Inventor · disambiguated record
Oswald Skeete
Also filed as: SKEETE OSWALD · SKEETE OSWALD L · SKEETE Oswald Leroy
12 granted patents·8 pending applications·129 citations·filing 2003–2025
88Inventor score
Files withSEMICONDUCTOR COMPONENTS IND LLC11INTEL CORP4SKEETE Oswald Leroy2MELLODY JAMES P1SEMICONDUCTOR COMPONENTS IND1
Top patents by PatentIndex Score
20 records- 0195US9941245B2Integrated circuit packages including high density bump-less build up layers and a lesser density core or coreless substrateSKEETE OSWALD·Filed 2007·Granted Apr 10, 2018·80 cites·10 claims
- 0290US8035216B2Integrated circuit package and method of manufacturing sameINTEL CORP·Filed 2008·Granted Oct 11, 2011·25 cites·11 claims
- 0386US10290672B2Image sensor semiconductor packages and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2016·Granted May 14, 2019·5 cites·4 claims
- 0482US7304381B2Package and method for attaching an integrated heat spreaderINTEL CORP·Filed 2006·Granted Dec 4, 2007·12 cites·25 claims
- 0579US11462580B2Image sensor packages and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2019·Granted Oct 4, 2022·2 cites·16 claims
- 0677US9368535B2Imaging systems with flip chip ball grid arraysSEMICONDUCTOR COMPONENTS IND·Filed 2014·Granted Jun 14, 2016·3 cites·18 claims
- 0766US11079282B2Flexible interconnect sensing devices and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2018·Granted Aug 3, 2021·0 cites·8 claims
- 0866US2022415943A1Image sensor packages and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2022·Application pending·0 cites
- 0965US2021325252A1Flexible interconnect sensing devices and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2021·Application pending·0 cites
- 1063US10608042B2Semiconductor package with chamfered corners and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2019·Granted Mar 31, 2020·0 cites·17 claims
- 1161US2020185451A1Semiconductor package with chamfered corners and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2020·Application pending·0 cites
- 1260US7727805B2Reducing stress in a flip chip assemblyINTEL CORP·Filed 2007·Granted Jun 1, 2010·2 cites·14 claims
- 1359US10340306B1Semiconductor package with chamfered corners and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2018·Granted Jul 2, 2019·0 cites·15 claims
- 1456US11508776B2Image sensor semiconductor packages and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2019·Granted Nov 22, 2022·0 cites·20 claims
- 1549US2025262509A1System and Method for Timing Personal Physical ActivitySKEETE Oswald Leroy·Filed 2025·Application pending·0 cites
- 1645US2008156895A1Flux overspray reduction apparatus, systems, and methodsMELLODY JAMES P·Filed 2006·Application pending·0 cites
- 1741US12290739B2System and method for timing personal physical activitySKEETE Oswald Leroy·Filed 2021·Granted May 6, 2025·0 cites·7 claims
- 1836US2004238947A1Package and method for attaching an integrated heat spreaderINTEL CORP·Filed 2003·Application pending·0 cites
- 1935US2018226515A1Semiconductor device and method of forming embedded thermoelectric cooler for heat dissipation of image sensorSEMICONDUCTOR COMPONENTS IND LLC·Filed 2017·Application pending·0 cites
- 2033US2016282175A1Removable protective cap for an image sensorSEMICONDUCTOR COMPONENTS IND LLC·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →