Gold plating method and plating film

Abstract

The purpose of the present invention is to provide a gold plating method and a plating film for preventing a decrease of wire bonding characteristic by a thermal hysteresis by implementation and else. In addition, the purpose of the present invention is to provide a gold plating method and a plating film for preventing a decrease of wire bonding characteristic by a thermal hysteresis by implementation and else, even when a film thickness of a gold plating film is thin. A gold plating method for wire bonding connection by plating using a silver catalyst on a copper or copper alloy film, comprising: a silver catalyst forming step for forming a silver film as the silver catalyst for forming a palladium film; a palladium film forming step for forming the palladium film on the silver catalyst; a gold plating film forming step for forming a gold plating film on the palladium film, wherein a film thickness of the silver film is 0.05 μm to 0.5 μm.

1 . A gold plating method for wire bonding connection by plating using a silver catalyst on a copper or copper alloy film, comprising:
 a silver catalyst forming step for forming a silver film as the silver catalyst for forming a palladium film;   a palladium film forming step for forming the palladium film on the silver catalyst;   a gold plating film forming step for forming a gold plating film on the palladium film,   wherein a film thickness of the silver film is 0.05 μm to 0.5 μm.   
     
     
         2 . The gold plating method according to  claim 1 , wherein a particle size of the palladium film is 0.09 μm or more. 
     
     
         3 . The gold plating method according to  claim 1 , wherein a film thickness of the gold plating film is 0.2 μm or less. 
     
     
         4 . The gold plating method according to  claim 1 , wherein a film thickness of the palladium film is 0.04 μm to 0.6 μm. 
     
     
         5 . A plating film for wire bonding connection by plating using a silver catalyst on a copper or copper alloy film, comprising:
 the copper or copper alloy film;   a silver film as the silver catalyst formed on the copper or copper alloy film;   a palladium film formed on the silver catalyst; and   a gold film formed on the palladium film,   wherein a film thickness of the silver film is 0.05 μm to 0.5 μm.   
     
     
         6 . The plating film according to  claim 5 , wherein a particle size of the palladium film is 0.09 μm or more. 
     
     
         7 . The plating film according to  claim 5 , wherein a wire pull average strength after heat treatment is 10.0 g or more.