a given workpiece into the given electrochemical deposition module;   an electrical system configured to apply an electrical current to each opposing planar surface of the flexible workpiece when held within the given electrochemical deposition module such that each opposing planar surface is plated with metal;   an unloader module configured to remove the flexible workpiece from the workpiece holder and convey the flexible workpiece to an unloading port configured to receive the set of flexible workpieces.   
     
     
         2 . The electrochemical deposition system of  claim 1 , wherein the loading port and the unloading port are positioned at different locations of the electrochemical deposition system. 
     
     
         3 . The electrochemical deposition system of  claim 2 , wherein the transportation mechanism is configured to return workpiece holders from the unloader module to the loader module. 
     
     
         4 . The electrochemical deposition system of  claim 2 , wherein the loading port and the unloading port are located at opposite ends of the electrochemical deposition system. 
     
     
         5 . The electrochemical deposition system of  claim 1 , wherein the electrochemical deposition system includes a chemical management system coupled to the one or more electrochemical deposition modules, and configured to supply at least one of the one or more electrochemical deposition modules with one or more metal constituents for depositing the one or more metals. 
     
     
         6 . The electrochemical deposition system of  claim 5 , wherein the chemical management system includes a helical conveyor for conveying metal powder to a metal dispensing system. 
     
     
         7 . The electrochemical deposition system of  claim 1 , further comprising:
 a membrane separating the anode compartment from the cathode compartment.   
     
     
         8 . The electrochemical deposition system of  claim 1 , wherein each electrochemical deposition module includes an agitation member configured to agitate plating solution at opposing surfaces of the flexible workpiece. 
     
     
         9 . The electrochemical deposition system of  claim 1 , wherein when the flexible workpiece is positioned within the given electrochemical deposition module, each opposing planar surface of the flexible workpiece faces an anode, wherein each flexible workpiece defines through holes to be filled with metal. 
     
     
         10 . The electrochemical deposition system of  claim 1 , wherein each electrochemical deposition module is configured to hold less than thirty liters of plating solution. 
     
     
         11 . The electrochemical deposition system of  claim 1 , wherein the clamping mechanism includes elastic members that impart a clamping force on the opposing planar surfaces of the flexible workpiece. 
     
     
         12 . The electrochemical deposition system of  claim 11 , wherein the electrochemical deposition system includes a pneumatic bladder configured to open the clamping mechanism when inflated. 
     
     
         13 . The electrochemical deposition system of  claim 1 , wherein the common platform includes less than 16 electrochemical deposition modules and is configured to plate 100 flexible workpieces per hour. 
     
     
         14 . The electrochemical deposition system of  claim 13 , wherein the common platform covers a floor space of less than 250 square feet. 
     
     
         15 . An electrochemical deposition system comprising:
 two or more electrochemical deposition modules arranged on a common platform and configured for depositing one or more metals on a substrate, each electrochemical deposition module comprising:   a plating solution compartment configured to contain a volume of plating solution;   a loading port configured to receive a set of workpieces;   a loader module configured to receive a workpiece from the loading port and position the workpiece in a workpiece holder while holding the workpiece using an air cushion on each opposing planar surface of the workpiece;   the workpiece holder having a header member separating first and second leg members, the workpiece holder configured to hold opposing edges of the workpiece between the first and second leg members via a clamping mechanism that applies electrical contacts to the opposing planar surfaces of the workpiece with the electrical contacts surrounded by an elastomeric seal to the workpiece when held by the workpiece holder, the holder being configured to expose both sides of the workpiece to plating solution;   a transportation mechanism configured to transport workpieces, via workpiece holders, from the loader module to a given electrochemical deposition module and lower a given workpiece into the given electrochemical deposition module;   an electrical system configured to apply an electrical current to each opposing planar surface of the workpiece when held within the given electrochemical deposition module such that each opposing planar surface is plated with metal or one opposing planar surface is plated with metal;   an unloader module configured to remove the workpiece from the workpiece holder and convey the workpiece to an unloading port configured to receive the set of workpieces.   
     
     
         16 . The electrochemical deposition system of  claim 15 , wherein an anode and the workpiece are in contact with a same plating solution.