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Light emitting diode package substrate

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Assignee: GENESIS PHOTONICS INCPriority: Apr 2, 2015Filed: Jun 21, 2016Granted: Jun 27, 2017
Est. expiryApr 2, 2035(~8.7 yrs left)· nominal 20-yr term from priority
Inventors:Hao-Chung LeeYu-Feng LinXun-Xain Zhan
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PatentIndex Score
4
Cited by
32
References
1
Claims

Claims

exact text as granted — not AI-modified
CLAIM 
     
       The ornamental design for a light emitting diode package substrate, as shown and described.

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