Circuit system having compact decoupling structure

Abstract

A circuit system having compact decoupling structure, including: a mother board; at least one circuit unit, each having a substrate, a logic-circuit die, a plurality of first metal contacts, and a plurality of second metal contacts, the substrate having a first surface and a second surface, the first metal contacts being formed on the first surface and soldered onto the mother board, the second metal contacts being formed on the logic-circuit die and soldered onto the second surface to form flip-chip pillars, and the flip-chip pillars determining a height of a gap between the die and the substrate; and at least one decoupling unit for providing an AC signals decoupling function for the at least one circuit unit; wherein each of the at least one decoupling unit is placed in the gap of one said circuit unit and includes a mother die and at least one stack-type integrated-passive-device die.

1 . A circuit system having compact decoupling structure, including:
 a mother board;   at least one circuit unit, each having a substrate, a logic-circuit die, a plurality of first metal contacts, and a plurality of second metal contacts, wherein the substrate has a first surface and a second surface opposing the first surface, the first metal contacts are formed on the first surface and soldered onto the mother board, the second metal contacts are formed on the logic-circuit die and soldered onto the second surface of the substrate to form flip-chip pillars, and the flip-chip pillars determine a height of a gap between the logic-circuit die and the substrate; and   at least one decoupling unit for providing an AC signals decoupling function for the at least one circuit unit;   wherein, each of the at least one decoupling unit is placed in the gap of one said circuit unit and includes a mother die, at least one stack-type integrated-passive-device die, and a plurality of third metal contacts, the third metal contacts being formed on the mother die and soldered onto the logic-circuit die, and the at least one stack-type integrated-passive-device die each having a plurality of fourth metal contacts formed thereon and soldered onto the mother die.   
     
     
         2 . The circuit system having compact decoupling structure as disclosed in  claim 1 , wherein the second metal contacts are controlled-collapse-chip-connection bumps. 
     
     
         3 . The circuit system having compact decoupling structure as disclosed in  claim 1 , wherein the third metal contacts are controlled-collapse-chip-connection bumps. 
     
     
         4 . The circuit system having compact decoupling structure as disclosed in  claim 1 , wherein the fourth metal contacts are Cu-pillar-with-solder-cap bumps. 
     
     
         5 . The circuit system having compact decoupling structure as disclosed in  claim 1 , wherein the at least one stack-type integrated-passive-device die includes at least one decoupling capacitor. 
     
     
         6 . The circuit system having compact decoupling structure as disclosed in  claim 5 , wherein the decoupling capacitor is a stack-type capacitor. 
     
     
         7 . The circuit system having compact decoupling structure as disclosed in  claim 1 , wherein the first metal contacts are BGA contacts. 
     
     
         8 . A circuit system having compact decoupling structure, including:
 a mother board;   at least one circuit unit, each having a substrate, at least one die, and a plurality of metal contacts, the substrate having a first surface and a second surface opposing the first surface, the at least one die being formed on the first surface, the metal contacts being formed on the second surface and soldered onto the mother board, and a gap being formed between the substrate and the mother board and having a height less than 50 micrometers; and   at least one decoupling unit, being placed in the gap and soldered onto the substrate for providing a decoupling function for the at least one circuit unit.   
     
     
         9 . The circuit system having compact decoupling structure as disclosed in  claim 8 , wherein the decoupling unit includes a discrete capacitor having a height less than 30 micrometers. 
     
     
         10 . The circuit system having compact decoupling structure as disclosed in  claim 9 , wherein the discrete capacitor is a stack-type capacitor. 
     
     
         11 . The circuit system having compact decoupling structure as disclosed in  claim 8 , wherein the metal contacts are BGA contacts. 
     
     
         12 . A circuit system having compact decoupling structure, including:
 a mother board;   at least one circuit unit, each having a substrate, at least one first die, at least one second die, and a plurality of metal contacts, the substrate having a first surface and a second surface opposing the first surface, a gap being formed between the substrate and the mother board and having a height less than 50 micrometers, the at least one first die being formed on the first surface, the at least one second die being embedded in an inner region of the substrate, the inner region having a height less than 50 micrometers, and the metal contacts being formed on the second surface and soldered onto the mother board; and   at least one decoupling unit, being placed in the inner region and connected electrically with the at least one second die in close proximity, or placed in the gap and soldered onto the substrate for providing an AC signals decoupling function for the at least one circuit unit.   
     
     
         13 . The circuit system having compact decoupling structure as disclosed in  claim 12 , wherein the decoupling unit includes a discrete capacitor having a height less than 30 micrometers. 
     
     
         14 . The circuit system having compact decoupling structure as disclosed in  claim 13 , wherein the discrete capacitor is a stack-type capacitor. 
     
     
         15 . The circuit system having compact decoupling structure as disclosed in  claim 12 , wherein the metal contacts are BGA contacts.