Inventor · disambiguated record
Hao-Chung Lee
Also filed as: LEE HAO-CHUNG
18 granted patents·11 pending applications·69 citations·filing 2012–2021
93Inventor score
Top patents by PatentIndex Score
29 records- 0191US9953956B2Package substrate and package structure using the sameGENESIS PHOTONICS INC·Filed 2016·Granted Apr 24, 2018·6 cites·18 claims
- 0288US10910523B2Light emitting deviceGENESIS PHOTONICS INC·Filed 2018·Granted Feb 2, 2021·5 cites·14 claims
- 0387US9997676B2Light emitting device and manufacturing method thereofGENESIS PHOTONICS INC·Filed 2016·Granted Jun 12, 2018·5 cites·7 claims
- 0474US9801274B2Light emitting deviceGENESIS PHOTONICS INC·Filed 2015·Granted Oct 24, 2017·2 cites·20 claims
- 0568USD796456SLight emitting diode packageGENESIS PHOTONICS INC·Filed 2016·Granted Sep 5, 2017·10 cites·1 claims
- 0668US8882974B2Support mechanismHONGFUJIN PREC IND SHENZHEN·Filed 2013·Granted Nov 11, 2014·1 cites·11 claims
- 0765USD772181SLight emitting diode package substrateGENESIS PHOTONICS INC·Filed 2015·Granted Nov 22, 2016·9 cites·1 claims
- 0862US2021159369A1Light emitting deviceGENESIS PHOTONICS INC·Filed 2021·Application pending·0 cites
- 0959USD761214SLight emitting diode packageGENESIS PHOTONICS INC·Filed 2015·Granted Jul 12, 2016·7 cites·1 claims
- 1059US2018240780A1Package substrate and package structure using the sameGENESIS PHOTONICS INC·Filed 2018·Application pending·0 cites
- 1159US2018261572A1Manufacturing method of semiconductor light-emitting deviceGENESIS PHOTONICS INC·Filed 2018·Application pending·0 cites
- 1257USD854195SLight emitting diode packageGENESIS PHOTONICS INC·Filed 2017·Granted Jul 16, 2019·7 cites·1 claims
- 1354US10064272B2Light emitting device using metal substrate for improving heat dissipation efficiencyGENESIS PHOTONICS INC·Filed 2017·Granted Aug 28, 2018·0 cites·19 claims
- 1453US10147709B2Light emitting moduleGENESIS PHOTONICS INC·Filed 2017·Granted Dec 4, 2018·0 cites·11 claims
- 1552US10090445B2Package method and packageGENESIS PHOTONICS INC·Filed 2017·Granted Oct 2, 2018·0 cites·13 claims
- 1650USD790487SLight emitting diode package substrateGENESIS PHOTONICS INC·Filed 2016·Granted Jun 27, 2017·4 cites·1 claims
- 1750US2018151781A1Light emitting device package structure and manufacturing method thereofGENESIS PHOTONICS INC·Filed 2018·Application pending·0 cites
- 1849USD762596SLight emitting diode package substrateGENESIS PHOTONICS INC·Filed 2015·Granted Aug 2, 2016·5 cites·1 claims
- 1949USD761213SLight emitting diode moduleGENESIS PHOTONICS INC·Filed 2015·Granted Jul 12, 2016·5 cites·1 claims
- 2047US2014060592A1Cleaning deviceHON HAI PREC IND CO LTD·Filed 2013·Application pending·0 cites
- 2146US9685596B2Package method and packageGENESIS PHOTONICS INC·Filed 2015·Granted Jun 20, 2017·0 cites·9 claims
- 2245US2015333227A1Light emitting device package structure and manufacturing method thereofGENESIS PHOTONICS INC·Filed 2015·Application pending·0 cites
- 2345US2016013166A1Light emitting moduleGENESIS PHOTONICS INC·Filed 2015·Application pending·0 cites
- 2443USD886751SLight emitting diode moduleGENESIS PHOTONICS INC·Filed 2017·Granted Jun 9, 2020·3 cites·1 claims
- 2539US2013233724A1System and method of electrolytic deburring for metal piecesHONGFUJIN PREC IND SHENZHEN·Filed 2012·Application pending·0 cites
- 2637US9027399B2Liquid level sensorHONGFUJIN PREC IND SHENZHEN·Filed 2013·Granted May 12, 2015·0 cites·14 claims
- 2737US2016293806A1Light-emitting diode (led) packageGENESIS PHOTONICS INC·Filed 2016·Application pending·0 cites
- 2834US2016276546A1Chip package structure and method of manufacturing the sameGENESIS PHOTONICS INC·Filed 2016·Application pending·0 cites
- 2933US2015311190A1Light emitting diode package structureGENESIS PHOTONICS INC·Filed 2015·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Hao-Chung Lee files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →