Heat dissipation device and board card

Abstract

The present disclosure provides a heat dissipation device and a board card. The heat dissipation device includes a fin group provided with a plurality of heat dissipation fins, and a heat pipe group provided with at least one heat pipe. The fin group is wholly located on one side of the heat pipe group in a first direction. The heat dissipation device and the board card have high heat dissipation efficiency.

1 . A heat dissipation device, comprising:
 a fin group including a plurality of heat dissipation fins that form a whole structure; and   a heat pipe group including at least one heat pipe,   wherein the fin group is wholly located on one side of the heat pipe group in a first direction, the fin group contacts the heat pipe group in the first direction, the heat dissipation fins include a first heat dissipation fin that contacts the heat pipe in a second direction so as to locate the heat pipe in the second direction.   
     
     
         2 . The heat dissipation device of  claim 1 , wherein the heat pipe group includes a plurality of heat pipes that are arranged parallelly in the second direction to form the heat pipe group. 
     
     
         3 . The heat dissipation device of  claim 1 , wherein the plurality of heat dissipation fins are arranged parallelly to form the fin group. 
     
     
         4 . The heat dissipation device of  claim 1 , wherein the first heat dissipation fin includes a first fin body and a first fin inner edgefold, wherein the first fin body contacts the heat pipe in the second direction, the first fin inner edgefold protrudes angularly from the first fin body, and the first fin inner edgefold contacts the heat pipe on one side of the heat pipe in the first direction. 
     
     
         5 . The heat dissipation device of  claim 4 , wherein the first fin inner edgefold is formed on part of the first heat dissipation fin in a length direction of the heat pipe. 
     
     
         6 . The heat dissipation device of  claim 4 , wherein the first fin inner edgefold contacts adjacent heat dissipation fins in the fin group. 
     
     
         7 . The heat dissipation device of  claim 4 , wherein the first heat dissipation fin further includes a first fin outer edgefold, wherein the first fin outer edgefold and the first fin inner edgefold are located at two ends of the first fin body in the first direction. 
     
     
         8 . The heat dissipation device of  claim 1 , wherein the heat dissipation fins further include a second heat dissipation fin, wherein the second heat dissipation fin and the first heat dissipation fin form a whole structure, and the second heat dissipation fin contacts the heat pipes on one side of the heat pipe in the first direction. 
     
     
         9 . The heat dissipation device of  claim 8 , wherein the second heat dissipation fin includes a second fin body and a second fin inner edgefold, wherein the second fin inner edgefold is bent from the second fin body and contacts the heat pipe in the first direction. 
     
     
         10 . (canceled) 
     
     
         11 . The heat dissipation device of  claim 9 , wherein the second fin inner edgefold contacts adjacent heat dissipation fins in the fin group. 
     
     
         12 . The heat dissipation device of  claim 9 , wherein the second heat dissipation fin further includes a second fin outer edgefold, the second fin outer edgefold and the second fin inner edgefold are located at two ends of the second fin body in the first direction. 
     
     
         13 . The heat dissipation device of  claim 1 , wherein the heat pipes is a flattening heat pipes, and the flattening direction of the flattening heat pipes is the first direction. 
     
     
         14 . The heat dissipation device of  claim 1 , wherein the heat dissipation device further includes a metal heat dissipation plate, wherein the metal heat dissipation plate is located on the other side of the heat pipe group in the first direction, and the metal heat dissipation plate contacts the heat pipes. 
     
     
         15 . The heat dissipation device of  claim 13 , wherein the heat dissipation fins, the heat pipe group and the metal heat dissipation plate are welded together by reflow soldering.