Wiring substrate device

Abstract

A wiring substrate device includes a wiring substrate, a plurality of terminals each of which is provided upright on the wiring substrate and has a lower end, an upper end and a narrowed part between the lower end and the upper end, and a plurality of solders each of which has a melting point lower than the terminals and covers a surface of the corresponding terminal.

What is claimed is: 
     
         1 . A wiring substrate device comprising:
 a wiring substrate;   a plurality of terminals each of which is provided upright on the wiring substrate and has a lower end, an upper end and a narrowed part between the lower end and the upper end; and   a plurality of solders each of which has a melting point lower than the terminals and covers a surface of the corresponding terminal.   
     
     
         2 . The wiring substrate device according to  claim 1 , wherein the narrowed part has a narrow portion having a smallest width, as seen from a cross sectional view, and
 wherein a sectional shape of the terminal is thinned in a tapered shape from the lower end toward the narrow portion and the sectional shape of the terminal is widened in a tapered shape from the narrow portion toward the upper end.   
     
     
         3 . The wiring substrate device according to  claim 2 , wherein the wiring substrate comprises:
 a wiring connected to the terminals via the solders, and   a solder resist layer formed on the wiring around the terminals, and   wherein the narrow portion is positioned above an upper surface of the solder resist layer.   
     
     
         4 . The wiring substrate device according to  claim 1 , wherein a side surface of each of the terminals is formed with a plurality of grooves extending from the lower end to the upper end. 
     
     
         5 . The wiling substrate device according to  claim 1 , wherein each of the terminals has:
 an upper plate comprising the upper end,   a lower plate comprising the lower end, and   a column-shaped part connecting the upper plate and the lower plate each other, and   wherein a width of the column-shaped part is constant.   
     
     
         6 . The wiring substrate device according to  claim 1 , further comprising:
 a component connected to the terminals via the solders.   
     
     
         7 . The wiring substrate device according to  claim 6 , wherein the component is a semiconductor device or a separate wiring substrate from the wiring substrate.