Image sensor packages and related methods

Abstract

Implementations of image sensor packages may include a plurality of microlenses coupled over a color filter array (CFA), a low refractive index layer directly coupled to and over the plurality of microlenses, an adhesive directly coupled to and over the low refractive index layer, and an optically transmissive cover directly coupled to and over the adhesive. Implementations may include no gap present between the optically transmissive cover and the plurality of microlenses.

What is claimed is: 
     
         1 . A sensor package comprising:
 a substrate including a sensor die, the sensor die configured to receive an incoming optical signal;   one or more optically transmissive layers including an edge surface positioned at an edge of the sensor package; and   a light blocking layer that contacts a first optically transmissive layer of the one or more optically transmissive layers and follows along a perimeter of the first optically transmissive layer;   wherein the light blocking layer is positioned between the edge surface of the sensor package and a plurality of microlenses.   
     
     
         2 . The sensor package of  claim 1 , further comprising a mold compound that couples the one or more optically transmissive layers and the sensor die. 
     
     
         3 . The sensor package of  claim 1 , wherein the light blocking layer is coupled over a surface of the first optically transmissive layer. 
     
     
         4 . The sensor package of  claim 4 , wherein the surface of the first optically transmissive layer is the surface of the first optically transmissive layer most proximal to the substrate. 
     
     
         5 . The sensor package of  claim 4 , wherein the surface of the first optically transmissive layer is the surface of the first optically transmissive layer most distal to the substrate. 
     
     
         6 . The sensor package of  claim 1 , wherein the light blocking layer is embedded in the first optically transmissive layer. 
     
     
         7 . The sensor package of  claim 1 , further comprising a digital signal processor die coupled to the sensor die opposite the one or more optically transmissive layers. 
     
     
         8 . The sensor package of  claim 1 , wherein the one or more optically transmissive layers include a transparent or translucent layer. 
     
     
         9 . The sensor package of  claim 1 , wherein the one or more optically transmissive layers include a low refractive index layer. 
     
     
         10 . The sensor package of  claim 1 , wherein the light blocking layer extends to an outer edge of the sensor package. 
     
     
         11 . The sensor package of  claim 1 , further comprising:
 one or more metal structures on the substrate, wherein the light blocking layer is positioned between the one or more metal structures and the first optically transmissive layer.   
     
     
         12 . The sensor package of  claim 1 , wherein the first optically transmissive layer separates the light blocking layer from the plurality of microlenses. 
     
     
         13 . A method of manufacturing a sensor package comprising:
 bonding an image sensor wafer to a digital signal processor wafer;   coupling a light blocking layer along a perimeter of a surface of a first optically transmissive layer of one or more optically transmissive layers;   coupling the one or more optically transmissive layers over the image sensor wafer, wherein the surface of the first optically transmissive layer coupled to the light blocking layer is positioned closest to the image sensor wafer than other surfaces of the one or more optically transmissive layers;   singulating the image sensor wafer, the digital signal processor wafer, and the one or more optically transmissive layers to obtain an image sensor die, a digital signal processor die, and an optically transmissive cover, respectively; and   applying a mold compound to encapsulate one or more edges of the image sensor die, the digital signal processor die, and the optically transmissive cover.   
     
     
         14 . The method of  claim 13 , further comprising:
 forming a color filter array over the image sensor wafer; and   forming a plurality of microlenses over the color filter array.   
     
     
         15 . The method of  claim 13 , wherein the optically transmissive layers includes a transparent or translucent layer. 
     
     
         16 . The method of  claim 13 , wherein optically transmissive layers includes a low refractive index layer. 
     
     
         17 . The method of  claim 13 , wherein the coupling the light blocking layer further comprises:
 applying a mask layer on the first optically transmissive layer; and   patterning the mask layer.   
     
     
         18 . The method of  claim 13 , wherein coupling the light blocking layer to the first optically transmissive layer is done before coupling the first optically transmissive layer over the image sensor wafer. 
     
     
         19 . The method of  claim 13 , wherein coupling the light blocking layer to the first optically transmissive layer is done after coupling the first optically transmissive layer over the image sensor wafer.