Manufacturing method of semiconductor light-emitting device

Abstract

A manufacturing method of a semiconductor light-emitting device is provided. Steps of the manufacturing method includes: providing a substrate; placing at least one light-emitting unit on the substrate; encapsulating the at least one light-emitting unit onto the substrate by a phosphor layer and a reflective layer. The phosphor layer at least covers an upper surface of the at least one light-emitting unit, and the reflective layer surrounds the at least one light-emitting unit.

What is claimed is: 
     
         1 . A manufacturing method of a semiconductor light-emitting device, comprising:
 providing a substrate;   placing at least one light-emitting unit on the substrate; and   encapsulating the at least one light-emitting unit onto the substrate by a phosphor layer and a reflective layer, wherein the phosphor layer at least covers an upper surface of the at least one light-emitting unit, and the reflective layer surrounds the at least one light-emitting unit.   
     
     
         2 . The manufacturing method of  claim 1 , wherein the step of encapsulating the at least one light-emitting unit onto the substrate by the phosphor layer and the reflective layer further comprises:
 placing the reflective layer on the substrate, the reflective layer covering a side surface of the at least one light-emitting unit; and   placing the phosphor layer on the upper surface of the at least one light-emitting unit or on the upper surface of the at least one light-emitting unit and an upper surface of the reflective layer after the reflective layer covers the side surface of the at least one light-emitting unit.   
     
     
         3 . The manufacturing method of  claim 2 , wherein the upper surface of the reflective layer is substantially co-planar with the upper surface of the at least one light-emitting unit. 
     
     
         4 . The manufacturing method of  claim 1 , wherein the step of encapsulating the at least one light-emitting unit onto the substrate by the phosphor layer and the reflective layer further comprises:
 encapsulating the at least one light-emitting unit onto the substrate by the phosphor layer; and   placing the reflective layer on a side surface of the phosphor layer of the at least one light-emitting unit.   
     
     
         5 . The manufacturing method of  claim 4 , wherein an upper surface of the reflective layer is substantially higher than the upper surface of the at least one light-emitting unit. 
     
     
         6 . The manufacturing method of  claim 1 , wherein after encapsulating the at least one light-emitting unit onto the substrate by the phosphor layer and the reflective layer, the manufacturing method further comprises:
 encapsulating the at least one light-emitting unit, the phosphor layer, and the reflective layer onto the substrate by a molding compound.   
     
     
         7 . The manufacturing method of  claim 1 , wherein before encapsulating the at least one light-emitting unit onto the substrate by the phosphor layer and the reflective layer; the manufacturing method further comprises:
 placing a blocking wall on the substrate, the blocking wall surrounding a light-emitting region, wherein the at least one light-emitting unit, the phosphor layer, and the reflective layer are arranged in the light-emitting region.   
     
     
         8 . The manufacturing method of  claim 7 , wherein when the at least one light-emitting unit is encapsulated onto the substrate by the phosphor layer and the reflective layer, the blocking wall is adapted to restricting the reflective layer to be located in the light-emitting region. 
     
     
         9 . The manufacturing method of  claim 1 , wherein the step of placing the at least one light-emitting unit on the substrate further comprises:
 placing a plurality of light-emitting chips on the substrate, the light-emitting chips being connected together and constituting the at least one light-emitting unit.   
     
     
         10 . The manufacturing method of  claim 1 , wherein if the quantity of the at least one light-emitting units is plural, the reflective layer is further arranged between the light-emitting units.