Method for manufacturing light emitting unit

Abstract

A method for manufacturing a light emitting unit is provided. A semiconductor structure including a plurality of light emitting dice separated from each other is provided. A molding compound is formed to encapsulate the light emitting dice. Each of the light emitting dice includes a light emitting element, a first electrode and a second electrode. A patterned metal layer is formed on the first electrodes and the second electrodes of the light emitting dice. A substrate is provided, where the molding compound is located between the substrate and the light emitting elements of the light emitting dice. A cutting process is performed to cut the semiconductor structure, the patterned metal layer, the molding compound and the substrate so as to define a light emitting unit with a series connection loop, a parallel connection loop or a series-parallel connection loop.

What is claimed is: 
     
         1 . A method for manufacturing a light emitting unit, comprising:
 providing a semiconductor structure comprising a plurality of light emitting dices separated from each other, wherein each of the light emitting dices comprises a light emitting element, a first electrode and a second electrode, and the first electrode and the second electrode are disposed at a same side of the light emitting element, and the first electrode and the second electrode have a gap therebetween;   forming a molding compound to encapsulate the light emitting dices, wherein the molding compound encapsulates the light emitting element of each of the light emitting dices, and exposes the first electrode and the second electrode of each of the light emitting dices, and the molding compound is doped with a phosphor material;   forming a patterned metal layer on the first electrodes and the second electrodes of the light emitting dices, wherein the patterned metal layer directly contact the first electrodes and the second electrodes of the light emitting dices;   providing a substrate, wherein the molding compound is located between the substrate and the light emitting elements of the light emitting dices;   performing a cutting process to cut the molding compound and the substrate so as to define at least a light emitting unit having a series connection loop, a parallel connection loop or a series-parallel connection loop; and   providing an external circuit disposed at one side of the light emitting units adjacent to the patterned metal layer, the light emitting units being electrically connected to the external circuit via the patterned metal layer, wherein a gap is formed between the molding compound and the external circuit.