Inventor · disambiguated record
Jerry Gomez Cayabyab
Also filed as: CAYABYAB JERRY · CAYABYAB JERRY G · CAYABYAB JERRY GOMEZ
11 granted patents·10 pending applications·36 citations·filing 2003–2022
87Inventor score
Top patents by PatentIndex Score
21 records- 0183US10418294B1Semiconductor device package with a cap to selectively exclude contact with mold compoundTEXAS INSTRUMENTS INC·Filed 2018·Granted Sep 17, 2019·4 cites·28 claims
- 0282US10615075B2Dicing a waferTEXAS INSTRUMENTS INC·Filed 2018·Granted Apr 7, 2020·4 cites·20 claims
- 0381US10811292B2Transport packaging and method for expanded wafersTEXAS INSTRUMENTS INC·Filed 2018·Granted Oct 20, 2020·3 cites·26 claims
- 0469US7476960B2System and method for improved auto-boatingTEXAS INSTRUMENTS INC·Filed 2006·Granted Jan 13, 2009·5 cites·8 claims
- 0565US9824959B2Structure and method for stabilizing leads in wire-bonded semiconductor devicesTEXAS INSTRUMENTS INC·Filed 2016·Granted Nov 21, 2017·2 cites·15 claims
- 0657US8716845B2Lead frame strip for reduced mold sticking during degatingSANTOS NORBERT JOSON·Filed 2011·Granted May 6, 2014·3 cites·15 claims
- 0756US11276615B2Semiconductor device package with a cap to selectively exclude contact with mold compoundTEXAS INSTRUMENTS INC·Filed 2019·Granted Mar 15, 2022·0 cites·18 claims
- 0855US9997490B2Window clampTEXAS INSTRUMENTS INC·Filed 2015·Granted Jun 12, 2018·1 cites·7 claims
- 0955US7358617B2Bond pad for ball grid array packageTEXAS INSTRUMENTS INC·Filed 2004·Granted Apr 15, 2008·10 cites·8 claims
- 1052US2020203227A1Dicing A WaferTEXAS INSTRUMENTS INC·Filed 2020·Application pending·0 cites
- 1147US2008245470A1System and method for improved auto-boatingTEXAS INSTRUMENTS INC·Filed 2008·Application pending·0 cites
- 1246US7402893B2System and method for improved auto-boatingTEXAS INSTRUMENTS INC·Filed 2003·Granted Jul 22, 2008·3 cites·8 claims
- 1345US2024063107A1Crack arrest features for miultilevel package substrateTEXAS INSTRUMENTS INC·Filed 2022·Application pending·0 cites
- 1444US2007006805A1Method and System for Applying an Adhesive Substance on an Electronic DeviceTEXAS INSTRUMENTS INC·Filed 2006·Application pending·0 cites
- 1543US2018261568A1Window ClampTEXAS INSTRUMENTS INC·Filed 2018·Application pending·0 cites
- 1643US2018261567A1Window ClampTEXAS INSTRUMENTS INC·Filed 2018·Application pending·0 cites
- 1740US2011017806A1Forming gas kit design for copper bondingCAYABYAB JERRY GOMEZ·Filed 2009·Application pending·0 cites
- 1839US7127794B2Auto-boating processTEXAS INSTRUMENTS INC·Filed 2003·Granted Oct 31, 2006·1 cites·12 claims
- 1939US2005260789A1Method and system for applying an adhesive substance on an electronic deviceTEXAS INSTRUMENTS INC·Filed 2004·Application pending·0 cites
- 2037US2006097400A1Substrate via pad structure providing reliable connectivity in array package devicesTEXAS INSTRUMENTS INC·Filed 2004·Application pending·0 cites
- 2134US2005121139A1System and method used in attaching die for ball grid arraysTEXAS INSTRUMENTS INC·Filed 2003·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →