Electronic Device Module Comprising an Ethylene Multi-Block Copolymer

Abstract

An electronic device module comprises: A. At least one electronic device, e.g., a solar cell, and B. A polymeric material in intimate contact with at least one surface of the electronic device, the polymeric material comprising an ethylene multi-block copolymer. Typically, the polyolefin material is an ethylene multi-block copolymer with a density of less than about 0.90 grams per cubic centimeter (g/cc). The polymeric material can fully encapsulate the electronic device, or it can be laminated to one face surface of the device. Optionally, the polymeric material can further comprise a scorch inhibitor, and the copolymer can remain uncrosslinked or it can be crosslinked.

1 - 25 . (canceled) 
     
     
         26 . An electronic device module comprising:
 A. at least one electronic device having a face surface; and   B. a polymeric material in intimate contact with the face surface of the electronic device, the polymeric material comprising a reaction product of at least:   (1) an ethylene/α-olefin multi-block copolymer characterized by
 (i) a molecular fraction that elutes between about 40° C. and about 130′C when fractionated using TREF, characterized in that the fraction has a block index of at least 0.5 and up to about 1 and a MWD greater than about 1.3, 
 (ii) a melt point of less than 125° C., and 
 (iii) a density from 0.85 g/cc to 0.89 g/cc; 
   (2) a vinyl silane in an amount of at least about 0.1 wt % based on the weight of the copolymer,   (3) optionally, a co-agent;   C. a cover layer disposed apart from the face surface; and   the polymeric material is interposed between the electronic device and the cover layer.   
     
     
         27 . The module of  claim 26  wherein the polymeric material has greater than or equal to 92% transmission over the wavelength range of 400 to 1000 nanometers, and a water vapor transmission rate of less than 50 grams per square meters per day (g/m 2 /day). 
     
     
         28 . The module of  claim 27  wherein the ethylene/α-olefin multi-block copolymer consists of (i) ethylene and (ii) a comonomer selected from the group consisting of butene, hexene, and octene. 
     
     
         29 . The module of  claim 28  wherein the polymeric material has a property selected from the group consisting of (iv) an average block index greater than zero and up to about 1.0 and an MWD greater than about 1.3, (v) a 2% secant modulus of less than 150 megaPascal (mPa) as measured by ASTM D-882-02, (vi) a Tg of less than about −35 C, and combinations thereof. 
     
     
         30 . The module of  claim 26  comprising the coagent present in an amount of at least about 0.05 wt % based on the weight of the copolymer. 
     
     
         31 . The module of  claim 30  further comprising a free radical initiator which is a peroxide. 
     
     
         32 . The module of  claim 31  in which the vinyl silane is at least one of vinyl tri-ethoxy silane and vinyl tri-methoxy silane. 
     
     
         33 . The module of  claim 26  wherein the polymeric material is crosslinked such that the polymeric material contains less than about 70 percent xylene soluble extractables as measured by ASTM 2765-95. 
     
     
         34 . The module of  claim 26  wherein the polymeric material further comprises a scorch inhibitor in an amount from 0.01 to about 1.7 wt %. 
     
     
         35 . The module of  claim 26  wherein the polymeric material further comprises a polyolefin polymer grafted with an unsaturated organic compound containing at least one ethylenic unsaturation and at least one carbonyl group. 
     
     
         36 . The module of  claim 35  in which the unsaturated organic compound is maleic anhydride. 
     
     
         37 . The module of  claim 26  wherein the polymeric material (i) adheres to the cover layer and (ii) adheres to the electronic device with no gaps between the cover layer and the electronic device. 
     
     
         38 . The module of  claim 26  wherein the cover layer is a glass cover sheet. 
     
     
         39 . The module of  claim 26  wherein the electronic device comprises a second face surface parallel to the face surface; and
 the polymeric material is in intimate contact with the second face surface. 
 
     
     
         40 . The module of  claim 39  wherein a second cover layer is disposed apart from the second face surface; and
 the polymeric material is interposed between the electronic device and the second cover layer. 
 
     
     
         41 . The module of  claim 40  wherein the second cover layer is a second glass cover sheet. 
     
     
         42 . The module of  claim 26  wherein the cover layer is a flexible polymeric film. 
     
     
         43 . The module of  claim 42  wherein the polymeric material (i) adheres to the flexible polymeric film and (ii) adheres to the electronic device with no gaps between the flexible polymeric film and the electronic device. 
     
     
         44 . The module of  claim 43  wherein the electronic device comprises a second face surface parallel to the face surface; and
 a backsheet in intimate contact with the second face surface. 
 
     
     
         45 . The module of  claim 44  wherein the polymeric material is a multilayer film in which at least one outer skin layer (i) does not contain peroxide for crosslinking, and (ii) is the surface which comes into intimate contact with the face surface.