Assignee
KAIJO KK
JP·66 granted patents·9 pending applications·1,120 citations·filing 1992–2020
Top patents by PatentIndex Score
75 records- 0196US7262124B2Wire loop, semiconductor device having same, wire bonding method and wire bonding apparatusKAIJO KK·Filed 2005·Granted Aug 28, 2007·118 cites·13 claims
- 0295US6933608B2Wire loop, semiconductor device having same, wire bonding method and wire bonding apparatusKAIJO KK·Filed 2003·Granted Aug 23, 2005·144 cites·11 claims
- 0395US5810155AObject levitating apparatus object transporting apparatus and object levitating bearing along with an object levitating process and object transporting processKAIJO KK·Filed 1997·Granted Sep 22, 1998·82 cites·4 claims
- 0490US7815095B2Wire loop, semiconductor device having same and wire bonding methodKAIJO KK·Filed 2006·Granted Oct 19, 2010·35 cites·12 claims
- 0585US6216364B1Method and apparatus for drying washed objectsKAIJO KK·Filed 1999·Granted Apr 17, 2001·100 cites·20 claims
- 0682US5566876AWire bonder and wire bonding methodKAIJO KK·Filed 1994·Granted Oct 22, 1996·83 cites·26 claims
- 0778US7726325B2Deaeration device and ultrasonic cleaning device using the sameKAIJO KK·Filed 2006·Granted Jun 1, 2010·7 cites·12 claims
- 0877US6715666B2Wire bonding method, method of forming bump and bumpKAIJO KK·Filed 2002·Granted Apr 6, 2004·38 cites·11 claims
- 0976US6901685B2Method for drying washed objectsKAIJO KK·Filed 2003·Granted Jun 7, 2005·17 cites·6 claims
- 1075US10600754B2Bonding methodKAIJO KK·Filed 2017·Granted Mar 24, 2020·2 cites·6 claims
- 1175US5890580AObject levitating apparatus, object transporting apparatus, and object levitating bearing along with an object levitating process and object transporting processKAIJO KK·Filed 1994·Granted Apr 6, 1999·26 cites·15 claims
- 1275US5749698ASubstrate transport apparatus and substrate transport path adjustment methodKAIJO KK·Filed 1997·Granted May 12, 1998·26 cites·12 claims
- 1375US5238173AWire bonding misattachment detection apparatus and that detection method in a wire bonderKAIJO KK·Filed 1992·Granted Aug 24, 1993·83 cites·15 claims
- 1474US7748599B2Wire bonding method, wire bonding apparatus, and wire bonding control programKAIJO KK·Filed 2008·Granted Jul 6, 2010·8 cites·8 claims
- 1573US5699951AWire bonder and a bonding tool and bonding armKAIJO KK·Filed 1995·Granted Dec 23, 1997·44 cites·12 claims
- 1669US9865562B2Bonding deviceKAIJO KK·Filed 2015·Granted Jan 9, 2018·2 cites·13 claims
- 1768US6779534B2Apparatus and method for drying washed objectsKAIJO KK·Filed 2002·Granted Aug 24, 2004·10 cites·11 claims
- 1866US8016182B2Wire loop, semiconductor device having same and wire bonding methodKAIJO KK·Filed 2005·Granted Sep 13, 2011·8 cites·9 claims
- 1965US10262969B2Bonding deviceKAIJO KK·Filed 2017·Granted Apr 16, 2019·1 cites·1 claims
- 2065US7191929B2Method of measuring thickness of bonded ball in wire bondingKAIJO KK·Filed 2005·Granted Mar 20, 2007·5 cites·11 claims
- 2163US9772012B2Drive mechanism and manufacturing deviceKAIJO KK·Filed 2014·Granted Sep 26, 2017·2 cites·9 claims
- 2262US7899239B2Inspection method of bonded status of ball in wire bondingKAIJO KK·Filed 2005·Granted Mar 1, 2011·4 cites·16 claims
- 2361US7975899B2Work clamp and wire bonding apparatusKAIJO KK·Filed 2007·Granted Jul 12, 2011·4 cites·5 claims
- 2461US6455982B1Object levitating apparatus, an object transporting apparatus equipped with said apparatus, and an object levitating processKAIJO KK·Filed 1997·Granted Sep 24, 2002·24 cites·12 claims
- 2560US6241162B1Ultrasonic shower cleaning apparatusKAIJO KK·Filed 1999·Granted Jun 5, 2001·25 cites·25 claims
- 2659US2015083160A1Ultrasonic cleaning deviceKAIJO KK·Filed 2014·Application pending·0 cites
- 2758US11302667B2Method of vertically vibrating a bonding armKAIJO KK·Filed 2020·Granted Apr 12, 2022·0 cites·8 claims
- 2857US8960208B2Ultrasonic cleaning deviceKAIJO KK·Filed 2013·Granted Feb 24, 2015·0 cites·2 claims
- 2957US6921193B2Chemical concentration control device for semiconductor processing apparatusKAIJO KK·Filed 2002·Granted Jul 26, 2005·5 cites·4 claims
- 3057US5685476AWire guiding apparatus, wire guiding method and a wire bonder equipped with said apparatusKAIJO KK·Filed 1996·Granted Nov 11, 1997·22 cites·15 claims
- 3157US5474224AWire bonder and wire bonding methodKAIJO KK·Filed 1994·Granted Dec 12, 1995·27 cites·39 claims
- 3256US8042725B2Wire bonding method, wire bonding apparatus, and wire bonding control programKAIJO KK·Filed 2010·Granted Oct 25, 2011·1 cites·1 claims
- 3354USD381344SDisk carrierKAIJO KK·Filed 1995·Granted Jul 22, 1997·11 cites·1 claims
- 3454US2013125935A1Ultrasonic cleaning deviceKAIJO KK·Filed 2012·Application pending·0 cites
- 3553US5222648ABonderKAIJO KK·Filed 1992·Granted Jun 29, 1993·14 cites·13 claims
- 3652US11458442B2Ultrasonic homogenizerKAIJO KK·Filed 2020·Granted Oct 4, 2022·0 cites·8 claims
- 3751US11148355B2Three-dimensional shaped object production device and three-dimensional shaped object production methodKAIJO KK·Filed 2017·Granted Oct 19, 2021·0 cites·9 claims
- 3851US5628605ASubstrate transport apparatus and substrate transport path adjustment methodKAIJO KK·Filed 1995·Granted May 13, 1997·14 cites·4 claims
- 3951US5458280AWire bonder and wire bonding methodKAIJO KK·Filed 1994·Granted Oct 17, 1995·21 cites·25 claims
- 4050US8680747B2Output adjustment circuit, ultrasonic transducer device component, and ultrasonic transducer deviceKAIJO KK·Filed 2013·Granted Mar 25, 2014·0 cites·11 claims
- 4150US2018151532A1Wire bonding apparatusKAIJO KK·Filed 2015·Application pending·0 cites
- 4248US11404393B2Wire bonding method and wire bonding deviceKAIJO KK·Filed 2018·Granted Aug 2, 2022·0 cites·5 claims
- 4348US11273515B2Bonding process with rotating bonding stageKAIJO KK·Filed 2020·Granted Mar 15, 2022·0 cites·14 claims
- 4448US7392812B2Substrate processing apparatus and substrate transporting device mounted theretoKAIJO KK·Filed 2003·Granted Jul 1, 2008·7 cites·20 claims
- 4547USD867610SUltrasonic cleanerKAIJO KK·Filed 2018·Granted Nov 19, 2019·6 cites·1 claims
- 4646US11127709B2Capillary transport device, capillary mounting device, capillary replacement device, capillary transport method, capillary mounting method, and capillary replacement methodKAIJO KK·Filed 2019·Granted Sep 21, 2021·0 cites·5 claims
- 4746US10629563B2Ball forming device for wire bonderKAIJO KK·Filed 2015·Granted Apr 21, 2020·0 cites·6 claims
- 4846US5456403AWire bonder and wire bonding methodKAIJO KK·Filed 1994·Granted Oct 10, 1995·17 cites·18 claims
- 4945US5853284ANotched wafer aligning apparatusKAIJO KK·Filed 1997·Granted Dec 29, 1998·19 cites·33 claims
- 5044USD889593SUltrasonic transducerKAIJO KK·Filed 2018·Granted Jul 7, 2020·3 cites·1 claims
Showing the top 50 of 75 patent records by PatentIndex Score.
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