Wire bonding apparatus

Abstract

To provide a wire bonding apparatus, which is insusceptible to a bonding state at a second bonding point due to a wire cut error or the like, or to members such as a capillary and a wire, and is capable of automatically protruding the wire from a leading end of the capillary, provided is a wire bonding apparatus including: a capillary ( 6 ) having a through hole through which a wire ( 40 ) is to be inserted; a holding unit, which is provided above the capillary ( 6 ), and is configured to hold the wire ( 40 ) inserted through the capillary ( 6 ); and a vibrating unit configured to vertically vibrate the capillary ( 6 ). Under a state in which the holding unit holds the wire ( 40 ), the vibrating unit vertically vibrates the capillary ( 6 ) so that the wire ( 40 ) is protruded from the leading end of the capillary.

1 . A wire bonding apparatus, comprising:
 a capillary having a through hole through which a wire is to be inserted;   holding means, which is provided above the capillary, for holding the wire inserted through the capillary; and   vibrating means for vertically vibrating the capillary,   wherein, under a state in which the holding means holds the wire, the vibrating means vertically vibrates the capillary so that the wire is protruded from a leading end of the capillary.   
     
     
         2 . A wire bonding apparatus according to  claim 1 , wherein the vibrating means is configured to vertically vibrate a bonding arm, which has a leading end to which the capillary is mounted through intermediation of an ultrasonic horn, at a frequency including a natural frequency of the bonding arm. 
     
     
         3 . A wire bonding apparatus according to  claim 1 , further comprising capillary moving means for vertically moving the capillary,
 wherein the capillary is vertically vibrated after the capillary is moved for a predetermined distance to approach the holding means.   
     
     
         4 . A wire bonding apparatus according to  claim 3 , wherein the capillary is vertically vibrated while the capillary is raised by the capillary moving means so as to approach the holding means. 
     
     
         5 . A wire bonding apparatus according to  claim 1 , further comprising ultrasonic applying means for applying ultrasonic vibration to the capillary,
 wherein the ultrasonic vibration is superimposed to the capillary when the capillary is vertically vibrated.   
     
     
         6 . A wire bonding apparatus according to  claim 1 , further comprising wire protrusion amount measuring means for measuring a protrusion amount of the wire from the leading end of the capillary,
 wherein the capillary is vertically vibrated based on a measurement result obtained by the wire protrusion amount measuring means.   
     
     
         7 . A wire bonding apparatus according to  claim 6 ,
 wherein the wire protrusion amount measuring means comprises:
 a capillary height detection unit configured to detect a capillary height; 
 a measurement member made of a conductive material; and 
 a contact detection unit configured to detect contact between the measurement member and one of the leading end of the capillary and a leading end of the wire protruding from the leading end of the capillary based on a conductive state therebetween, and 
   wherein the protrusion amount of the wire is calculated based on a difference between a capillary height obtained when the leading end of the capillary in a state in which the wire is not protruded from the leading end is in contact with the measurement member and a capillary height obtained when the leading end of the wire protruding from the leading end of the capillary is in contact with the measurement member.   
     
     
         8 . A wire bonding apparatus according to  claim 1 , further comprising wire protrusion state detecting means comprising:
 a capillary height detection unit configured to detect a capillary height; and   a conductive state detection unit configured to detect a conductive state between the wire and a bonding point at which the wire is bonded,   wherein the wire protrusion state detecting means is configured to detect a protrusion state of the wire from the leading end of the capillary based on the capillary height at which the conductive state has changed while the capillary, which has bonded the wire to the bonding point, is raised, and   wherein the capillary is vertically vibrated based on the protrusion state of the wire.   
     
     
         9 . A wire bonding apparatus according to  claim 1 , further comprising a cleaning sheet having an adhesive property,
 wherein the vibrating means is configured to vertically vibrate the capillary so that the leading end of the capillary repeatedly abuts against a surface of the cleaning sheet, to thereby perform cleaning of removing dirt adhering to the leading end of the capillary.   
     
     
         10 . A wire bonding apparatus according to  claim 9 , wherein the cleaning sheet is obtained by forming an abrasive layer made of an abrasive on a cushioning layer having protrusions. 
     
     
         11 . A wire bonding apparatus according to  claim 9 , wherein the capillary is vertically vibrated after the capillary is cleaned with use of the cleaning sheet. 
     
     
         12 . A wire bonding apparatus according to  claim 10 , wherein the capillary is vertically vibrated after the capillary is cleaned with use of the cleaning sheet.