Multi-chip self adjusting cooling solution

Abstract

An apparatus including a primary device and at least one secondary device coupled in a planar array to a substrate; a first passive heat exchanger disposed on the primary device and having an opening over an area corresponding to the at least one secondary device; a second passive heat exchanger disposed on the at least one secondary device; at least one first spring operable to apply a force to the first heat exchanger in a direction of the primary device; and at least one second spring operable to apply a force to the second heat exchanger in the direction of the secondary device. A method including placing a passive heat exchanger on a multi-chip package, and deflecting a spring to apply a force in a direction of an at least one secondary device on the package.

1 . An apparatus comprising:
 a passive heat exchanger having dimensions operable for disposition on a multi-chip package, the passive heat exchanger comprising:
 a first portion having a first area with an opening therein; 
 a second portion having dimension operable for disposal in the opening; and 
 a spring operable to apply a force to the second portion. 
   
     
     
         2 . The apparatus of  claim 1 , wherein each of the first portion and the second portion of the heat exchanger comprises a heatsink base and a fin structure. 
     
     
         3 . The apparatus of  claim 2 , wherein the spring is disposed between the first sink base and the at least one second heatsink base. 
     
     
         4 . The apparatus of  claim 3 , wherein a thickness dimension of the first heatsink base is different than a thickness dimension of the at least one second heatsink base. 
     
     
         5 . The apparatus of  claim 4 , wherein the thickness dimension of the at least one second heatsink base is less than the thickness dimension of the first heatsink base. 
     
     
         6 . The apparatus of  claim 2 , wherein the at least one spring is disposed across a dimension of the fin structure of the at least one second portion. 
     
     
         7 . The apparatus of  claim 2 , wherein the heatsink base of the first portion has a thickness operable to justify the heatsink base with a device in a multi-chip package comprising the greatest heat generation. 
     
     
         8 . An apparatus comprising:
 a first passive heat exchanger comprising a heatsink base and a fin structure, wherein the heatsink base and the fin structure of the first passive heat exchanger both comprise an opening, wherein the heatsink base of the first passive heat exchanger has a bottommost surface;   a second passive heat exchanger comprising a heatsink base and a fin structure both disposed in the opening of the heatsink base and the fin structure of the first passive heat exchanger;   a second spring operable to apply a force to the second passive heat exchanger, the spring between the heatsink base of the first passive heat exchanger and the heatsink base of the second passive heat exchanger, wherein the spring extends below the bottommost surface of the heatsink base of the first passive heat exchanger.   
     
     
         9 . The apparatus of  claim 8 , wherein the spring is disposed across a dimension of the fin structure of the second passive heat exchanger. 
     
     
         10 . The apparatus of  claim 8 , wherein the spring is a coil spring or a wave spring to maintain a mechanical load of the heatsink base of the second passive heat exchanger. 
     
     
         11 . An apparatus comprising:
 a central processing unit die on a processor substrate, the central processing unit die having a first thickness above the processor substrate;   a memory chip on the processor substrate, the memory chip having a second thickness above the processor substrate, the second thickness less than the first thickness;   a first passive heat exchanger comprising a heatsink base and a fin structure disposed on the central processing unit die, wherein the heatsink base and the fin structure of the first passive heat exchanger both comprise an opening over an area corresponding to the memory chip, wherein the heatsink base of the first passive heat exchanger has a bottommost surface;   a second passive heat exchanger comprising a heatsink base and a fin structure both disposed in the opening and on the memory chip;   a first spring between the substrate and the heatsink base of the first passive heat exchanger; and   a second spring between the heatsink base of the first passive heat exchanger and the heatsink base of the second passive heat exchanger, wherein the second spring extends below the bottommost surface of the heatsink base of the first passive heat exchanger.   
     
     
         12 . The apparatus of  claim 11 , wherein the second spring is disposed across a dimension of the fin structure of the at least one second passive heat exchanger. 
     
     
         13 . The apparatus of  claim 12 , wherein the second spring is operable to displace the heatsink of the second passive heat exchanger toward the memory chip. 
     
     
         14 . The apparatus of  claim 11 , wherein the heatsink base of the first passive heat exchanger has a thickness to justify the heatsink base of the first passive heat exchanger with the central processing unit die. 
     
     
         15 . The apparatus of  claim 11 , wherein the second spring is a coil spring or a wave spring. 
     
     
         16 . The apparatus of  claim 15 , wherein the second spring is to maintain a mechanical load of the heatsink base of the second passive heat exchanger. 
     
     
         17 . The apparatus of  claim 15 , wherein the second spring is a coil spring. 
     
     
         18 . The apparatus of  claim 15 , wherein the second spring is a wave spring.