Inline dps chamber hardware design to enable axis symmetry for improved flow conductance and uniformity

Abstract

The present disclosure generally relates to apparatus and methods for symmetry in electrical field, gas flow and thermal distribution in a processing chamber to achieve process uniformity. Embodiment of the present disclosure includes a plasma processing chamber having a plasma source, a substrate support assembly and a vacuum pump aligned along the same central axis to create substantially symmetrical flow paths, electrical field, and thermal distribution in the plasma processing chamber resulting in improved process uniformity and reduced skew.

1 . A substrate support assembly, comprising:
 an electrostatic chuck having a top surface for supporting a substrate; and   a support block comprising:
 a disk for supporting the electrostatic chuck; and 
 a mounting block attached to the disk for mounting the disk and the electrostatic chuck to a sidewall in a cantilever manner. 
   
     
     
         2 . The substrate support assembly of  claim 1 , wherein the mounting block comprises:
 an outer portion for securing the mounting block to a chamber body;   an upper arm attached to the outer portion; and   a lower arm attached to the outer portion below the upper arm, wherein a gap is formed between the upper arm and the lower arm, and the disk is secured in the gap.   
     
     
         3 . The substrate support assembly of  claim 2 , further comprising:
 a facility plate stacked between the electrostatic chuck and the support block.   
     
     
         4 . The substrate support assembly of  claim 3 , wherein the mounting block includes one or more facility tunnels for providing one or more of electrical, gaseous and fluid communication to the electrostatic chuck. 
     
     
         5 . The substrate support assembly of  claim 3 , further comprising a facility duct attached to the mounting block. 
     
     
         6 . A method for processing a substrate, comprising:
 positioning the substrate on a substrate support assembly disposed in a processing volume of a processing chamber, wherein the processing volume is substantially symmetrical to a central axis, the substrate is positioned substantially symmetrical about the central axis, and the substrate support assembly is attached to a sidewall of the processing chamber in a cantilever manner; and   delivering one or more processing gases to the processing volume through a gas distribution assembly positioned substantially symmetrical to the central axis while vacuuming the processing volume through a gate valve coupled to an opening on the processing chamber, wherein the opening is substantially symmetrical about the central axis.   
     
     
         7 . The method of  claim 6 , further comprising generating a plasma in the processing volume using a plasma generator disposed substantially symmetrical to the central axis. 
     
     
         8 . The method of  claim 6 , further comprising:
 providing electrical, gaseous or fluid communication to the substrate support assembly through the sidewall of the processing chamber.   
     
     
         9 . A substrate support assembly, comprising:
 a support body having a top surface for supporting a substrate; and   a support block comprising:
 a disk for supporting the support body; and 
 a mounting block attached to the disk for mounting the disk and the support body to a sidewall in a cantilever manner. 
   
     
     
         10 . The substrate support assembly of  claim 9 , wherein the support body is formed from a dielectric material. 
     
     
         11 . The substrate support assembly of  claim 10 , wherein the support body comprises one or more electrodes embedded in the dielectric material for securing the substrate using electrostatic form. 
     
     
         12 . The substrate support assembly of  claim 10 , wherein the support body comprises a heater embedded in the dielectric material. 
     
     
         13 . The substrate support assembly of  claim 9 , further comprising:
 a facility plate stacked between the support body and the support block.   
     
     
         14 . The substrate support assembly of  claim 13 , wherein the facility plate includes features to provide at least one of electric connection, gas supply, and temperature control to the support body. 
     
     
         15 . The substrate support of  claim 9 , wherein the support block includes features to provide at least one of electric connection, gas supply, and temperature control to the support body. 
     
     
         16 . The substrate support assembly of  claim 9 , wherein the mounting block comprises:
 an outer portion for securing the mounting block to a chamber body.   
     
     
         17 . The substrate support assembly of  claim 16 , wherein the mounting block further comprises:
 an upper arm attached to the outer portion; and   a lower arm attached to the outer portion below the upper arm.   
     
     
         18 . The substrate support assembly of  claim 17 , wherein a gap is formed between the upper arm and the lower arm, and the disk is secured in the gap. 
     
     
         19 . The substrate support assembly of  claim 16 , wherein the mounting block includes one or more facility tunnels for providing one or more of electrical, gaseous and fluid communication to the support body. 
     
     
         20 . The substrate support assembly of  claim 16 , further comprising a facility duct attached to the mounting block.