Leak checking method, leak checking apparatus, electroplating method, and electroplating apparatus

Abstract

There is disclosed an improved leak checking method which can accurately test a sealing performance of a substrate holder more than conventional leak check techniques. The leak checking method includes: holding a substrate with a substrate holder, the substrate holder including a first holding member and a second holding member, the second holding member having an opening through which a surface of the substrate is exposed; pressing a sealing projection of the second holding member against the surface of the substrate when holding the substrate with the substrate holder; covering the surface of the substrate, exposed through the opening, and the sealing projection with a sealing cap; forming a hermetic space between the sealing cap and the substrate holder; introducing a pressurized gas into the hermetic space; and detecting a decrease in pressure of the pressurized gas in the hermetic space.

What is claimed is: 
     
         1 . A leak checking apparatus for checking for leakage of a fluid through a sealing projection of a substrate holder when the sealing projection is being pressed against a surface of a substrate held by the substrate holder which includes a first holding member and a second holding member, the second holding member having the sealing projection and an opening through which a surface of the substrate is to be exposed, said apparatus comprising:
 a sealing cap having a shape that covers the opening and the sealing projection;   a pressurized-gas supply system configured to introduce a pressurized gas into a hermetic space formed between the sealing cap and the substrate holder; and   a pressure decrease detector configured to detect a decrease in pressure of the pressurized gas in the hermetic space.   
     
     
         2 . The leak checking apparatus according to  claim 1 , further comprising:
 a pressure regulator configured to regulate the pressure of the pressurized gas based on a pressure command value; and   an operation controller that stores a preset pressure range therein,   wherein the operation controller is configured to send the pressure command value, which has been selected from the pressure range, to the pressure regulator.   
     
     
         3 . The leak checking apparatus according to  claim 1 , wherein the first holding member having a first opening and a back-side sealing projection,
 the leak checking apparatus further comprises a back-side sealing cap having a shape that covers the first opening and the back-side sealing projection,   the pressurized-gas supply system is further configured to introduce the pressurized gas into a back-side hermetic space formed between the back-side sealing cap and the substrate holder, and   the pressure decrease detector is further configured to detect a decrease in pressure of the pressurized gas in the back-side hermetic space.   
     
     
         4 . An electroplating apparatus comprising:
 a substrate attachment and detachment section configured to set a substrate, to be plated, on a substrate holder;   a plating tank configured to hold a plating solution therein; and   the leak checking apparatus according to  claim 1 .   
     
     
         5 . The electroplating apparatus according to  claim 4 , wherein the leak checking apparatus is incorporated in the substrate attachment and detachment section.