Pick and place machine cleaning system and method

Abstract

A device, mechanism, and methodology for regular and consistent cleaning of the vacuum aperture, nozzle, and contacting surfaces of a pick-and-place apparatus and the pick-up tools of automated or manual semiconductor device and die handling machines are disclosed. The cleaning material may include a cleaning pad layer with one or more intermediate layers that have predetermined characteristics, regular geometrical features, and/or an irregular surface morphology.

1 . A method for picking and placing semiconductor elements, the method comprising:
 performing a pick and place operation on a semiconductor device using a contact element of a pick and place apparatus;   cleaning the contact element of the pick and place apparatus while the contact element is attached to the pick and place apparatus, wherein cleaning the contact element further comprises inserting an end of the contact element into a cleaning material; and   performing the pick and place operation once the contact element is cleaned.   
     
     
         2 . The method of  claim 1 , wherein cleaning the contact element further comprises transferring a piece of debris from a surface of the contact element to the cleaning material. 
     
     
         3 . The method of  claim 2 , wherein transferring a piece of debris from a surface of the contact element further comprises attracting the piece of debris using a surface tackiness of a top surface of the cleaning material. 
     
     
         4 . The method of  claim 3 , wherein transferring a piece of debris from a surface of the contact element further comprises transferring a piece of debris from an inner surface of the contact element to the surface of the cleaning material. 
     
     
         5 . The method of  claim 1 , wherein performing the pick and place operation further comprises one of performing the pick and place operation for a packaged device being tested and performing the pick and place operation for a component used in a surface mount process. 
     
     
         6 . The method of  claim 1 , wherein performing the pick and place operation further comprises one of performing the pick and place operation for a die attach machine and performing the pick and place operation for a flip-chip bonder machine. 
     
     
         7 . The method of  claim 1 , wherein cleaning the contact element further comprises positioning the cleaning material adjacent to the pick and place apparatus. 
     
     
         8 . The method of  claim 1 , wherein cleaning the contact element further comprises cleaning one of a vacuum aperture, a nozzle, a suction cup, a suction inlet, a vacuum collet of the pick and place apparatus.