Inventor · disambiguated record
John A. Naumovitz
Also filed as: NAUMOVITZ JOHN · NAUMOVITZ JOHN A
13 granted patents·17 pending applications·116 citations·filing 1989–2021
89Inventor score
Files withDOW GLOBAL TECHNOLOGIES LLC15NAUMOVITZ JOHN A4PATEL RAJEN M2BONEKAMP JEFFREY E1CHU LIH-LONG1
Top patents by PatentIndex Score
30 records- 0192US8592679B2Electronic device module comprising polyolefin copolymerDOW GLOBAL TECHNOLOGIES LLC·Filed 2012·Granted Nov 26, 2013·7 cites·18 claims
- 0292US8581094B2Electronic device module comprising polyolefin copolymerPATEL RAJEN M·Filed 2007·Granted Nov 12, 2013·21 cites·18 claims
- 0389US6685872B2Method for preparing multilayer filmsDOW GLOBAL TECHNOLOGIES INC·Filed 2001·Granted Feb 3, 2004·50 cites·12 claims
- 0486US9362436B2Silane-containing ethylene interpolymer formulation including films and electronic device module comprising sameDOW GLOBAL TECHNOLOGIES LLC·Filed 2013·Granted Jun 7, 2016·14 cites·20 claims
- 0583US9169340B2Electronic device module comprising an ethylene multi-block copolymerDOW GLOBAL TECHNOLOGIES LLC·Filed 2012·Granted Oct 27, 2015·2 cites·17 claims
- 0670US8431235B2Co-extruded, multilayered polyolefin-based backsheet for electronic device modulesCHU LIH-LONG·Filed 2009·Granted Apr 30, 2013·4 cites·7 claims
- 0768US2018148525A1Electronic Device Module Comprising an Ethylene Multi-Block CopolymerDOW GLOBAL TECHNOLOGIES LLC·Filed 2018·Application pending·0 cites
- 0866US5002989AFormulation for extrudable vinylidene chloride copolymers having high barrier propertiesDOW CHEMICAL CO·Filed 1989·Granted Mar 26, 1991·18 cites·61 claims
- 0963US10872990B2Electronic devices comprising two encapsulant filmsDOW GLOBAL TECHNOLOGIES LLC·Filed 2018·Granted Dec 22, 2020·0 cites·15 claims
- 1063US10759152B2Multilayered polyolefin-based films having an integrated backsheet and encapsulation performance comprising a layer comprising crystalline block copolymer composite or block copolymer compositeDOW GLOBAL TECHNOLOGIES LLC·Filed 2018·Granted Sep 1, 2020·0 cites·18 claims
- 1162US10164137B2Electronic devices comprising two encapsulant filmsDOW GLOBAL TECHNOLOGIES LLC·Filed 2014·Granted Dec 25, 2018·0 cites·7 claims
- 1256US10770609B2Multilayered polyolefin-based films having a layer comprising a crystalline block copolymer composite or a block copolymer composite resinDOW GOBAL TECH LLC·Filed 2018·Granted Sep 8, 2020·0 cites·19 claims
- 1356US2008115825A1Electronic Device Module Comprising an Ethylene Multi-Block CopolymerPATEL RAJEN M·Filed 2007·Application pending·0 cites
- 1456US2014174509A1Multilayered polyolefin-based films having a layer comprising a crystalline block copolymer composite or a block copolymer composite resinDOW GLOBAL TECHNOLOGIES LLC·Filed 2012·Application pending·0 cites
- 1555US2023151195A1Enhanced melt strength low-density polyethylene for use in films or blendsDOW GLOBAL TECHNOLOGIES LLC·Filed 2021·Application pending·0 cites
- 1654US2014096825A1Multilayered polyolefin-based films having integrated backsheet and encapsulation performance comprising a layer comprising crystalline block copolymer composite or block copolymer compositeBONEKAMP JEFFREY E·Filed 2012·Application pending·0 cites
- 1753US2016149063A1Backsheets/Frontsheets Having Improved Adhesion to Encapsulants and Photovoltaic Modules Made TherefromDOW GLOBAL TECHNOLOGIES LLC·Filed 2014·Application pending·0 cites
- 1851US2013206224A1Electronic Device Module Comprising Film of Homogeneous Polyolefin Copolymer and Adhesive Property Enhancing Graft PolymerNAUMOVITZ JOHN A·Filed 2011·Application pending·0 cites
- 1951US2011290317A1Electronic device module comprising polyolefin copolymer with low unsaturation and optional vinyl silaneNAUMOVITZ JOHN·Filed 2011·Application pending·0 cites
- 2048US11613636B2Polymer blends for use in multilayer structure and multilayer structures comprising the sameDOW GLOBAL TECHNOLOGIES LLC·Filed 2016·Granted Mar 28, 2023·0 cites·12 claims
- 2147US2008274245A1Multicomponent Structures Having Improved Adhesion Between ComponentsLEE ERIC K C·Filed 2005·Application pending·0 cites
- 2246US10424682B2Multilayer down-converting encapsulant films and electronic devices including the sameDOW GLOBAL TECHNOLOGIES LLC·Filed 2013·Granted Sep 24, 2019·0 cites·20 claims
- 2346US2013087198A1Electronic Device Module Comprising Heterogeneous Polyolefin Copolymer and Optionally SilaneNAUMOVITZ JOHN A·Filed 2011·Application pending·0 cites
- 2446US2018186941A1Methods of preparing vinylidene chloride polymer compositionsDOW GLOBAL TECHNOLOGIES LLC·Filed 2016·Application pending·0 cites
- 2545US2013167926A1Electronic Device Module Comprising Ethylene-Alpha Olefin Tapered Block Copolymers and Optional Vinyl SilaneNIEMANN DEBRA H·Filed 2011·Application pending·0 cites
- 2644US2013269776A1Silane-containing thermoplastic polyolefin copolymer resins, films, processes for their preparation and photovoltaic module laminate structure comprising such resins and filmsWU SHAOFU·Filed 2011·Application pending·0 cites
- 2742US2020048448A1Vinylidene chloride polymer compositions and articles comprising the sameDOW GLOBAL TECHNOLOGIES LLC·Filed 2016·Application pending·0 cites
- 2839US2017338360A1PV Module with Film Layer Comprising Micronized Silica GelDOW GLOBAL TECHNOLOGIES LLC·Filed 2015·Application pending·0 cites
- 2938US2013233383A1Electronic Device Module Comprising Film of Homogeneous Polyolefin Copolymer and Grafted SilaneNAUMOVITZ JOHN A·Filed 2011·Application pending·0 cites
- 3038US2013087199A1Electronic Device Module Comprising Long Chain Branched (LCB), Block or Interconnected Copolymers of Ethylene and Optionally SilaneNAUMOVITZ JOHN A·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →