Window Clamp

Abstract

A wire bonding machine window clamp assembly. The assembly includes a support plate adapted to support a leadframe strip. The assembly also includes a frame structure defining a central clamp opening adapted to expose a portion of the leadframe strip. The frame structure includes at least one elongate frame member having a first surface portion adapted to engage a top surface of the leadframe strip and a second surface portion adapted to engage upper surfaces of integrated circuit (“IC”) component stacks mounted on the leadframe strip.

What is claimed is: 
     
         1 . A method of making a semiconductor device, comprising:
 using a frame member to clampingly engage a peripheral portion of the leadframe strip having multiple leadframe portions, more than one of the leadframe portions being adjacent to the engaged peripheral portion of the leadframe strip and more than one of the leadframe portions not being adjacent to the engaged peripheral portion of the leadframe strip, each of the multiple leadframe portions having an IC component stack mounted on it;   using the frame member to urge only the IC component stacks that are mounted on the more than one of the leadframe portions that are adjacent to the engaged peripheral portion of the leadframe strip downwardly;   wire bonding the IC component stacks to their respective leadframe portion;   singulating the leadframe to separate the multiple leadframe portions; and   packaging one of the singulated leadframe portions to form the semiconductor device.   
     
     
         2 . The method of  claim 1  comprising performing said urging during said clampingly engaging. 
     
     
         3 . The method of  claim 1 , said urging comprising engaging clip leadframes on said component stacks. 
     
     
         4 . The method of  claim 1 , said clampingly engaging a peripheral portion of the leadframe strip comprising clampingly engaging a peripheral portion of the leadframe strip with a first surface portion of the frame member. 
     
     
         5 . The method of  claim 4 , said urging component stacks mounted adjacent to the engaged peripheral portion of the leadframe strip downwardly comprising urging said component stacks downwardly with a second surface portion of the frame member. 
     
     
         6 . The method of  claim 4 , said urging component stacks mounted adjacent to the engaged peripheral portion of the leadframe strip downwardly comprising urging said component stacks downwardly with a second surface portion of a frame structure of a window clamp. 
     
     
         7 . The method of  claim 6 , said clampingly engaging and said urging occurring simultaneously.