Inventor · disambiguated record
Masaru Haraguchi
Also filed as: HARAGUCHI MASARU
30 granted patents·6 pending applications·474 citations·filing 2000–2025
97Inventor score
Files withRENESAS TECH CORP11AP MEMORY TECH CORP7MITSUBISHI ELECTRIC CORP6ZENTEL JAPAN CORP4RENESAS ELECTRONICS CORP3
Top patents by PatentIndex Score
36 records- 0198US11417628B2Method for manufacturing semiconductor structureAP MEMORY TECH CORPORATION·Filed 2020·Granted Aug 16, 2022·11 cites·25 claims
- 0296US6285622B1Semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2000·Granted Sep 4, 2001·142 cites·14 claims
- 0395US11380614B2Circuit assemblyAP MEMORY TECH CORP·Filed 2020·Granted Jul 5, 2022·3 cites·15 claims
- 0493US7724606B2Interface circuitRENESAS TECH CORP·Filed 2007·Granted May 25, 2010·27 cites·9 claims
- 0591US7007215B2Test circuit capable of testing embedded memory with reliabilityRENESAS TECH CORP·Filed 2002·Granted Feb 28, 2006·46 cites·12 claims
- 0687US6650583B2Test circuit device capable of identifying error in stored data at memory cell level and semiconductor integrated circuit device including the sameMITSUBISHI ELECTRIC CORP·Filed 2002·Granted Nov 18, 2003·45 cites·14 claims
- 0785US6496429B2Semiconductor memory deviceMITSUBISHI ELECTRIC CORP·Filed 2001·Granted Dec 17, 2002·39 cites·12 claims
- 0884US6240045B1Synchronous semiconductor integrated circuit capable of improving immunity from malfunctionsMITSUBISHI ELECTRIC CORP·Filed 2000·Granted May 29, 2001·37 cites·10 claims
- 0980US6449198B1Semiconductor memory deviceMITSUBISHI ELECTRIC CORP·Filed 2000·Granted Sep 10, 2002·30 cites·6 claims
- 1079US10818337B2Semiconductor memory device for preventing occurrence of row hammer issueZENTEL JAPAN CORP·Filed 2017·Granted Oct 27, 2020·5 cites·39 claims
- 1178US2025299729A1Drive circuit with improved timing margin for memory deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1278US2024371747A1Circuit assemblyAP MEMORY TECH CORP·Filed 2024·Application pending·0 cites
- 1375US12074103B2Circuit assemblyAP MEMORY TECH CORP·Filed 2022·Granted Aug 27, 2024·0 cites·19 claims
- 1475US7433251B2Semiconductor memory device storing redundant replacement information with small occupation areaRENESAS TECH CORP·Filed 2007·Granted Oct 7, 2008·8 cites·3 claims
- 1575US7254069B2Semiconductor memory device storing redundant replacement information with small occupation areaRENESAS TECH CORP·Filed 2003·Granted Aug 7, 2007·19 cites·20 claims
- 1671US2025261386A1Capacitor device and manufacturing method thereforAP MEMORY TECH CORP·Filed 2025·Application pending·0 cites
- 1767US12340838B2Drive circuit with improved timing margin for memory deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jun 24, 2025·0 cites·20 claims
- 1866US11038012B2Capacitor device and manufacturing method thereforZENTEL JAPAN CORP·Filed 2017·Granted Jun 15, 2021·1 cites·18 claims
- 1966US7983112B2Semiconductor device which transmits or receives a signal to or from an external memory by a DDR systemRENESAS ELECTRONICS CORP·Filed 2008·Granted Jul 19, 2011·6 cites·6 claims
- 2066US7535251B2Semiconductor device and impedance adjusting method thereofRENESAS TECH CORP·Filed 2007·Granted May 19, 2009·5 cites·7 claims
- 2164US7064993B2Semiconductor memory device with common I/O type circuit configuration achieving write before sense operationRENESAS TECH CORP·Filed 2003·Granted Jun 20, 2006·14 cites·9 claims
- 2261US6643214B2Semiconductor memory device having write column select gateMITSUBISHI ELECTRIC CORP·Filed 2002·Granted Nov 4, 2003·12 cites·6 claims
- 2360US12317521B2Capacitor device and manufacturing method thereforAP MEMORY TECH CORP·Filed 2020·Granted May 27, 2025·0 cites·12 claims
- 2459US6930940B2Semiconductor memory device with read and/or write column select gateRENESAS TECH CORP·Filed 2003·Granted Aug 16, 2005·11 cites·4 claims
- 2555US10978413B2Circuit system having compact decoupling structureAP MEMORY TECH CORP·Filed 2019·Granted Apr 13, 2021·0 cites·6 claims
- 2650US9921638B2Data processing system with selective engagement of standby mode based on comparison with a break-even timeRENESAS ELECTRONICS CORP·Filed 2014·Granted Mar 20, 2018·0 cites·10 claims
- 2750US9360922B2Data processing system, microcontroller and semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2014·Granted Jun 7, 2016·0 cites·13 claims
- 2848US2019198460A1Circuit system having compact decoupling structureAP MEMORY TECH CORP·Filed 2017·Application pending·0 cites
- 2947US6704229B2Semiconductor test circuit for testing a semiconductor memory device having a write mask functionRENESAS TECH CORP·Filed 2002·Granted Mar 9, 2004·5 cites·10 claims
- 3045US6779139B2Circuit for reducing test time and semiconductor memory device including the circuitRENESAS TECH CORP·Filed 2001·Granted Aug 17, 2004·4 cites·25 claims
- 3144US6781903B2Semiconductor memory device with power consumption reduced in non-data-accessRENESAS TECH CORP·Filed 2003·Granted Aug 24, 2004·4 cites·9 claims
- 3243US10991418B2Semiconductor memory device comprising an interface conforming to JEDEC standard and control device thereforZENTEL JAPAN CORP·Filed 2017·Granted Apr 27, 2021·0 cites·33 claims
- 3342US2012113271A1Processor and image processing system using the sameHARAGUCHI MASARU·Filed 2011·Application pending·0 cites
- 3440US9558151B2Data processing device and data processing method thereofMURATA KAN·Filed 2012·Granted Jan 31, 2017·0 cites·7 claims
- 3540US2010257324A1Interface circuitRENESAS TECH CORP·Filed 2010·Application pending·0 cites
- 3634US11200945B2Semiconductor memory deviceZENTEL JAPAN CORP·Filed 2017·Granted Dec 14, 2021·0 cites·21 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →