Inventor · disambiguated record
Yogananda Sarode Vishwanath
Also filed as: SARODE VISHWANATH YOGANANDA
23 granted patents·11 pending applications·63 citations·filing 2014–2024
94Inventor score
Files withAPPLIED MATERIALS INC34
Top patents by PatentIndex Score
34 records- 0196US10600623B2Process kit with adjustable tuning ring for edge uniformity controlAPPLIED MATERIALS INC·Filed 2018·Granted Mar 24, 2020·13 cites·22 claims
- 0295US10790123B2Process kit with adjustable tuning ring for edge uniformity controlAPPLIED MATERIALS INC·Filed 2018·Granted Sep 29, 2020·11 cites·20 claims
- 0393US12002703B2Lift pin assemblyAPPLIED MATERIALS INC·Filed 2021·Granted Jun 4, 2024·2 cites·20 claims
- 0493US11393710B2Wafer edge ring lifting solutionAPPLIED MATERIALS INC·Filed 2017·Granted Jul 19, 2022·9 cites·15 claims
- 0592US11728143B2Process kit with adjustable tuning ring for edge uniformity controlAPPLIED MATERIALS INC·Filed 2020·Granted Aug 15, 2023·2 cites·20 claims
- 0692US11373893B2Cryogenic electrostatic chuckAPPLIED MATERIALS INC·Filed 2020·Granted Jun 28, 2022·3 cites·20 claims
- 0791US12094752B2Wafer edge ring lifting solutionAPPLIED MATERIALS INC·Filed 2022·Granted Sep 17, 2024·1 cites·10 claims
- 0891US11569114B2Semiconductor processing with cooled electrostatic chuckAPPLIED MATERIALS INC·Filed 2021·Granted Jan 31, 2023·2 cites·20 claims
- 0989US11004722B2Lift pin assemblyAPPLIED MATERIALS INC·Filed 2018·Granted May 11, 2021·4 cites·20 claims
- 1088US9761416B2Apparatus and methods for reducing particles in semiconductor process chambersAPPLIED MATERIALS INC·Filed 2014·Granted Sep 12, 2017·7 cites·2 claims
- 1185US12444644B2Lift pin assemblyAPPLIED MATERIALS INC·Filed 2024·Granted Oct 14, 2025·0 cites·17 claims
- 1285US10381200B2Plasma chamber with tandem processing regionsAPPLIED MATERIALS INC·Filed 2017·Granted Aug 13, 2019·3 cites·20 claims
- 1379US11075105B2In-situ apparatus for semiconductor process moduleAPPLIED MATERIALS INC·Filed 2018·Granted Jul 27, 2021·2 cites·16 claims
- 1478US10211033B2Inline DPS chamber hardware are design to enable axis symmetry for improved flow conductance and uniformityAPPLIED MATERIALS INC·Filed 2015·Granted Feb 19, 2019·2 cites·20 claims
- 1577US11201037B2Process kit with adjustable tuning ring for edge uniformity controlAPPLIED MATERIALS INC·Filed 2018·Granted Dec 14, 2021·1 cites·20 claims
- 1676US2025087524A1Process kit enclosure systemAPPLIED MATERIALS INC·Filed 2024·Application pending·0 cites
- 1776US2024429088A1Wafer edge ring lifting solutionAPPLIED MATERIALS INC·Filed 2024·Application pending·0 cites
- 1868US12459071B2Cooling base for a substrate supportAPPLIED MATERIALS INC·Filed 2024·Granted Nov 4, 2025·0 cites·20 claims
- 1968US10770269B2Apparatus and methods for reducing particles in semiconductor process chambersAPPLIED MATERIALS INC·Filed 2017·Granted Sep 8, 2020·0 cites·9 claims
- 2067US10446418B2Symmetric chamber body design architecture to address variable process volume with improved flow uniformity/gas conductanceAPPLIED MATERIALS INC·Filed 2015·Granted Oct 15, 2019·1 cites·20 claims
- 2164US11887879B2In-situ apparatus for semiconductor process moduleAPPLIED MATERIALS INC·Filed 2021·Granted Jan 30, 2024·0 cites·20 claims
- 2264US10847351B2Plasma chamber with tandem processing regionsAPPLIED MATERIALS INC·Filed 2019·Granted Nov 24, 2020·0 cites·20 claims
- 2363US2024351055A1Icp source gas delivery hub and nozzleAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 2462US10727096B2Symmetric chamber body design architecture to address variable process volume with improved flow uniformity/gas conductanceAPPLIED MATERIALS INC·Filed 2019·Granted Jul 28, 2020·0 cites·20 claims
- 2560US2024339301A1Ccp gas delivery nozzleAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 2660US2024339302A1Electrical break for substrate processing systemsAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 2759US2025299929A1Substrate support assembly having an edge voltage delivery systemAPPLIED MATERIALS INC·Filed 2024·Application pending·0 cites
- 2859US2019148121A1Inline dps chamber hardware design to enable axis symmetry for improved flow conductance and uniformityAPPLIED MATERIALS INC·Filed 2019·Application pending·0 cites
- 2958US2024420984A1Electrostatic substrate supportAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 3057US2024420932A1Substrate supportAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 3157US2024304486A1Differential substrate backside coolingAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 3256US12165905B2Process kit enclosure systemAPPLIED MATERIALS INC·Filed 2019·Granted Dec 10, 2024·0 cites·20 claims
- 3347US11437261B2Cryogenic electrostatic chuckAPPLIED MATERIALS INC·Filed 2018·Granted Sep 6, 2022·0 cites·20 claims
- 3443US2015097486A1Multizone hollow cathode discharge system with coaxial and azimuthal symmetry and with consistent central triggerAPPLIED MATERIALS INC·Filed 2014·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →