Electroless palladium plating solution, and electroless palladium plated coating

Abstract

An object of the present invention is to provide an electroless Pd plating solution which enables formation of a Pd plating film forming a plating film having excellent wire bondability even after a high-temperature thermal history. An electroless Pd plating solution of the present invention solved above problems, the solution includes a Palladium compound, at least one selected from a group consisting of a hypophosphorous acid compound and a phosphorous acid compound, at least one selected from the group consisting of an amine borane compound and a hydroboron compound, and a complexing agent.

1 . An electroless Pd plating solution comprising:
 a Palladium compound;   at least one selected from a group consisting of a hypophosphorous acid compound and a phosphorous acid compound;   at least one selected from the group consisting of an amine borane compound and a hydroboron compound; and   a complexing agent.   
     
     
         2 . The electroless Pd plating solution according to  claim 1  wherein,
 the amine borane compound is at least one selected from a group consisting of dimethylamine borane and trimethylamine borane; and 
 the hydroboron compound is borohydride salt 
 
     
     
         3 . The electroless Pd plating solution according to  claim 1  wherein,
 the complexing agent is at least one selected from a group consisting of ammonia and an amine compound. 
 
     
     
         4 . An electroless Pd plating film including phosphorus and boron. 
     
     
         5 . A laminated film comprising:
 the electroless Pd plating film according to  claim 4 ;   a gold plating film formed on a surface of the electroless Pd plating film.   
     
     
         6 . An electronic equipment component comprising:
 the electroless Pd plating film according to  claim 4 .   
     
     
         7 . The electroless Pd plating solution according to  claim 2  wherein,
 the complexing agent is at least one selected from a group consisting of ammonia and an amine compound. 
 
     
     
         8 . An electronic equipment component comprising:
 the laminated film according to  claim 5 .