Semiconductor package with chamfered corners and related methods

Abstract

Implementations of image sensors may include a die having either a rounded corner or a chamfered corner edge, and an optically transmissive cover coupled to the die. The optically transmissive cover may include either a rounded corner or a chamfered corner edge that corresponds with either the rounded corner or the chamfered corner edge of the die.

What is claimed is: 
     
         1 . An image sensor comprising:
 a die comprising a die sidewall and a rounded corner or a chamfered corner edge; and   an optically transmissive cover coupled to the die, the optically transmissive cover comprising an optically transmissive cover sidewall;   wherein a surface of the die sidewall and a surface of the optically transmissive cover sidewall are comprised within a same plane.   
     
     
         2 . The image sensor of  claim 1 , wherein the rounded corner or the chamfered corner edge of the die is convexly rounded. 
     
     
         3 . The image sensor of  claim 1 , wherein the rounded corner or the chamfered corner edge of the die is concavely rounded. 
     
     
         4 . The image sensor of  claim 1 , wherein the optically transmissive cover comprises glass. 
     
     
         5 . The image sensor of  claim 1 , wherein the rounded corner or the chamfered corner edge of the die are formed through etching. 
     
     
         6 . The image sensor of  claim 1 , wherein two or more optically transmissive cover sidewalls of the optically transmissive cover are aligned with two or more die sidewalls of the die. 
     
     
         7 . An image sensor comprising:
 a die comprising a rounded corner or a chamfered corner edge; and   an optically transmissive cover coupled to the die;   wherein the optically transmissive cover comprises a rounded corner or a chamfered corner edge; and   wherein a perimeter of the optically transmissive cover is the same size as a perimeter of the die.   
     
     
         8 . The image sensor of  claim 7 , wherein the rounded corner or the chamfered corner edge of the die is convexly rounded. 
     
     
         9 . The image sensor of  claim 7 , wherein the rounded corner or the chamfered corner edge of the die is concavely rounded. 
     
     
         10 . The image sensor of  claim 7 , wherein the optically transmissive cover comprises glass. 
     
     
         11 . The image sensor of  claim 7 , wherein the rounded corner or the chamfered corner edge of the die are formed through etching. 
     
     
         12 . The image sensor of  claim 7 , wherein a sidewall of the die comprises a surface comprised in the same plane as a surface of a sidewall of the optically transmissive cover. 
     
     
         13 . An image sensor comprising:
 a die comprising a die sidewall and a rounded corner or a chamfered corner edge; and   an optically transmissive cover coupled to the die, the optically transmissive cover comprising an optically transmissive cover sidewall;   wherein the optically transmissive cover comprises a rounded corner or a chamfered corner edge; and   wherein a surface of the die sidewall and a surface of the optically transmissive cover sidewall are comprised within a same plane.   
     
     
         14 . The image sensor of  claim 13 , wherein the rounded corner or the chamfered corner edge of the die is convexly rounded. 
     
     
         15 . The image sensor of  claim 13 , wherein the rounded corner or the chamfered corner edge of the die is concavely rounded. 
     
     
         16 . The image sensor of  claim 13 , wherein the optically transmissive cover comprises glass. 
     
     
         17 . The image sensor of  claim 13 , wherein the rounded corner or the chamfered corner edge of the die are formed through etching. 
     
     
         18 . The image sensor of  claim 13 , wherein the rounded corner or the chamfered corner edge of the optically transmissive cover lines up with the rounded corner or the chamfered corner edge of the die.