US2021249254A1PendingUtilityA1

Oxide-nitride-oxide stack having multiple oxynitride layers

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Assignee: Longitude Flash Memory Solutions LtdPriority: May 25, 2007Filed: Jan 25, 2021Published: Aug 12, 2021
Est. expiryMay 25, 2027(~0.9 yrs left)· nominal 20-yr term from priority
H10P 14/69433H10P 14/69215H10P 14/6334H10P 14/6322H10P 14/6309H10P 14/662H10P 14/6682H10P 14/6328H10P 14/693H10P 14/6927H10D 30/601H10D 64/693H10D 64/037H10D 30/69C23C 16/308C23C 16/0272G11C 16/0466H01L 29/7833H01L 21/02255H01L 21/02238H01L 29/792H01L 21/02148H01L 21/022H01L 21/0214H01L 27/11568H01L 29/40117H01L 29/518H01L 21/02211H01L 21/02164H01L 21/02271H10B 43/30
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Abstract

A semiconductor device including an oxide-nitride-oxide (ONO) structure having a multi-layer charge storing layer and methods of forming the same are provided. Generally, the method involves: (i) forming a first oxide layer of the ONO structure; (ii) forming a multi-layer charge storing layer comprising nitride on a surface of the first oxide layer; and (iii) forming a second oxide layer of the ONO structure on a surface of the multi-layer charge storing layer. Preferably, the charge storing layer comprises at least two silicon oxynitride layers having differing stochiometric compositions of Oxygen, Nitrogen and/or Silicon. More preferably, the ONO structure is part of a silicon-oxide-nitride-oxide-silicon (SONOS) structure and the semiconductor device is a SONOS memory transistor. Other embodiments are also disclosed.

Claims

exact text as granted — not AI-modified
1 . A method comprising:
 depositing on a substrate a silicon-rich nitride; and   oxidizing the silicon-rich nitride to form a silicon-rich, oxygen-rich first oxynitride layer.

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