US2018336393A1PendingUtilityA1

Fingerprint sensing unit

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Assignee: J METRICS TECH CO LTDPriority: Sep 10, 2015Filed: Jul 31, 2018Published: Nov 22, 2018
Est. expirySep 10, 2035(~9.2 yrs left)· nominal 20-yr term from priority
Inventors:Wei-Ting LinShih-Chun Kuo
G06V 40/1329H10W 90/754H10W 90/734H10W 90/724H10W 90/722H10W 90/00H10W 74/114H10W 72/07254H10W 72/07237H10W 72/877H10W 72/865H10W 72/859H10W 72/331H10W 72/247H10W 72/241H10W 72/222H10W 72/074H10W 72/073H10W 72/072H10W 42/60H01L 2224/73253G06K 9/00013H01L 2224/48227H01L 2224/13082H01L 2224/81191H01L 2224/29011H01L 24/13H01L 2224/16145G06K 9/00053H01L 2224/32225H01L 2224/73207H01L 2924/00012H01L 2224/8185H01L 2224/83192H01L 24/32H01L 24/29H01L 2224/17181H01L 24/48H01L 2224/73215H01L 2224/81193H01L 23/60H01L 25/0657H01L 24/16H01L 2224/16227H01L 24/17H01L 24/73H01L 2224/83851H01L 23/3121H01L 2924/15158
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Claims

Abstract

A fingerprint sensing unit includes a carrier substrate, a fingerprint sensing chip on an upper surface of the carrier substrate, a molding layer, a light-pervious cover layer on the molding layer, and an adhesive layer between the light-pervious cover layer and the molding layer. The fingerprint sensing chip is electrically connected to the carrier substrate. The molding layer covers the fingerprint sensing chip.

Claims

exact text as granted — not AI-modified
What is claimed is: 
     
         1 . A fingerprint sensing unit, comprising:
 a carrier substrate;   a fingerprint sensing chip on an upper surface of the carrier substrate and electrically connected to the carrier substrate;   an adhesive layer disposed on the fingerprint sensing chip;   a light-pervious cover layer on the adhesive layer; and   a filling layer disposed under the adhesive layer and surrounding the fingerprint sensing chip, wherein the filling layer is located between the adhesive layer and the carrier substrate.   
     
     
         2 . The fingerprint sensing unit of  claim 2 , wherein the fingerprint sensing unit further comprises a molding layer, and the molding layer covers a part of the light-pervious cover layer, a part of the filling layer, and a part of the carrier substrate.

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