US2019259898A1PendingUtilityA1
Hexagonal phase epitaxial cadmium sulfide on copper indium gallium selenide for a photovoltaic junction
Assignee: BEIJING APOLLO DING RONG SOLAR TECH CO LTDPriority: May 15, 2015Filed: Apr 30, 2019Published: Aug 22, 2019
Est. expiryMay 15, 2035(~8.8 yrs left)· nominal 20-yr term from priority
Inventors:Neil MackieGeordie ZapalacWeijie ZhangJohn CorsonXiaoqing HeAngus RockettJoel Basile VarleyVincenzo Lordi
H10P 14/3428H10P 14/3236H10P 14/22Y02E10/541Y02E10/543H01L 31/0296H01L 31/0749H01L 21/02485H01L 31/1828H01L 21/02631H01L 21/02557H01L 31/18H01L 31/036Y02P70/521H10F 77/123H10F 77/16H10F 71/125H10F 71/00H10F 10/167H10F 77/127Y02P70/50Y02E10/547
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Claims
Abstract
A method of manufacturing a photovoltaic structure includes forming a p-type semiconductor absorber layer containing a copper indium gallium selenide based material over a first electrode, forming a n-type cadmium sulfide layer over the p-type semiconductor absorber layer by sputtering in an ambient including hydrogen gas and oxygen gas, and forming a second electrode over the cadmium sulfide layer.
Claims
exact text as granted — not AI-modifiedWhat is claimed is:
1 . A method of manufacturing a photovoltaic structure, comprising:
forming a p-type semiconductor absorber layer comprising a copper indium gallium selenide based material over a first electrode; forming a n-type cadmium sulfide layer over the p-type semiconductor absorber layer by sputtering in an ambient including hydrogen gas and oxygen gas; and forming a second electrode over the cadmium sulfide layer.
2 . The method of claim 1 , wherein:
the ambient includes an inert sputtering gas; and a total pressure of the ambient is in a range from 5 mTorr to 10 mTorr.
3 . The method of claim 1 , wherein:
hydrogen gas is flowed into a sputtering chamber at a first flow rate; oxygen gas is flowed into the sputtering chamber at a second flow rate; and a difference between the first flow rate and the second flow rate is in a range from 30 sccm to 80 sccm.
4 . The method of claim 1 , wherein forming the n-type cadmium sulfide layer comprises forming a single crystal intrinsically doped or zinc doped cadmium sulfide layer having a predominant hexagonal crystal structure by sputtering in the ambient.
5 . The method of claim 1 , wherein forming the n-type cadmium sulfide layer comprises forming a single crystal copper cadmium sulfide layer having a predominant hexagonal crystal structure by sputtering in the ambient.
6 . The method of claim 5 , wherein the single crystal copper cadmium sulfide layer is composed predominantly of one or more hexagonal phase cadmium sulfide grains.
7 . The method of claim 1 , wherein forming the n-type cadmium sulfide layer comprises forming a first single crystal copper cadmium sulfide layer having a predominant hexagonal crystal structure by sputtering in the ambient and forming a second single crystal cadmium sulfide layer having a predominant hexagonal crystal structure over the first single crystal copper cadmium sulfide layer by sputtering in the ambient.
8 . The method of claim 1 , wherein forming the second electrode comprises forming a zinc containing oxide layer such that zinc diffuses into the n-type cadmium sulfide layer to form a zinc doped cadmium sulfide layer.
9 . The method of claim 8 , wherein oxygen and the zinc diffuse into the n-type cadmium sulfide layer to form a zinc and oxygen doped cadmium sulfide layer.
10 . The method of claim 1 , wherein the n-type cadmium sulfide layer is doped with one or more of copper, zinc, oxygen or hydrogen.
11 . The method of claim 1 , wherein the step of forming the n-type cadmium sulfide layer by sputtering comprises sputtering the n-type cadmium sulfide layer from a CdS target in the ambient.Join the waitlist — get patent alerts
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