Inventor · disambiguated record
Katsuhisa Tanabe
Also filed as: TANABE KATSUHISA
8 granted patents·10 pending applications·0 citations·filing 2007–2024
71Inventor score
Top patents by PatentIndex Score
18 records- 0165US2024360586A1Method and system for regenerating electrolytic copper plating solutionUEMURA KOGYO KK·Filed 2024·Application pending·0 cites
- 0265US2024200196A1Catalyst application bath for electroless plating, method of producing catalytic nucleus-containing material to be electroless plated, method of producing material with electroless plating deposit, and material with electroless plating depositUEMURA KOGYO KK·Filed 2023·Application pending·0 cites
- 0364US12454760B2Etchant and method of surface treatment of aluminum or aluminum alloyUEMURA KOGYO KK·Filed 2023·Granted Oct 28, 2025·0 cites·7 claims
- 0462US11946144B2Electroless palladium plating solutionUEMURA KOGYO KK·Filed 2018·Granted Apr 2, 2024·0 cites·5 claims
- 0561US11814717B2Palladium plating solution and plating methodUEMURA KOGYO KK·Filed 2021·Granted Nov 14, 2023·0 cites·7 claims
- 0657US2022396881A1Method for fabricating electronic componentUEMURA KOGYO KK·Filed 2022·Application pending·0 cites
- 0757US2023203665A1Regeneration method for gold plating solutionUEMURA KOGYO KK·Filed 2022·Application pending·0 cites
- 0856US10975475B2Electroless gold plating bathUEMURA KOGYO KK·Filed 2020·Granted Apr 13, 2021·0 cites·5 claims
- 0956US10822704B2Electroless platinum plating bathUEMURA KOGYO KK·Filed 2017·Granted Nov 3, 2020·0 cites·7 claims
- 1056US2022388279A1Multilayer plating filmUEMURA KOGYO KK·Filed 2022·Application pending·0 cites
- 1154US7985285B2Electroless gold plating bath, electroless gold plating method and electronic partsUYEMURA C & CO LTD·Filed 2007·Granted Jul 26, 2011·0 cites·11 claims
- 1251US2022033973A1Electroless palladium plating bathUEMURA KOGYO KK·Filed 2021·Application pending·0 cites
- 1349US11492706B2Electroless palladium plating solution and palladium filmUEMURA KOGYO KK·Filed 2019·Granted Nov 8, 2022·0 cites·3 claims
- 1449US2023151493A1Metal displacement solution, method for surface treatment of aluminum or aluminum alloyUEMURA KOGYO KK·Filed 2022·Application pending·0 cites
- 1546US2020340120A1Gold plating method and plating filmUEMURA KOGYO KK·Filed 2020·Application pending·0 cites
- 1646US2023111446A1Electroless gold plating bathUEMURA KOGYO KK·Filed 2022·Application pending·0 cites
- 1745US2020248312A1Electroless palladium plating solution, and electroless palladium plated coatingUEMURA KOGYO KK·Filed 2018·Application pending·0 cites
- 1839US10941493B2Film formation methodUEMURA KOGYO KK·Filed 2017·Granted Mar 9, 2021·0 cites·5 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →